JPH0340413A - Solid electrolytic capacitor - Google Patents
Solid electrolytic capacitorInfo
- Publication number
- JPH0340413A JPH0340413A JP17579289A JP17579289A JPH0340413A JP H0340413 A JPH0340413 A JP H0340413A JP 17579289 A JP17579289 A JP 17579289A JP 17579289 A JP17579289 A JP 17579289A JP H0340413 A JPH0340413 A JP H0340413A
- Authority
- JP
- Japan
- Prior art keywords
- solid electrolytic
- electrolytic capacitor
- resin
- capacitor element
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 53
- 239000007787 solid Substances 0.000 title claims abstract description 51
- 239000011347 resin Substances 0.000 claims abstract description 58
- 229920005989 resin Polymers 0.000 claims abstract description 58
- 239000000843 powder Substances 0.000 claims abstract description 22
- 239000000178 monomer Substances 0.000 claims abstract description 18
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 11
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229920000642 polymer Polymers 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 8
- 239000000454 talc Substances 0.000 claims description 5
- 229910052623 talc Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 abstract description 11
- 238000000576 coating method Methods 0.000 abstract description 11
- 230000006866 deterioration Effects 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 9
- 229910052715 tantalum Inorganic materials 0.000 description 8
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- VDYWHVQKENANGY-UHFFFAOYSA-N 1,3-Butyleneglycol dimethacrylate Chemical compound CC(=C)C(=O)OC(C)CCOC(=O)C(C)=C VDYWHVQKENANGY-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229940042596 viscoat Drugs 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は樹脂外装型の固体電解コンデンサに関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a resin-clad solid electrolytic capacitor.
従来の技術
従来の樹脂外装型の固体電解コンデンサは、第４図に示
すように、固体電解コンデンサ素子１を種々の物理的ス
トレスや湿気等から保護するために、固体電解コンデン
サ素子ｌの外側を硬質の樹脂材で被覆し、かつ加熱硬化
させることにより、外装樹脂層２を形成していた。なお
、３は陽極リード部材、４は陽極リード部材３に接続さ
れた陽極端子、５は陰極端子である。BACKGROUND OF THE INVENTION Conventional resin-clad solid electrolytic capacitors, as shown in FIG. The exterior resin layer 2 was formed by covering with a hard resin material and heating and curing it. Note that 3 is an anode lead member, 4 is an anode terminal connected to the anode lead member 3, and 5 is a cathode terminal.
発明が解決しようとする課題
しかしながら、上記のようにして固体電解コンデンサ素
子１を樹脂で被覆して外装樹脂層２を形成した場合、樹
脂硬化時の収縮ストレスによって内部の固体電解コンデ
ンサ素子１がストレスを受けるため、漏れ電流が大きく
なり、歩留りが低下するという問題点を有していた。Problems to be Solved by the Invention However, when the solid electrolytic capacitor element 1 is coated with resin to form the exterior resin layer 2 as described above, the internal solid electrolytic capacitor element 1 is subjected to stress due to shrinkage stress during resin curing. Therefore, there was a problem in that the leakage current increased and the yield decreased.
また上記のようにコンデンサ素子１を樹脂で被覆して外
装樹脂層２を形成した固体電解コンデンサをプリント基
板に半田付けする際に、半田による熱が固体電解コンデ
ンサ本体に加わり、そして樹脂の熱膨張ストレスが内部
の固体電解コンデンサ素子１にストレスを与えるため、
漏れ電流不良が発生するという問題点を有していた。Furthermore, when soldering a solid electrolytic capacitor in which the capacitor element 1 is coated with resin to form the exterior resin layer 2 to a printed circuit board as described above, heat from the solder is applied to the solid electrolytic capacitor body, and the resin expands thermally. Since the stress applies stress to the internal solid electrolytic capacitor element 1,
There was a problem in that leakage current failure occurred.
