JPH0230578B2 - JUSHIMOORUDOGATADENSHIBUHINNOSEIZOHOHO - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a resin molded electronic component.

Recently, in order to realize small electronic circuit devices,
Leadless electronic components are now in practical use.

Figure 1 shows an example of a leadless electronic component, such as a diode, where 1 is an electronic component body (diode pellet) with electrodes formed on both sides, 2a,
2b is a pair of leads, and the pellet 1 is placed and fixed on one lead 2a. Reference numeral 3 indicates a thin metal wire that electrically connects the upper surface electrode of the pellet 1 to another lead 2b, and 4 indicates a resin molded portion in which the main portion including the pellet 1 is covered with a resin material.

Figure 2 shows an example of a lead frame used in manufacturing this diode, with leads 2a,
The ends of the connecting pieces 2b are connected by connecting pieces 2c, 2c, and both ends of the connecting pieces 2c, 2c are connected by a connecting piece 2d, and 2e indicates a guide hole for positioning and transfer.

This diode is connected to lead 2a of the lead frame.
A mounting process in which the pellets 1 are sequentially placed and fixed on the ends, a wire bonding process in which the upper surface electrode of the pellet 1 and the lead 2b are connected with a thin metal wire 3, and the main part including the pellet 1 is covered with a resin material and packaged. Exterior process, cutting and removing tie bars 2c, 2c,
It is manufactured through a separation process of separating the diodes into individual diodes, a process of inspecting the electrical characteristics and appearance of the diodes, etc.

By the way, although a plurality of sets of diodes can be constructed on one lead frame, it has not been possible to manufacture a plurality of diodes all at once. For example, in the wire bonding process, it has been impossible to arrange multiple wire bonders because the lead spacing is narrow.

Furthermore, since there are many manufacturing steps, transfer work between steps is also complicated.

The present invention was proposed in view of the above problems, and
To provide a manufacturing method capable of collectively manufacturing a plurality of electronic components and shortening the manufacturing process.

The present invention will be applied to the manufacture of diodes and will be explained below with reference to FIGS. 3 to 11. FIG. 3 shows the electrode body 5, and in the illustrated example, four legs 5b are erected in the same direction from the corners of a rectangular flat plate portion 5a. FIGS. 4 and 5 show an example of a jig 6 used for manufacturing according to the present invention, and 7 is a lower jig that supports one electrode body 5, and a stepped portion 7a that supports the end surface of the leg piece 5b. The leg piece 5b protrudes from the step, and the side surface is the leg piece 5b.
The protrusion 7b is in contact with the inner surface of the protrusion 7b and has an upper surface facing the flat plate part 5a with a gap therebetween, and side walls 7c extend in parallel from both sides of the protrusion 7b. Reference numeral 8 denotes an upper jig, which has a vertically symmetrical shape with the lower jig 7 except for side wall portions 7c, 7c. Further, a gate 7d for injecting resin is provided in the side wall 7c. 9 and 10 are movable jigs arranged between the lower jig 7 and the upper jig 8, which slide in the horizontal direction and move the protrusions 7 of the lower mold 7 and the upper mold 8.
Protrusions 9a, 9b, 10a, 10b are provided to press the pieces 5b, 5b of the side wall portions b, 8b.
Grooves 9c and 10c are provided between b and between 10a and 10b.

This operation will be explained below with reference to FIGS. 6 to 9.

First, as shown in FIG. 6, remove the upper jig 8, slide the movable jigs 9 and 10 left and right,
One electrode body 5 is attached to the protrusion 7b of the lower jig 7. Although not shown, the other electrode body 5 is also attached to the protrusion 8b of the upper jig 8.

Next, as shown in FIG. 7, the movable jig 9,
10, and the protrusion 7b of the lower jig 7 and the protrusions 9a, 10a of the movable jigs 9, 10 align the electrode body 5.
The leg pieces 5b of the electrode body 5 are fixed by pressure contact, and the pellet 1 is further supplied onto the flat plate part 5a of the electrode body 5.

