JPH0341274B2 - - Google Patents
Info
- Publication number
- JPH0341274B2 JPH0341274B2 JP11980882A JP11980882A JPH0341274B2 JP H0341274 B2 JPH0341274 B2 JP H0341274B2 JP 11980882 A JP11980882 A JP 11980882A JP 11980882 A JP11980882 A JP 11980882A JP H0341274 B2 JPH0341274 B2 JP H0341274B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- flux
- zinc chloride
- present
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 claims description 26
- 230000004907 flux Effects 0.000 claims description 23
- 235000005074 zinc chloride Nutrition 0.000 claims description 13
- 239000011592 zinc chloride Substances 0.000 claims description 13
- 239000002253 acid Substances 0.000 claims description 8
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 4
- QBYIENPQHBMVBV-HFEGYEGKSA-N (2R)-2-hydroxy-2-phenylacetic acid Chemical compound O[C@@H](C(O)=O)c1ccccc1.O[C@@H](C(O)=O)c1ccccc1 QBYIENPQHBMVBV-HFEGYEGKSA-N 0.000 claims description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 2
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 claims description 2
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 claims description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- IWYDHOAUDWTVEP-UHFFFAOYSA-N R-2-phenyl-2-hydroxyacetic acid Natural products OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 claims description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 2
- 235000015165 citric acid Nutrition 0.000 claims description 2
- 239000004310 lactic acid Substances 0.000 claims description 2
- 235000014655 lactic acid Nutrition 0.000 claims description 2
- 239000001630 malic acid Substances 0.000 claims description 2
- 235000011090 malic acid Nutrition 0.000 claims description 2
- 229960002510 mandelic acid Drugs 0.000 claims description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 2
- 229960004889 salicylic acid Drugs 0.000 claims description 2
- 239000011975 tartaric acid Substances 0.000 claims description 2
- 235000002906 tartaric acid Nutrition 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 9
- 239000011701 zinc Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3603—Halide salts
Description
【発明の詳細な説明】
本発明は各種はんだ付けのために用いるフラツ
クスに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a flux used for various types of soldering.
従来、たとえば半導体製品の製造過程において
は、リード部の予備はんだ付けあるいはプリント
基板への組立てのためのはんだ付け等が要求され
る。そのため、はんだ付けを良好に行うべく、リ
ード部をフラツクスで処理することが行われてい
る。 Conventionally, for example, in the manufacturing process of semiconductor products, preliminary soldering of lead portions or soldering for assembly to a printed circuit board is required. Therefore, in order to ensure good soldering, the lead portions are treated with flux.
このようなフラツクスとしては従来から様々な
材料が用いられているが、フラツクスははんだ付
け性が良いことは勿論、はんだ付け後の洗浄によ
る除去が容易なものでなければならない。 Various materials have been used for such fluxes, but the flux must not only have good solderability but also be easy to remove by cleaning after soldering.
従来からフラツクスとして用いられているもの
の中で、塩化亜鉛（ZnCl2）を含有するフラツク
スはその活性が非常に高く、はんだ付け性の悪い
素材にはんだ付けする場合に特に有効なフラツク
スとして知られている。 Among the fluxes traditionally used, fluxes containing zinc chloride (ZnCl 2 ) have extremely high activity and are known as particularly effective fluxes when soldering to materials with poor solderability. There is.