さらに、プリント基板に実装された固体電解コンデンサ
は、使用される周囲温度の変化による樹脂の熱膨張スト
レスを受けるため、漏れ電流が大きくなり、固体電解コ
ンデンサの信頼性を損うという問題点を有していた。Furthermore, solid electrolytic capacitors mounted on printed circuit boards are subject to thermal expansion stress due to changes in the ambient temperature in which they are used, which increases leakage current and impairs the reliability of solid electrolytic capacitors. Was.
本発明はこのような問題点を解決するもので、極めて耐
ストレス性に優れた固体電解コンデンサを提供すること
を目的とするものである。The present invention solves these problems and aims to provide a solid electrolytic capacitor with extremely excellent stress resistance.
課題を解決するための手段
上記課題を解決するために本発明の固体電解コンデンサ
は、陽極端子と陰極端子を有する固体電解コンデンサ素
子と、この固体電解コンデンサ素子を被覆する内装樹脂
と、この内装樹脂を被覆する外装樹脂とを備え、前記内
装樹脂を、ゴム状粉末からなる非相溶性モノマー、ある
いは弾力性を有する非相溶性ポリマー、さらにはゴム状
粉末からなる非相溶性モノマーと弾力性を有する非相溶
性ポリマーとを含有した紫外線硬化型エポキシ変性アク
リル樹脂で構成したものである。Means for Solving the Problems In order to solve the above problems, the solid electrolytic capacitor of the present invention includes a solid electrolytic capacitor element having an anode terminal and a cathode terminal, an interior resin covering this solid electrolytic capacitor element, and this interior resin. and an exterior resin that covers the interior resin, and the interior resin is an incompatible monomer made of rubbery powder, or an immiscible polymer having elasticity, or an incompatible monomer made of rubbery powder and elasticity. It is made of an ultraviolet curable epoxy-modified acrylic resin containing an incompatible polymer.
作用
上記構成によれば、ゴム状粉末からなる非相溶性モノマ
ーや弾力性を有する非相溶性ポリマーを含有した紫外線
硬化型エポキシ変性アクリル樹脂で構成した内装樹脂に
よって固体電解コンデンサ素子を被覆しているため、内
装樹脂や外装樹脂の硬化収縮ストレスや熱膨張ストレス
を吸収することができ、これにより被覆された固体電解
コンデンサ素子に与えるストレスを低減することができ
るため、固体電解コンデンサの漏れ電流劣化を確実に防
止することができるものである。Effect According to the above structure, the solid electrolytic capacitor element is covered with the interior resin made of an ultraviolet-curable epoxy-modified acrylic resin containing an incompatible monomer made of rubbery powder and an elastic incompatible polymer. Therefore, it is possible to absorb the curing shrinkage stress and thermal expansion stress of the interior resin and exterior resin, thereby reducing the stress applied to the covered solid electrolytic capacitor element, thereby reducing leakage current deterioration of the solid electrolytic capacitor. This is something that can be reliably prevented.
実施例
以下、本発明の実施例を添付図面にもとづいて説明する
。第１図において、１１は固体電解コンデンサ素子で、
この固体電解コンデンサ素子１１は、まずタンタルから
なる弁作用金属で構成した陽極リード部材１２を、タン
タルからなる弁作用金属で構成した陽極体に埋め込んで
焼結し、そしてこの陽極体上に酸化皮膜層からなる誘電
体層、二酸化マンガン層からなる半導体層、陰極層を順
次積層して構成したものである。その後、前記陰極層に
陰極端子１３を半田部材１４で接続し、方、前記陽極リ
ード部材１２にＬ字状に形成された陽極端子１５を溶接
し、そしてこの陽極端子１５は前記陰極端子１３ととも
に固体電解コンデンサ素子１１より外部に引き出される
。Embodiments Hereinafter, embodiments of the present invention will be described based on the accompanying drawings. In FIG. 1, 11 is a solid electrolytic capacitor element,
This solid electrolytic capacitor element 11 is manufactured by first embedding and sintering an anode lead member 12 made of a valve metal made of tantalum in an anode body made of a valve metal made of tantalum, and then coating an oxide film on the anode body. It is constructed by sequentially laminating a dielectric layer consisting of a layer, a semiconductor layer consisting of a manganese dioxide layer, and a cathode layer. Thereafter, the cathode terminal 13 is connected to the cathode layer with a solder member 14, and the anode terminal 15 formed in an L-shape is welded to the anode lead member 12. It is drawn out from the solid electrolytic capacitor element 11.
