JPH11286798A - Sealing agent - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sealing agent by which solderability and further corrosion resistance can be improved. SOLUTION: At least one kind among neopentyl ester of a fatty acid, a dibasic acid and amine salt of a dibasic acid or the one and at least one kind between 5-aminotetrazole and 5-methylbenzotriazole are dissolved in at least one kind of solvent among alcoholic, chloric and fluoric solvents to prepare the sealing agent.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a treatment agent for improving soldering performance when soldering on metal plating and improving the corrosion resistance of precious metal plated contacts.

[0002]

2. Description of the Related Art IC lead frames, relay terminals,
When soldering to the surface of a metal material such as a printed wiring board, plating is performed on the surface of the metal material and then soldering is performed on this plating to ensure solder adhesion. I have. As this plating, solder plating (Sn-Pb) is the most common in the soldering portion, but Au plating, Pd plating, or Pb-free Sn-Pb is used.
Alloy plating of Zn, Sn-Bi, Sn-Ag or the like is also performed.

[0003] In addition, Au flash plating, Sn-Pb plating and the like are performed on the contact portions after Au plating and Pd plating are performed.

[0004]

In soldering a metal material, even if the metal material is plated in advance as described above, the wettability to the solder is insufficient, and sufficient solderability is obtained. It is difficult. For this reason, it was necessary to use a flux when performing soldering.

Further, there is a problem that it is difficult to obtain corrosion resistance at a contact portion such as a connector. The present invention has been made in view of the above points, and has as its object to provide a sealing agent capable of improving solderability and improving corrosion resistance.

[0006]

The pore-treating agent according to claim 1 of the present invention comprises at least one of neopentyl fatty acid ester, dibasic acid and amine salt of dibasic acid, which is an alcohol-based, chlorine-based, It is characterized by being dissolved in at least one type of fluorine-based solvent.

The pore-sealing agent according to claim 2 of the present invention comprises at least one of neopentyl fatty acid ester, dibasic acid, and amine salt of dibasic acid and 5-aminotetrazole and 5-methylbenzotriazole. It is characterized in that at least one kind is dissolved in at least one kind of solvent among alcohol type, chlorine type and fluorine type.

The invention of claim 3 is characterized in that neopentyl fatty acid ester is 0.02-1.0% (w / v), dibasic acid is 0.01-0.5% (w / v), dibasic acid Amine salt of 0.01-0.1% (w / v), 5-aminotetrazole 0.001-0.05% (w / v), 5-methylbenzotriazole 0.001-0.05 % (W /
It is characterized by being dissolved in a solvent at the concentration of v).

The invention according to claim 4 is characterized in that the solvent contains at least ethanol.

[0010]

Embodiments of the present invention will be described below. In the present invention, the neopentyl fatty acid ester is not particularly limited, but trimethylolpropane fatty acid ester represented by the following chemical structural formula can be used.

[0011]

Embedded image

In the present invention, the dibasic acid is not particularly limited, but 1,16-hexadecanedicarboxylic acid can be used.
The amine salt of the dibasic acid is not particularly limited, but a reaction product of 1,16-hexadecanedicarboxylic acid and monoisopropanolamine can be used. In addition, instead of these dibasic acids and amine salts of dibasic acids, aliphatic carboxylic acids having 2 or more carbon atoms can be used.

The pore-treating agent can be prepared by dissolving at least one of the above-mentioned neopentyl fatty acid esters, dibasic acids, and dibasic acid amine salts in a solvent. For example, a combination of neopentyl fatty acid ester and dibasic acid, a combination of neopentyl fatty acid ester and amine salt of dibasic acid, and a combination of neopentyl fatty acid ester, dibasic acid and amine salt of dibasic acid are dissolved in a solvent and sealed. An agent can be prepared.