ところが、塩化亜鉛を含むフラツクスは、はん
だ付け後に水洗によつてフラツクス除去を行う場
合、塩化亜鉛中の亜鉛がZn（OH）Cl、Zn（OH）2
等の溶解度の小さい化合物を生成するので、洗浄
が困難である。このような化合物がリード部に残
留すると、リード部が腐食したり、あるいは電気
的な絶縁抵抗が低下する等の重大な欠点が生じる
ので、特に半導体製品のはんだ付けにおいては大
きい問題をひき起こすことになる。また、十分な
洗浄を行うためには、湯洗浄を行つたり、塩酸等
を含む酸性溶液で洗浄する必要があるので、コス
ト的に高価なものとなり、作業時間も長くなる等
の問題もあつた。 However, when the flux containing zinc chloride is removed by washing with water after soldering, the zinc in the zinc chloride becomes Zn(OH)Cl, Zn(OH) 2
It is difficult to clean because it produces compounds with low solubility such as. If such compounds remain on the leads, serious problems such as corrosion of the leads or reduction in electrical insulation resistance will occur, which can cause major problems, especially when soldering semiconductor products. become. In addition, in order to perform sufficient cleaning, it is necessary to wash with hot water or with an acidic solution containing hydrochloric acid, so there are problems such as high cost and long working hours. Ta.
本発明は前記従来技術の問題点を一挙に解決す
るためになされたもので、その目的は、塩化亜鉛
を含有することによるはんだ付け性の良さはその
まま活かしつつ、洗浄除去も容易なフラツクスを
提供することにある。 The present invention was made in order to solve the problems of the prior art described above all at once.The purpose of the present invention is to provide a flux that is easy to wash and remove while still maintaining the good solderability due to the zinc chloride content. It's about doing.
この目的を達成するため、本発明によるフラツ
クスは、塩化亜鉛を含有した上に、オキシカルボ
ン酸を添加するものである。 To achieve this objective, the flux according to the invention contains zinc chloride and also has oxycarboxylic acid added thereto.
以下、本発明を実施例にしたがつてさらに説明
する。 Hereinafter, the present invention will be further explained using examples.
本発明は塩化亜鉛を含むフラツクスにオキシカ
ルボン酸を添加するものであり、塩化亜鉛系フラ
ツクスの組成はたとえば水（H2O）を60％、塩
化亜鉛（ZnCl2）を30％、塩化アンモニウム
（NH4Cl）を10％、その他界面活性剤等を少量含
有してなるものである。 In the present invention, oxycarboxylic acid is added to a flux containing zinc chloride, and the composition of the zinc chloride-based flux is, for example, 60% water (H 2 O), 30% zinc chloride (ZnCl 2 ), and ammonium chloride ( It contains 10% NH 4 Cl) and a small amount of other surfactants.
本発明によれば、このような組成を持つ塩化亜
鉛系フラツクスに、オキシカルボン酸、たとえば
グリコール酸を添加するが、その添加量は塩化亜
鉛中の亜鉛（Zn）がキレートを生成するのに十
分な量であるのが好ましい。 According to the present invention, an oxycarboxylic acid, such as glycolic acid, is added to a zinc chloride flux having such a composition, but the amount added is sufficient for zinc (Zn) in zinc chloride to form a chelate. It is preferable that the amount is sufficient.
本発明において使用されるオキシカルボン酸と
しては、グリコール酸の他に、グリセリン酸、乳
酸、リンゴ酸、酒石酸、クエン酸、マンデル酸、
サリチル酸等が好適である。 In addition to glycolic acid, the oxycarboxylic acids used in the present invention include glyceric acid, lactic acid, malic acid, tartaric acid, citric acid, mandelic acid,
Salicylic acid and the like are preferred.
本発明により、塩化亜鉛系のフラツクスにオキ
シカルボン酸を所望量添加すると、はんだ付け後
のフラツクス洗浄時に塩化亜鉛がZn（OH）Cl、
Zn（OH）を生成しにくく、下記の如きキレート
を形成するので、フラツクスは洗浄水に溶解し易
く、水洗のみで十分清浄に洗浄でき、腐食や電気
的絶縁抵抗の低下を来たすことなく、洗浄時間も
従来の場合に比べて非常に短くて済む。 According to the present invention, when a desired amount of oxycarboxylic acid is added to zinc chloride-based flux, zinc chloride becomes Zn(OH)Cl,
Since flux is difficult to generate Zn(OH) and forms chelates as shown below, flux is easily dissolved in cleaning water and can be cleaned thoroughly with just water, without causing corrosion or reduction in electrical insulation resistance. The time required is also much shorter than in the conventional case.