Then, as shown in FIG.
Insert b. At this time, the electrode body 5 mounted on the upper jig 8 presses the flat plate part 5a against the pellet 1 with the leg piece 5b pressed by the upper jig 8, and the protrusions 9b of the movable jigs 9 and 10 , 10b and the protrusion 8 of the upper jig 8
The leg piece 5b is held at b.

With the pellet 1 being clamped between the electrode bodies 5, 5 in this way, the jig 6 is moved as shown in FIG.
is supplied to the resin injection device. 11 is a bottom on which the jig 6 is placed; 12 is a projecting wall for positioning the jig 6 on the bottom 11; and 13 is an opening on the top surface corresponding to the gate 7d of the jig 6 positioned on the bottom 11. The runner is connected to a pot portion (not shown) for supplying resin material. 14 is a first pressing body that presses the jig 6 against the bottom portion 11, and 15 is a second pressing body that presses the jig 6 against the projecting wall 12. This resin injection device injects the resin material 16 from the runner 13 through the gate 7d into the space surrounded by the lower jig 7 and the upper jig 8. In this state, the jig 6 is heated and the resin material 16 is heated.
After curing, the diode shown in FIG. 10 is obtained. A resin molded diode is obtained by bending the leg pieces 5b of the electrode body 5 of this diode along the outer surface of the resin molded part 3 as shown in FIG.

According to this manufacturing method, the leg pieces 5b of the electrode body 5 are pressed in the axial direction to form pellets 1 at the flat plate portion 5a.
Since the electrode bodies 5, 5 and pellets 1 are pressed elastically, bonding is not required, and a plurality of sets of electrode bodies 5, 5 and pellets 1 can be resin-molded at once in the assembled state in the jig 6, improving work efficiency.

Moreover, the electrode body 5, without damaging the pellet 1,
5 can be pressed and clamped, and resin material 16 is placed on both sides of the electrode body 5.
Since the resin material 16 can be filled with resin, there is no problem that the contact pressure between the electrode body 5 and the pellet 1 decreases due to shrinkage of the resin material 16 after the resin hardens.

Note that the present invention is not limited to the above-mentioned embodiment, and for example, the electrode body 5 may not only be used alone but also connect the ends of the leg pieces 5b with a connecting piece 17 as shown in FIG. However, a plurality of electrode bodies 5 may be integrated, which further improves workability.

Further, the flat plate portion 5a of the electrode body 5 may be provided with a concave portion for accommodating the electronic component main body 1 and a convex portion that comes into contact with the electrode.

Furthermore, it can be applied not only to diodes but also to the manufacture of other electronic components such as resistors and capacitors.

[Brief explanation of drawings]

Figure 1 is a side sectional view showing an example of an electronic component;
The figures are Fig. 1: a plan view of a lead frame used for manufacturing electronic components; Fig. 3: a perspective view showing an example of an electrode body; and Fig. 4: a sectional view of a jig for explaining the manufacturing method according to the present invention. , FIG. 5 is a plane view taken along the line A-A in FIG. 4, FIGS. 6 to 9 are cross-sectional views of the jig shown in FIG. , FIG. 11 is a perspective view of an electronic component with lead molding, and FIG. 12 is a perspective view showing another example of an electrode body. 1...Electronic component body, 3...Resin mold part,
5... Electrode body, 5a... Flat plate part, 5b... Leg piece,
6...Jig, 16...Resin material.

Claims (1)

[Claims] 1. Place a pair of electrode bodies with legs erected from the ends of a flat plate and an electronic component main body having electrodes on both sides in a jig having a recess, with the legs facing in opposite directions, and with the flat plate part facing the electronic component main body. A resin-molded electronic component, characterized in that the recess of the jig is filled with a resin material while the electronic component body is pressed into contact with an electrode body, and the main parts including the electronic component body are exteriorized. Production method.