またこのようにして製造された固体電解コンデンサ素子
１１は、全外周が紫外線硬化型エポキシ変性アクリル樹
脂で構成した内装樹脂１６によっ、て被覆され、そして
前記紫外線硬化型エポキシ変性アクリル樹脂はゴム状粉
末からなる非相溶性モノマーまたは弾力性を有する非相
溶性ポリマー１７を含有している。そしてまた内装樹脂
１６の全外周は、熱硬化型の硬質エポキシ樹脂からなる
外装樹脂１８によって被覆されている。Further, the solid electrolytic capacitor element 11 manufactured in this way is covered with an interior resin 16 made of an ultraviolet-curable epoxy-modified acrylic resin on the entire outer periphery, and the ultraviolet-curable epoxy-modified acrylic resin is rubber-like. It contains an incompatible monomer made of powder or an elastic incompatible polymer 17. The entire outer periphery of the interior resin 16 is covered with an exterior resin 18 made of thermosetting hard epoxy resin.
実施例 次に本発明の具体的な実施例について説明する。Example Next, specific examples of the present invention will be described.
（実施例１）
本発明の固体電解コンデンサにおいて、前記内装樹脂１
６の構成は、ビスフェノールＡジグリシジルエーテルア
クリル酸エステル（例えば大阪有機化学工業製ビスコー
ト＃５４０）２５重量部とジメタクリル酸１・３ブチレ
ングリコール（例えば三菱レイヨン製ＢＤＭＡ）２５重
量部とを６０℃〜７０℃で、１時間加熱混練してポリマ
一部を形成し、次に充填材として水酸化アルミニウム（
例えば昭和軽金属型ハイシライトＨ−３２）３重量部を
添加し、さらに増粘剤としてシリカ（例えば日本エアロ
ジル製エロジール９３００）１重量部を添加し、また粒
径５００１．ｔｍのゴム状粉末からなる非相溶性モノマ
ー（例えばエチレンプロピレンジエンモノマー〉１５重
量部を添加してフィラ一部分を形成し、そしてまた光硬
化剤としてベンゾインイソプロピルエーテル（例えば大
阪有機化学工業性ＢＩＰ）１重量部と、熱硬化触媒とし
てｔ−ブチルクミルパーオキサイド（例えば日本油脂製
バーブチルＣ）０．５重量部を添加して、常温で３時間
混練することにより形成されている。(Example 1) In the solid electrolytic capacitor of the present invention, the interior resin 1
The composition of No. 6 is as follows: 25 parts by weight of bisphenol A diglycidyl ether acrylate (e.g. Viscoat #540 manufactured by Osaka Organic Chemical Industry) and 25 parts by weight of 1,3-butylene glycol dimethacrylate (e.g. BDMA manufactured by Mitsubishi Rayon) at 60°C. Heat and knead for 1 hour at ~70°C to form a part of the polymer, then add aluminum hydroxide (
For example, 3 parts by weight of Showa light metal type Hisilite H-32) is added, 1 part by weight of silica (for example, Erosil 9300 manufactured by Nippon Aerosil) is added as a thickener, and the particle size is 5001. 15 parts by weight of an incompatible monomer (e.g. ethylene propylene diene monomer) consisting of a rubbery powder of TM is added to form a portion of the filler, and also benzoin isopropyl ether (e.g. Osaka Organic Chemical Industry BIP) as a photocuring agent. part by weight, and 0.5 part by weight of t-butylcumyl peroxide (for example, Barbutyl C manufactured by NOF Corporation) as a thermosetting catalyst, and kneaded at room temperature for 3 hours.
