JPH0340442A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPH0340442A JPH0340442A JP1175943A JP17594389A JPH0340442A JP H0340442 A JPH0340442 A JP H0340442A JP 1175943 A JP1175943 A JP 1175943A JP 17594389 A JP17594389 A JP 17594389A JP H0340442 A JPH0340442 A JP H0340442A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- conductive substrate
- mold
- substrate
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000011347 resin Substances 0.000 claims abstract description 40
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000011810 insulating material Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 239000000725 suspension Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract 4
- 238000009413 insulation Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000005266 casting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010125 resin casting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、導電性基板上に半導体素体を固着し、基板に
連結される外部端子および半導体素体の電極と導線で接
続される外部端子のみを露出させ、半導体素体および導
電性基板を樹脂で完全に被覆する半導体装置の製造方法
に関する。Detailed Description of the Invention [Industrial Application Field] The present invention is directed to fixing a semiconductor element on a conductive substrate, and connecting external terminals connected to the substrate and external terminals connected to electrodes of the semiconductor element with conductive wires. The present invention relates to a method of manufacturing a semiconductor device in which only the terminals are exposed and the semiconductor element and conductive substrate are completely covered with resin.
（従来の技術〕
導電性基板およびその上に固着した半導体素体を完全に
覆うように樹脂を注型するためには、基板を金型内で金
型面から離して支持しなければならない、しかし、半導
体素体に発生する熱の放熱のため基板の反半導体素体側
には０．５ｎ程度の薄い樹脂層が形成されなげられなら
ないので、基板を金型面かられずかだけ浮かして金型内
に支持する必要がある。そのために、従来は一方に外部
端子が連結される導電性基板を他方にも延長して吊り部
を形成し、基板およびその上の半導体素体を金型内に外
部端子と吊り部で支える方法、あるいは基板を金型内に
半導体素体と反対側で可動ビンで支えておき、樹脂のゲ
ル化が進む過程で可動ビンを引き抜いて基板から離し、
そのために生じた空洞にさらに樹脂を圧入する方法がと
られている。(Prior Art) In order to cast resin so as to completely cover a conductive substrate and a semiconductor element fixed thereon, the substrate must be supported within a mold away from the mold surface. However, in order to dissipate the heat generated in the semiconductor element, a thin resin layer of about 0.5 nm must be formed on the side of the substrate opposite to the semiconductor element, so the substrate is slightly lifted from the mold surface. To do this, conventionally, the conductive substrate to which external terminals are connected on one side is extended to the other side to form a hanging section, and the substrate and the semiconductor element thereon are placed inside the mold. You can either support the board with external terminals and a hanging part, or you can support the board with a movable bottle inside the mold on the side opposite to the semiconductor element, and as the gelation of the resin progresses, you can pull out the movable bottle and separate it from the board.
For this reason, a method is used in which resin is further press-fitted into the cavity created.
導電性基板に吊り部を形成して金型内で支持した場合、
樹脂注型後、吊り部が樹脂面に露出する。When a hanging part is formed on a conductive substrate and supported in a mold,
After resin casting, the hanging part is exposed on the resin surface.
このような半導体装置を金属支持板上に装着すると、吊
り部の露出部と支持板間に電圧がかかり、その間の距離
が短いため沿面耐圧ガ不十分で、絶縁が確保されないこ
とが生ずる。そこで、吊り部の露出部に後工程で樹脂を
盛る作業が必要となる。When such a semiconductor device is mounted on a metal support plate, a voltage is applied between the exposed portion of the hanging portion and the support plate, and since the distance therebetween is short, the creepage withstand voltage is insufficient and insulation cannot be ensured. Therefore, it is necessary to apply resin to the exposed part of the hanging part in a later process.
また、可動ビン方式の場合、基板の可動ビンが存在する
側の樹脂厚を確保するには、金型内のすべてのキャビテ
ィに数秒レベルの時間差内で樹脂を注入する必要があり
、しかも樹脂カント毎にゲル化時間のばらつきなどの問
題があって可動ピン引き抜きのタイミングの判定がむつ
かしく、樹脂厚の確保と可動ビン部でのピンホールの発
生の防止の２点を確実にすることが困難である。In addition, in the case of the movable bottle method, in order to ensure the resin thickness on the side of the board where the movable bottle is located, it is necessary to inject resin into all cavities in the mold within a time difference of several seconds, and the resin cant be injected into all cavities within a few seconds. There are problems such as variations in the gelation time for each product, making it difficult to judge the timing to pull out the movable pin, and it is difficult to ensure the two points of ensuring resin thickness and preventing pinholes from forming in the movable bottle part. be.
本発明の目的は、上記の問題を解決し、外部端子以外に
導電部が樹脂から露出せず、樹脂を盛らないでも基板の
絶縁性がよく、基板の半導体素体と反対側の樹脂厚が均
一な半導体装置を製造する方法を提供することにある。An object of the present invention is to solve the above-mentioned problems, so that conductive parts other than external terminals are not exposed from the resin, the insulation of the board is good even without filling the resin, and the thickness of the resin on the side opposite to the semiconductor element of the board is small. An object of the present invention is to provide a method for manufacturing a uniform semiconductor device.
