JPH0338839Y2 - - Google Patents

Description

[Detailed explanation of the idea] Industrial applications This invention relates to a semiconductor cooler.

BACKGROUND ART Conventionally, as shown in FIG. 7, for example, as shown in FIG. There is known a heat radiating body 24 made of aluminum plates attached in parallel, and a covering plate 28 having an inverted U-shape in cross section and covering the heat radiating body 24. However, in this cooler, since the heat radiating body 24 is plate-shaped, there is a problem that the heat radiating performance is very low. Therefore, conventionally, a semiconductor mounting base 3 having a flat upper surface as shown in FIG.
1, a plurality of aluminum extruded heat sinks 34 attached in parallel to the upper surface of the base 31 via a joint plate 33, and a covering plate 38 having an inverted U-shape in cross section and covering the heat sink 34. A cooler was proposed (see Utility Model Application Publication No. 58-173245), but in this conventional cooler, the heat radiator 34 is located at both the upper and lower horizontal portions 3.
4, 35 and a vertical section 36 provided between them.
and a large number of horizontal fins 37 provided on at least one side of the vertical part 36, the problem is that a large amount of material is used, resulting in a heavy and high cost of the cooler. It was hot.

Purpose of the invention The purpose of the invention is to solve the above problems and provide a semiconductor cooler that is lightweight, inexpensive, and has excellent heat dissipation performance.

Structure of the invention In order to achieve the above object, this invention includes a semiconductor mounting base having a flat top surface, a plurality of heat radiators made of extruded aluminum sections attached in parallel to the top surface of the base, and a heat radiator made of extruded aluminum. In a semiconductor cooler comprising a covering plate having an inverted U-shaped cross section, which is covered and fixed to a base at both ends to form a ventilation passage, a heat radiator is provided on the upper surface of the base and on the lower surface of the upper wall of the covering plate, respectively. The gist of this invention is a semiconductor cooler that is constituted by a pair of upper and lower horizontal parts joined together, and a vertical part with a horizontal cross-sectional waveform provided between the two.

Embodiment Next, an embodiment of this invention will be described based on the drawings.

In this specification, front and back and left and right are based on FIG. 1, and "front" refers to the front side of the sheet of drawing paper in FIG. 1, "back" refers to the back side of the sheet of drawing paper in FIG. Right means the same right side.

The semiconductor cooler according to this invention shown in FIGS. 1 to 4 is made of aluminum. In the figure, reference numeral 1 denotes a rectangular semiconductor mounting base with a flat top surface, and semiconductors (not shown) such as transistors and thyristors are mounted on the bottom surface of this base. 2 is a pair of grooves provided on the left and right edges of the upper surface of the base 1; 3 is a joint plate made of a brazing sheet placed on the base 1 in the middle of these grooves 2; 4 is a joint plate on the upper surface of this joint plate 3. A large number of heat dissipating bodies made of extruded materials are arranged in parallel. Each heat dissipating body 4 consists of upper and lower horizontal parts 5 and a vertical part 6 provided between the two central parts. It has a horizontal cross-sectional waveform. The lower horizontal portion 5 of each heat sink 4 is joined to the base 1 via a joining plate 3. 8 is an inverted U cross section that covers all the heat sinks 4
It is a shaped covering plate, and the inner surface of this plate is laminated with plate-shaped aluminum solder. The upper horizontal portion 5 of each heat radiator 4 is joined to the inner surface of the upper wall 8a of the covering plate 8, and the lower edges of the left and right side portions 8b are joined to the base 1 while being fitted into the grooves 2. In addition,
These base 1, joint plate 3, heat sink 4,
The covering plates 8 are assembled together and then joined together by vacuum brazing. Reference numeral 9 denotes a ventilation passage surrounded by the base 1 and the covering plate 8, which is open from the front and rear.

As shown in FIG. 5, the heat sink 4 is made of an extruded aluminum material 14 consisting of upper and lower horizontal portions 15, 15 and a vertical portion 16 in the middle, and the vertical portion 16 is formed by press working. As shown in FIG. 6, it is molded into a horizontal cross-sectional waveform consisting of a large number of convex portions 6a and concave portions 6b.

In the cooler, heat generated from semiconductors such as transistors and thyristors attached to the lower surface of the base 1 is transmitted from the base 1 to the heat radiator 4 and the cover plate 8 and released, and the heat is released into the ventilation passage 9 by a fan or the like (not shown). Heat is discharged to the outside by forcing ventilation through a radiator (omitted), but at this time, since the vertical section 6 of each heat radiator 4 has a horizontal cross-sectional corrugated shape, the contact area increases. Moreover, since there is little ventilation resistance, the heat dissipation performance is very good.

In each of the embodiments described above, the side edges of the heat sinks 4 that are adjacent to each other are butted against each other, but the heat sinks 4 may be placed apart from each other. Further, the number of heat sinks 4 used is arbitrary.
It is sufficient if there are more than one.

Effects of the invention As described above, this invention consists of a semiconductor mounting base 1 having a flat top surface, a plurality of heat sinks 4 made of extruded aluminum members attached in parallel to the top surface of the base, and a heat sink 4 that covers the heat sink 4. In a semiconductor cooling device, a heat dissipating body 4 is provided on the upper surface of the base 1 and on the cover plate 8. Since it is constituted by a pair of upper and lower horizontal parts 5, 5 respectively joined to the lower surface of the wall 8a, and a vertical part 6 with a corrugated horizontal cross section provided between the two, the heat sink 4 The contact area between the vertical portion 6 and the air is very large, and therefore the heat dissipation performance is very high compared to the conventional plate-shaped heat dissipation body 24. Further, since the vertical portion 6 of the heat radiator 4 according to this invention has a horizontal cross-sectional waveform, the ventilation resistance is small, and therefore the energy consumption of the ventilation fan is low, making it economical. Also, the vertical portion 6 of the heat sink 4
Since the heat dissipation body 34 is formed into a corrugated shape by press working, the amount of material used is small compared to the conventional extruded aluminum heat dissipation body 34 having a large number of horizontal fins 37, and the manufacturing cost is low. It has the effect of sticking.

[Brief explanation of the drawing]

Figures 1 to 4 show an embodiment of this invention; Figure 1 is a partially omitted front view of a semiconductor cooler;
Figure 2 is a partially enlarged sectional view taken along the line of Figure 1;
Figure 3 is an enlarged sectional view along the line of Figure 2;
The figure is a front view of only the heat sink. FIG. 5 is a partially enlarged perspective view of the heat sink material, showing the state before corrugation. Figure 6 is a partially enlarged perspective view of the heat sink.
This shows the state after waveform shaping. 7 and 8 are partially omitted front views showing conventional examples, respectively. 1... Semiconductor mounting base, 4... Heat sink, 5...
...Horizontal part, 6...Vertical part, 8...Covering plate, 8a...
...Top wall, 9...Ventilation passage.

Claims (1)

[Scope of utility model registration request] a semiconductor mounting base 1 having a flat top surface;
A plurality of heat sinks 4 made of extruded aluminum are attached in parallel on the top surface of the heat sink 4, and an inverted U-shaped cross section is covered with the heat sink 4 and fixed to the base 1 at both ends to form a ventilation passage 9. In a semiconductor cooler comprising a cover plate 8, a heat radiator 4 has a pair of upper and lower horizontal portions 5, 5 joined to the upper surface of the base 1 and the lower surface of the upper wall 8a of the cover plate 8, respectively; A semiconductor cooler constituted by a vertical section 6 having a corrugated horizontal cross section.