本実施例においては、２５Ｖ１０μＦのタンタル固体電
解コンデンサ素子を第１図のように組み立てた後、前記
内装樹脂中に浸漬し、８０ｗ／ａｎの高圧水銀ランプよ
りｉｏａｍの距離から２０秒間紫外線を照射して内装樹
脂１６を形成した後、硬質のエポキシ樹脂中に浸漬し、
１２０℃で２時間加熱し、かつ硬化させて外装樹脂１８
を形成して、タンタル固体電解コンデンサを作成した。In this example, after a 25V 10μF tantalum solid electrolytic capacitor element was assembled as shown in Figure 1, it was immersed in the interior resin and irradiated with ultraviolet rays from a distance of ioam from an 80W/an high pressure mercury lamp for 20 seconds. After forming the interior resin 16, it is immersed in a hard epoxy resin.
Heating at 120°C for 2 hours and curing the exterior resin 18
A tantalum solid electrolytic capacitor was created by forming a tantalum solid electrolytic capacitor.
第２図は前記内装樹脂１６の構成を示す概念図で、実施
例１は第２図（ｂ）で示し、これは従来例である第２図
（ａ）のエポキシ変性アクリル樹脂２１にゴム状粉末か
らなる非相溶性モノマー２２を添加したものである。FIG. 2 is a conceptual diagram showing the structure of the interior resin 16. Example 1 is shown in FIG. An incompatible monomer 22 made of powder is added.
上記したゴム状粉末からなる非相溶性モノマー２２は、
その粒径が３００〜５００μｍの範囲、また添加量が１
０〜１５重量部の範囲を最適条件とし、さらに粉末表面
をタルクコーティング処理したもので構成しているもの
で、このことは、以下に示す第１表、第２表、第３表の
実験結果がら明らかなものとなるものである。The incompatible monomer 22 made of the rubbery powder described above is
The particle size is in the range of 300 to 500 μm, and the amount added is 1
The optimum condition is 0 to 15 parts by weight, and the surface of the powder is coated with talc. However, it becomes clear.
（以 下 余 白 ）
第１表はゴム状粉末からなる非相溶性モノマー２２の粒
径を１００〜９００μｍの範囲の５条件とし、かつその
添加量は１５重量部で一定とし、従来例（添加能）と比
較して、固体電解コンデンサ素子を樹脂中に浸漬する場
合の樹脂塗布性、紫外線を照射する場合の樹脂硬化性、
そして樹脂硬化後の表面の凹凸およびピンホールなどの
外観形状、さらには樹脂物性としてストレスの大小に影
響を与える弾性率およびゴム状粉末の収率（コスト）に
ついて評価したもので、この第１表からも明らかなよう
に、粒径は３００〜５００μｍの範囲で最適条件を得る
ことができた。(Margin below) Table 1 shows five conditions in which the particle size of the incompatible monomer 22 made of rubbery powder is in the range of 100 to 900 μm, and the amount added is constant at 15 parts by weight. Compared to the conventional method, resin coating properties when solid electrolytic capacitor elements are immersed in resin, resin curing properties when irradiated with ultraviolet rays,
Then, the appearance shape such as surface irregularities and pinholes after resin curing, as well as the elastic modulus and yield (cost) of rubbery powder, which affect the magnitude of stress as resin physical properties, were evaluated. As is clear from the above, the optimum conditions could be obtained for the particle size in the range of 300 to 500 μm.