上記の目的を達成するために、本発明は導電性基板上に
半導体素体を固着し、その導電性基板に連結される外部
端子および前記半導体素体の電極と導線で接続される外
部端子のみを露出させ、半導体素体および導電性基板を
樹脂で完全に被覆する半導体装置の製造方法において、
導電性基板の外部端子と反対側に絶縁材からなる吊り部
を結合し、半導体素体が固着された導電性基板を前記吊
り部および外部端子とによって金型内に金型面から離し
て支持した状態で樹脂を金型キャビティ内に注入するも
のとする。In order to achieve the above object, the present invention fixes a semiconductor element on a conductive substrate, and only external terminals connected to the conductive substrate and external terminals connected to electrodes of the semiconductor element by conductive wires are provided. In a method for manufacturing a semiconductor device in which a semiconductor body and a conductive substrate are completely covered with resin,
A hanging part made of an insulating material is connected to the side opposite to the external terminal of the conductive substrate, and the conductive substrate to which the semiconductor element is fixed is supported in the mold by the hanging part and the external terminal at a distance from the mold surface. In this state, resin is injected into the mold cavity.
基板は連結された樹脂からなる吊り部および反対側の外
部端子により金型内に浮かして支持することができるた
め、基板の半導体素体と反対側の樹脂厚を均一な所定の
厚さにすることができる。The board can be floated and supported within the mold by the connected resin suspension parts and the external terminals on the opposite side, so the resin thickness on the side opposite to the semiconductor element of the board can be made uniform to a predetermined thickness. be able to.
また注型樹脂面の一部に吊り部が露出して残るが、吊り
部が絶縁材であるため、導電性基板と半導体素体封止樹
脂体の取付は面との間の絶縁が確保できる。In addition, the hanging part remains exposed on a part of the casting resin surface, but since the hanging part is an insulating material, insulation between the surface and the conductive substrate can be ensured when attaching the semiconductor element encapsulating resin body. .
（実施例） 以下、図を引用して本発明の実施例について説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
第２図（ａｌ、（ｂｌは樹ｌ１ｉｒＩ１．形する前の半
導体装置を示し、半導体チップ（半導体素体）１は金属
からなるリードフレームのマウント部（導電性基Ｆｉ）
２の上に固着されている。マウント部２には第一の
リード端子３１が連結されており、さらにそのリード端
子３１に連結部４を介して第二のリード端子３２および
第三のリード端子３３が連結されている。半導体テンプ
１の上面の電極はリード端子３２、３３の内側端部にあ
るワイヤボンディング部５と導線６によって接続されて
いる。マウント部２の端子と反対側に絶縁材、例えば樹
脂からなる吊り部７が取り付けられている。Figure 2 (al, (bl) shows the semiconductor device before being formed. The semiconductor chip (semiconductor element) 1 is the mount part (conductive group Fi) of the lead frame made of metal.
It is fixed on top of 2. A first lead terminal 31 is connected to the mount portion 2, and a second lead terminal 32 and a third lead terminal 33 are further connected to the lead terminal 31 via the connecting portion 4. The electrode on the upper surface of the semiconductor balance 1 is connected to the wire bonding portion 5 at the inner end of the lead terminals 32 and 33 by a conductive wire 6. A hanging portion 7 made of an insulating material, such as resin, is attached to the side of the mount portion 2 opposite to the terminals.
第１図はこの半導体装置の樹脂形成時の状態を示す、リ
ードフレームのマウント部２はそれに固着される半導体
チップ１と共に金型の上型１１．下型１２によって形成
されるキャビティ１３の中に収容されるが、吊り部７お
よびリード端子３１．３２．３３は、上型１１．下型１
２の間にクランプされる。これによりマウント部２の下
面と下型１２との間には０．５鶴程度の所定の間隔ｄが
保たれる。なお、吊り部７のクランプのために上型１１
および下型１２にはそれぞれ突出部１４が形成されてい
る。FIG. 1 shows the state of this semiconductor device at the time of resin formation, in which the mount portion 2 of the lead frame is attached to the upper die 11 of the mold together with the semiconductor chip 1 fixed thereto. The hanging portion 7 and the lead terminals 31, 32, 33 are housed in the cavity 13 formed by the lower mold 12, while the upper mold 11. Lower mold 1
It is clamped between 2. As a result, a predetermined distance d of approximately 0.5 mm is maintained between the lower surface of the mount portion 2 and the lower mold 12. Note that the upper die 11 is used for clamping the hanging part 7.
A protrusion 14 is formed on each of the lower mold 12 and the lower mold 12 .