また、本発明によりオキシカルボン酸を添加す
ることによつて、酸性の基剤としてフラツクスの
PHが下がり、Zn（OH）Cl、Zn（OH）2が生成しに
くいという利点が得られる。 In addition, by adding oxycarboxylic acid according to the present invention, flux can be used as an acidic base.
The advantage is that the pH is lowered and Zn(OH)Cl and Zn(OH) 2 are less likely to be produced.
なお、本発明のフラツクスは半導体製品のみな
らず、車輛用ラジエータ、あるいはステンレス製
品のようにはんだ付け性の良くないもの等にも広
く適用できる。特に、半導体製品のリードとして
一般的に使用されている鉄−ニツケル系合金（42
アロイ）は熱処理を経て表面が酸化されており、
はんだ付け性が悪くなつているが、本発明のフラ
ツクスはこのような場合にも極めて容易にはんだ
付けを行うことができる。 Incidentally, the flux of the present invention can be widely applied not only to semiconductor products but also to vehicle radiators and products with poor solderability such as stainless steel products. In particular, the iron-nickel alloy (42
Alloy) has undergone heat treatment and its surface has been oxidized.
Although the solderability has deteriorated, the flux of the present invention can be soldered extremely easily even in such cases.
以上説明したように、本発明によれば、はんだ
付け性が良好である上に、はんだ付け後には水洗
により容易に洗浄除去できるフラツクスが得ら
れ、フラツクスおよびその化合物の残留による腐
食や電気的絶縁抵抗の低下等を排除でき、また洗
浄作業の能率向上やコストの低減も可能である。 As explained above, according to the present invention, it is possible to obtain a flux that not only has good solderability but also can be easily removed by washing with water after soldering, thereby preventing corrosion caused by residual flux and its compounds and preventing electrical insulation. It is possible to eliminate a decrease in resistance, etc., and it is also possible to improve the efficiency of cleaning work and reduce costs.
Claims (1)
キシカルボン酸を添加することを特徴とするフラ
ツクス。 ２ 前記オキシカルボン酸は、グリコール酸、グ
リセリン酸、乳酸、リンゴ酸、酒石酸、クエン
酸、マンデル酸、サリチル酸のいずれかであるこ
とであることを特徴とする特許請求の範囲第１項
記載のフラツクス。[Scope of Claims] 1. A flux containing zinc chloride, characterized in that an oxycarboxylic acid is added thereto. 2. The flux according to claim 1, wherein the oxycarboxylic acid is any one of glycolic acid, glyceric acid, lactic acid, malic acid, tartaric acid, citric acid, mandelic acid, and salicylic acid. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11980882A JPS5910497A (en) | 1982-07-12 | 1982-07-12 | Flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11980882A JPS5910497A (en) | 1982-07-12 | 1982-07-12 | Flux |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5910497A JPS5910497A (en) | 1984-01-19 |
| JPH0341274B2 true JPH0341274B2 (en) | 1991-06-21 |
Family
ID=14770736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11980882A Granted JPS5910497A (en) | 1982-07-12 | 1982-07-12 | Flux |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5910497A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2627680C2 (en) | 1975-06-30 | 1986-02-06 | Sandoz-Patent-GmbH, 7850 Lörrach | Organic compounds, their manufacture and use |
| JPH0773795B2 (en) * | 1985-07-02 | 1995-08-09 | 太陽インキ製造株式会社 | Washable flux composition for soldering |
| US5136365A (en) * | 1990-09-27 | 1992-08-04 | Motorola, Inc. | Anisotropic conductive adhesive and encapsulant material |
| GB9114947D0 (en) * | 1991-07-11 | 1991-08-28 | Pfizer Ltd | Process for preparing sertraline |
-
1982
- 1982-07-12 JP JP11980882A patent/JPS5910497A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5910497A (en) | 1984-01-19 |
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