（以 下 余 白 ）
第２表はゴム状粉末からなる非相溶性モノマー２２の添
加量を５〜２５重量部の範囲の５条件とし、かつ粒径は
５００μｍで一定とし、従来例（添加能）と比較して、
固体電解コンデンサ素子を樹脂中に浸漬する場合の樹脂
塗布性、紫外線を照射する場合の樹脂硬化性、そして樹
脂硬化後の表面の凹凸およびピンホールなどの外観形状
、さらには難燃性および樹脂物性としてストレスの大小
に影響を与える弾性率について評価したもので、この第
２表からも明らかなように、添加量は１０〜１５重量部
の範囲で最適条件を得ることができた。(Margins below) Table 2 shows five conditions in which the amount of incompatible monomer 22 made of rubbery powder is added in the range of 5 to 25 parts by weight, and the particle size is constant at 500 μm. ) compared to
Resin coating properties when solid electrolytic capacitor elements are immersed in resin, resin curing properties when irradiated with ultraviolet rays, external appearance such as surface irregularities and pinholes after resin curing, as well as flame retardancy and resin physical properties. The elastic modulus, which affects the magnitude of stress, was evaluated, and as is clear from Table 2, the optimum conditions could be obtained when the amount added was in the range of 10 to 15 parts by weight.
第３表はゴム状粉末からなる非相溶性モノマー２２の表
面をタルク（マグネシウム含水ケイ酸塩）でコーティン
グし、モして粒径５００μｍで一定とし、さらに添加量
は１５重量部として、タルクコーティングしていないも
のと比較して、樹脂塗布性、外観形状および弾性率につ
いて評価したもので、この第３表からも明らかなように
、タルクコートを実施することにより、著しい効果があ
ることを確認することができた。Table 3 shows that the surface of the incompatible monomer 22 made of rubbery powder is coated with talc (magnesium hydrated silicate), the particle size is kept constant at 500 μm, and the amount added is 15 parts by weight. The resin coating properties, appearance shape, and elastic modulus were evaluated in comparison with those without talc coating, and as is clear from Table 3, it was confirmed that talc coating had a significant effect. We were able to.
（実施例２）
本実施例は第１図に示すような樹脂外装型の固体電解コ
ンデンサを作成し、前記内装樹脂１６の構成を第２図（
Ｃ）のように形成したもので、すなわち、第２図（ａ）
で示した従来例のエポキシ変性アクリル樹脂２１に弾力
性を有する非相溶性ポリマー２３（ポリブタジェン〉５
量量部を添加して、実施例１と同様に２５Ｖ１０μＦの
タンタル固体電解コンデンサを作成したものである。(Example 2) In this example, a resin-clad solid electrolytic capacitor as shown in FIG.
C), that is, Fig. 2(a)
An elastic incompatible polymer 23 (polybutadiene) 5 is added to the conventional epoxy-modified acrylic resin 21 shown in
A tantalum solid electrolytic capacitor of 25 V and 10 μF was prepared in the same manner as in Example 1 by adding a certain amount.
〈実施例３）
本実施例は第１図に示すような樹脂外装型の固体電解コ
ンデンサを作成し、前記内装樹脂１６の構成を第２図（
ｄ）のように形成したもので、すなわち、第２図（ａ）
で示した従来例のエポキシ変性アクリル樹脂２１にゴム
状粉末からなる非相溶性モノマー２２（エチレンプロピ
レンジエンモノマーの添加量１５重量部２２径径００μ
ｍ）を添加し、かつ弾力性を有する非相溶性ポリマー２
３〈ポリブタジェン５重量部〉を添加して、両者を混合
し、実施例１と同様に２５Ｖ１０μＦのタンタル固体電
解コンデンサを作成したものである。<Example 3> In this example, a resin-clad solid electrolytic capacitor as shown in FIG.
d), that is, Fig. 2(a)
An incompatible monomer 22 made of rubbery powder (addition amount of ethylene propylene diene monomer 15 parts by weight 22 diameter 00μ
m) and has elasticity, an incompatible polymer 2
3 (5 parts by weight of polybutadiene) was added and the two were mixed to produce a 25V 10 μF tantalum solid electrolytic capacitor in the same manner as in Example 1.
上記実施例１．２．３と従来例の４条件で形成したタン
タル固体電解コンデンサの電気特性を測定し、半田耐熱
（２６０℃、１０秒間浸漬）試験、ヒートサイクル（−
５５℃／＋１２５℃、各３０分、１００サイクル）試験
を行った。The electrical characteristics of tantalum solid electrolytic capacitors formed under the four conditions of Example 1.2.3 and the conventional example were measured, and the soldering heat resistance (260°C, 10 second immersion) test, heat cycle (-
55° C./+125° C., 30 minutes each, 100 cycles).