第３図ｆａ）、（ｂ）は樹ｎ成形後金型より取り出し、
リードフレームの連結部４を除去して造り上げられた半
導体装置を示し、マウント部２は樹脂体８によって完全
に包囲され、一方にリード端子３１゜３２．３３が露出
して外部端子となっている。樹脂体８の他方には、側面
図の図偽）かられかるように金型の突出部１４による溝
９ガ形戒されており、その溝の中に吊り部７が突出して
いる。吊り部７は絶縁材料からなるので樹脂体８の外面
は外部端子３２を除いてマウント部２と絶縁されている
。Figure 3 fa) and (b) are taken out from the mold after molding the tree.
This shows a semiconductor device manufactured by removing the connection part 4 of the lead frame, in which the mount part 2 is completely surrounded by the resin body 8, and lead terminals 31, 32, and 33 are exposed on one side and serve as external terminals. . On the other side of the resin body 8, as can be seen from the side view (not shown), a groove 9 is formed by a protrusion 14 of the mold, and a hanging portion 7 protrudes into the groove. Since the hanging part 7 is made of an insulating material, the outer surface of the resin body 8 is insulated from the mount part 2 except for the external terminal 32.
本発明によれば、半導体素体が固着される導電性基板の
外部端子が連結されている側と反対側に絶縁材からなる
吊り部を結合して導電性基板を外部端子と吊り部の両者
によって金型内に支持することにより、基板を金型のキ
ャビティ内の所定の位置に保持して半導体素体を注型樹
脂で包囲することができる、その結果、基板を屓ろ樹脂
体の淳さを均一にすることができる。そして、成形され
た樹脂面には、外部端子を除き金属部が露出せず、従っ
て樹脂を盛る作業°が不要であり、また、可動ビンを用
いないため樹脂体にピンホールが生ずることがないので
この半導体装置の支持体と導電性基板との間の絶縁がそ
のまま確保できる。According to the present invention, a hanging part made of an insulating material is connected to the side opposite to the side to which the external terminal is connected of the conductive substrate to which the semiconductor element is fixed, so that the conductive substrate can be connected to both the external terminal and the hanging part. By supporting the substrate in the mold by supporting it in the mold cavity, the semiconductor body can be surrounded by the casting resin by holding the substrate in a predetermined position in the cavity of the mold. can be made uniform. In addition, no metal parts are exposed on the molded resin surface except for external terminals, so there is no need to apply resin, and since no movable bottle is used, no pinholes will form in the resin body. Therefore, insulation between the support of the semiconductor device and the conductive substrate can be maintained as is.
第１図は本発明の一実施例における樹脂成形時の断面図
、第２図は樹脂成形前の状態で、ｌａｌは正面図、 （
ｂ）は平面図、第３図は樹脂成形後の状態で、（Ｊｌ）
は平面図、（ｂ）は側面図である。
１：半導体チップ、２：マウント部、３１．３２゜３３
＝外部端子、６：導線、７：吊り部、８：樹脂体、ｌ工
：上型、１２：下型、工３：牛ヤビティ。
４
第１図
第２隣
（ｂ）
第３図Fig. 1 is a sectional view of an embodiment of the present invention during resin molding, Fig. 2 is a state before resin molding, lal is a front view, (
b) is a plan view, Figure 3 is the state after resin molding, (Jl)
is a plan view, and (b) is a side view. 1: Semiconductor chip, 2: Mount part, 31.32°33
= external terminal, 6: conductor, 7: hanging part, 8: resin body, l work: upper mold, 12: lower mold, work 3: cow yabiti. 4 Figure 1 2nd neighbor (b) Figure 3
Claims (1)
板に連結される外部端子および前記半導体素体の電極と
導線で接続される外部端子のみを露出させ、半導体素体
および導電性基板を樹脂で完全に被覆する半導体装置の
製造方法において、導電性基板の外部端子と反対側に絶
縁材からなる吊り部を結合し、半導体素体が固着された
導電性基板を前記吊り部および外部端子とによって金型
内に金型面から離して支持した状態で樹脂を金型キャビ
ティ内に注入することを特徴とする半導体装置の製造方
法。1) A semiconductor element is fixed on a conductive substrate, and only the external terminals connected to the conductive substrate and the external terminals connected to the electrodes of the semiconductor element with conductive wires are exposed, and the semiconductor element and the conductive In a method for manufacturing a semiconductor device in which a substrate is completely coated with resin, a hanging portion made of an insulating material is coupled to the opposite side of the conductive substrate from the external terminal, and the conductive substrate to which the semiconductor body is fixed is attached to the hanging portion and the conductive substrate. 1. A method of manufacturing a semiconductor device, comprising injecting resin into a mold cavity while being supported within the mold at a distance from the mold surface by an external terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1175943A JPH0340442A (en) | 1989-07-07 | 1989-07-07 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1175943A JPH0340442A (en) | 1989-07-07 | 1989-07-07 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0340442A true JPH0340442A (en) | 1991-02-21 |
Family
ID=16004970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1175943A Pending JPH0340442A (en) | 1989-07-07 | 1989-07-07 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0340442A (en) |
-
1989
- 1989-07-07 JP JP1175943A patent/JPH0340442A/en active Pending
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