Further, in addition to one or more selected from neopentyl fatty acid ester, dibasic acid and amine salt of dibasic acid, one or both of 5-aminotetrazole and 5-methylbenzotriazole are dissolved in a solvent. By doing so, the pore-treating agent can be prepared (claim 2). As the solvent, one or more kinds of alcohol-based solvents, chlorine-based solvents, and fluorine-based solvents can be selected and used. For example, an alcohol-based solvent, a chlorine-based solvent, and a fluorine-based solvent can be used:
They can be mixed and used at a volume ratio of 10:10.
Here, as the alcohol solvent, ethyl alcohol,
Methyl alcohol, isopropyl alcohol, etc .; 1,1,1-trichloroethane, methylene chloride, etc. as chlorine solvents;
1, 3, Freon 225 and the like can be used, but the solvent may be 100% ethanol.

The amount of each component described above in the solvent is as follows:
0.02-1.0% neopentyl fatty acid ester
(W / v) [neopentyl fatty acid ester 0.2 to 10 g per liter of solvent], dibasic acid 0.01 to 0.01
0.5% (w / v) [0.1-5 g of dibasic acid per liter of solvent], and 0.01-0.5 g of amine salt of dibasic acid.
1% (w / v) [0.1-1 g of dibasic acid amine salt per liter of solvent], 5-aminotetrazole is 0.1% (w / v).
001 to 0.05% (w / v) [0.01 to 0.5 g of 5-aminotetrazole per liter of solvent], 5-
Methyl benzotriazole 0.001-0.05%
(W / v) [0.01 to 0.5 g of 5-methylbenzotriazole per liter of solvent] is preferably set.

The sealing agent can be prepared as described above. The surface of a metal material such as an IC lead frame, a relay terminal, a socket contact, a printed wiring board or the like is solder-plated or Au-plated. , Pd plating,
Immediately after metal plating, such as alloy plating of Sn-Zn, Sn-Bi, Sn-Ag, Sn-In, or the like, the surface of the metal plating can be treated by immersion in this sealing agent. it can.

By treating the surface of the metal plating with the sealing agent as described above, the wettability of the solder can be improved and the solder adhesion can be enhanced. Can be made unnecessary. In addition to such effects, the sealing agent of the present invention has an effect of preventing oxidation of metal plating, and can also improve slidability, particularly when the metal material is easily scraped. It is valid. Further, it is possible to prevent the contact resistance from deteriorating with time, and to improve the heat resistance. In addition, there is an effect of improving the corrosion resistance.

[0018]

Next, the present invention will be described specifically with reference to examples. By using a mixed solvent of ethanol and 1,1,1-trichloroethane in a volume ratio of 2: 8 as a solvent and mixing and dissolving the respective components in the following amounts in 1 liter of the solvent, the sealing agent is Prepared. -Neopentyl fatty acid ester ... 3.0 g / liter-Dibasic acid (1,16-hexadecanedicarboxylic acid) ... 1.5 g / liter-Amine salt of dibasic acid (reaction between 1,16-hexadecanedicarboxylic acid and monoisopropanolamine) 0.5 g / liter 5-aminotetrazole 0.1 g / liter 5-methylbenzotriazole 0.2 g / liter On the other hand, as shown in FIG. 1, a test piece for evaluating solderability was used. The contact 1 of a simple socket was used.

(Test 1) After applying a solder plating (Sn: Pb = 9: 1) with a thickness of 3 μm to the contact 1, the contact 1 is immersed in the above-mentioned sealing agent for 1 second, and the contact is shaded by cross lines in FIG. The indicated part was treated with a sealing agent. Then, a solderability test was performed on the contact 1 without performing the treatment with the flux. The solderability test was performed using a zero cross time when the contact 1 was immersed in a solder bath (time from immersion to wet of the immersed part: solder wetting time).
Was measured.

As a result, the solder wetting time was 0.2 seconds or less. For comparison, without soldering treatment, the same solderability test was performed without flux treatment.
The solder wetting time was 5 seconds or longer, and it was confirmed that the treatment with the sealing agent increased the solder wettability and improved the solderability. (Test 2) The contact 1 was plated with 2 μm thick Ni, and further plated thereon with 0.05 μm thick Au, and then immersed in the above sealing agent for 1 second. 1 was treated with a sealing agent.