第３図は上記試験後の漏れ電流値変化を示したもので、
この第３図のａ〜ｄが第２図のａ−ｄに対応しているも
のである。Figure 3 shows the change in leakage current value after the above test.
A to d in FIG. 3 correspond to a to d in FIG. 2.
第３図に示した漏れ電流変化の結果、従来例ａと比較し
て、ｂ、ｃ、ｄの条件が漏れ電流値のレベル、バラツキ
とも良くなっており、特にｄの条件が最も安定している
という結果を得た。また、静電容量、ｔａｎδの変化も
確認したが、各条件とも全く差は見られなかった。As a result of the change in leakage current shown in Figure 3, compared to conventional example a, conditions b, c, and d have improved both the level and variation of leakage current values, and in particular, condition d is the most stable. The result was that there was. Changes in capacitance and tan δ were also confirmed, but no differences were observed under each condition.
発明の効果
上記実施例の説明から明らかなように本発明によれば、
ゴム状粉末からなる非相溶性モノマーや弾力性を有する
非相溶性ポリマーを含有する内装樹脂により固体電解コ
ンデンサ素子を被覆しているため、内装樹脂や外装樹脂
の硬化収縮ストレスや熱膨張ストレスを吸収することが
でき、その結果、被覆された固体電解コンデンサ素子に
与えるストレスを低減することができるため、固体電解
コンデンサの漏れ電流劣化を確実に防止することができ
るものである。Effects of the Invention As is clear from the description of the above embodiments, according to the present invention,
The solid electrolytic capacitor element is coated with an interior resin containing an incompatible monomer made of rubbery powder or an elastic incompatible polymer, so it absorbs the curing shrinkage stress and thermal expansion stress of the interior resin and exterior resin. As a result, the stress applied to the covered solid electrolytic capacitor element can be reduced, so that leakage current deterioration of the solid electrolytic capacitor can be reliably prevented.
第１図は本発明の一実施例を示す固体電解コンデンサの
断面図、第２図（ａ）は従来の内装樹脂構成を示す概念
図、第２図（ｂ）〜（ｄ）は本発明の各実施例における
内装樹脂の構成を示す概念図、第３図は従来の製品と本
発明の実施例で用いた製品の初期値、半田耐熱試験、ヒ
ートサイクル試験後の漏れ電流値変化を示す特性図、第
４図は従来例を示す固体電解コンデンサの断面図である
。
１１・・・・・・固体電解コンデンサ素子、１３・・・
・・・陰極端子、１５・・・・・・陽極端子、■６・・
・・・・内装樹脂、１７・・・・・・ゴム状粉末からな
る非溶性モノマーまたは弾力性を有する非溶性ポリマー
１８・・・・・・外装樹脂。FIG. 1 is a sectional view of a solid electrolytic capacitor showing an embodiment of the present invention, FIG. 2(a) is a conceptual diagram showing a conventional interior resin structure, and FIGS. 2(b) to (d) are A conceptual diagram showing the composition of the interior resin in each example. Figure 3 shows the characteristics of the conventional product and the product used in the example of the present invention, showing initial values, changes in leakage current values after soldering heat resistance test and heat cycle test. 4 are sectional views of a solid electrolytic capacitor showing a conventional example. 11... Solid electrolytic capacitor element, 13...
...Cathode terminal, 15...Anode terminal, ■6...
... Interior resin, 17 ... Insoluble monomer made of rubbery powder or insoluble polymer having elasticity 18 ... Exterior resin.
Claims (4)
素子と、この固体電解コンデンサ素子を被覆する内装樹
脂と、この内装樹脂を被覆する外装樹脂とを備え、前記
内装樹脂を、ゴム状粉末からなる非相溶性モノマーを含
有した紫外線硬化型エポキシ変性アクリル樹脂で構成し
たことを特徴とする固体電解コンデンサ。(1) A solid electrolytic capacitor element having an anode terminal and a cathode terminal, an interior resin covering the solid electrolytic capacitor element, and an exterior resin covering the interior resin, wherein the interior resin is made of rubbery powder. A solid electrolytic capacitor characterized by being constructed from an ultraviolet-curable epoxy-modified acrylic resin containing an incompatible monomer.
素子と、この固体電解コンデンサ素子を被覆する内装樹
脂と、この内装樹脂を被覆する外装樹脂とを備え、前記
内装樹脂を、弾力性を有する非相溶性ポリマーを含有し
た紫外線硬化型エポキシ変性アクリル樹脂で構成したこ
とを特徴とする固体電解コンデンサ。(2) A solid electrolytic capacitor element having an anode terminal and a cathode terminal, an interior resin covering the solid electrolytic capacitor element, and an exterior resin covering the interior resin; A solid electrolytic capacitor characterized by being constructed from an ultraviolet curable epoxy-modified acrylic resin containing a compatible polymer.
素子と、この固体電解コンデンサ素子を被覆する内装樹
脂と、この内装樹脂を被覆する外装樹脂とを備え、前記
内装樹脂を、ゴム状粉末からなる非相溶性モノマーと弾
力性を有する非相溶性ポリマーとを含有した紫外線硬化
型エポキシ変性アクリル樹脂で構成したことを特徴とす
る固体電解コンデンサ。(3) A solid electrolytic capacitor element having an anode terminal and a cathode terminal, an interior resin covering the solid electrolytic capacitor element, and an exterior resin covering the interior resin, wherein the interior resin is made of rubbery powder. A solid electrolytic capacitor comprising an ultraviolet curable epoxy-modified acrylic resin containing an incompatible monomer and an elastic incompatible polymer.
μｍ〜５００μｍで、かつ粉末表面がタルクコートして
あり、さらに粉末の含有量が１０〜１５重量部である特
許請求の範囲第１項記載の固体電解コンデンサ。(4) The rubbery powder of the incompatible monomer has a particle size of 300
2. The solid electrolytic capacitor according to claim 1, which has a particle diameter of 1 to 500 .mu.m, the surface of the powder is coated with talc, and the powder content is 10 to 15 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17579289A JPH0340413A (en) | 1989-07-07 | 1989-07-07 | Solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17579289A JPH0340413A (en) | 1989-07-07 | 1989-07-07 | Solid electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0340413A true JPH0340413A (en) | 1991-02-21 |
Family
ID=16002332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17579289A Pending JPH0340413A (en) | 1989-07-07 | 1989-07-07 | Solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0340413A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1536441A1 (en) * | 1999-10-29 | 2005-06-01 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor |
| US20100246100A1 (en) * | 2009-03-31 | 2010-09-30 | Sanyo Electric Co., Ltd. | Solid electrolytic capacitor |
| WO2021171866A1 (en) * | 2020-02-26 | 2021-09-02 | パナソニックＩｐマネジメント株式会社 | Capacitor element, electrolytic capacitor, insulating material, and method for manufacturing mounting substrate |
-
1989
- 1989-07-07 JP JP17579289A patent/JPH0340413A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1536441A1 (en) * | 1999-10-29 | 2005-06-01 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor |
| US20100246100A1 (en) * | 2009-03-31 | 2010-09-30 | Sanyo Electric Co., Ltd. | Solid electrolytic capacitor |
| US8437117B2 (en) * | 2009-03-31 | 2013-05-07 | Sanyo Electric Co., Ltd. | Solid electrolytic capacitor with improved stress resistance in the vicinity of the anode lead and the anode terminal |
| WO2021171866A1 (en) * | 2020-02-26 | 2021-09-02 | パナソニックＩｐマネジメント株式会社 | Capacitor element, electrolytic capacitor, insulating material, and method for manufacturing mounting substrate |
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