After heating at 100 ° C. for 1 hour,
This contact 1 was subjected to a solderability test without treatment with a flux. The result was a solder wetting time of 3 seconds. For comparison, a similar solderability test was conducted without a treatment with a sealing agent and without a flux treatment. As a result, the solder wetting time was 5 seconds or more. A solderability test was also performed on a flux treated by immersing the contact 1 in the flux using "NA-200" manufactured by Tamura Kaken Co., Ltd. as a flux. Seconds. For comparison, the same solderability test was conducted by performing flux treatment without treating with a sealing agent, and it was found that the solder wetting time was 5 seconds or more.

As described above, it has been confirmed that high solderability can be obtained without the need for flux treatment by treating with a sealing agent. (Test 3) After the contact 1 was subjected to Sn-Zn plating (Sn: Zn = 7: 3) with a thickness of 3 μm, the contact 1 was immersed in the above-mentioned sealing agent for 1 second to obtain FIG.
Was treated with a pore-sealing agent.

After heating at 100 ° C. for 1 hour,
This contact 1 was subjected to a solderability test without treatment with a flux. The result was a solder wetting time of 1 second. For comparison, a similar solderability test was conducted without a treatment with a sealing agent and without a flux treatment. As a result, the solder wetting time was 5 seconds or more. Contact 1
When the soldering property test was performed in the same manner also for the one subjected to the flux treatment, the solder wetting time was 0.5 seconds. For comparison, the same solderability test was conducted by performing flux treatment without treating with a sealing agent, and it was found that the solder wetting time was 5 seconds or more.

Thus, it was confirmed that high solderability can be obtained without the need for flux treatment by treating with a sealing agent. (Test 4) After Au plating was applied to the contacts of the connector, the contacts of the connector were treated with the sealing agent by immersing the connector in the sealing agent for 1 second. Even when this was left in an atmosphere of 10 ppm SO ₂ gas, 95% relative humidity and 40 ° C., no corrosion occurred.

[0025]

As described above, the present invention provides at least one of neopentyl fatty acid ester, dibasic acid, and amine salt of dibasic acid, or at least one of 5-aminotetrazole and 5-methylbenzotriazole. The sealing agent was prepared by dissolving the type in at least one of alcohol, chlorine, and fluorine solvents, improving the solder wettability of the metal plating surface and improving the solderability. This makes it possible to perform soldering without the need for flux treatment. Further, it is possible to improve the corrosion resistance of a metal plating portion such as Au plating.

[Brief description of the drawings]

FIGS. 1A and 1B show a socket contact used in a soldering test, wherein FIG. 1A is a partial front view and FIG. 1B is a partial side view.

[Explanation of symbols]

 1 Socket contacts

Claims (4)

[Claims] 1. A method comprising dissolving at least one kind of neopentyl fatty acid ester, dibasic acid and amine salt of dibasic acid in at least one kind of alcohol, chlorine and fluorine solvents. Sealant. 2. At least one of neopentyl fatty acid ester, dibasic acid, amine salt of dibasic acid, and
5-aminotetrazole, at least one of 5-methylbenzotriazole, alcohol-based, chlorine-based,
A pore-sealing agent characterized by being dissolved in at least one fluorine-based solvent. 3. The amount of neopentyl fatty acid ester is 0.02.
1.0% (w / v), 0.01 to 0.5% dibasic acid
(W / v), 0.01 to 0.1% of amine salt of dibasic acid
(W / v), 0.001 to 5-aminotetrazole
3. The method according to claim 1, wherein 0.05% (w / v) and 5-methylbenzotriazole are dissolved in the solvent at a concentration of 0.001 to 0.05% (w / v). Sealing agent. 4. The pore-sealing agent according to claim 1, wherein the solvent contains at least ethanol.