JPS6223091Y2 - - Google Patents

Description

[Detailed explanation of the idea] This invention relates to a semiconductor cooler.

Conventionally, this type of aluminum cooler has a semiconductor mounting base 31 with a large number of grooves 32 arranged in parallel, as shown in FIG.
The lower edges of the partition plates 33 having an inverted L-shaped cross section are inserted into these grooves 32, and these partition plates 3
It is known that a corrugated fin 34 is interposed between the three comrades, and the base 31, partition plate 33, and corrugated fin 34 are joined by brazing.

However, in such conventional coolers,
The process of providing a large number of grooves 32 in the semiconductor mounting base 31 was extremely troublesome. In addition, the distance between the peaks of the corrugated fin 34 becomes wider or narrower, and the height of the peaks becomes uneven.
There are places where the fins 34 and the partition plate 33 are not joined because the shape is curved, making it impossible to obtain a uniform product, and the height of the ridges of the corrugated fins 34 is uneven. When this occurs, there is a problem in that the heat dissipation effect deteriorates.

This invention was made to solve the above problem, and its configuration will be explained below based on the embodiment shown in the drawings.

In this specification, front and back and left and right are based on FIG. 1, and "front" refers to the front side of the sheet of drawing paper in FIG. 1, "back" refers to the back side of the sheet of drawing paper in FIG. Right means the same right side.

Figures 1 and 2 show a first embodiment of this invention, in which the cooler is made of aluminum. In the figure, reference numeral 1 denotes a rectangular semiconductor mounting base with a flat top surface, and semiconductors (not shown) such as transistors and thyristors are mounted on the bottom surface of this base.
2 is a pair of grooves provided on the left and right edges of the upper surface of the base 1; 3 is a joint plate made of a brazing sheet placed on the base 1 in the middle of these grooves 2; 4 is a joint plate on the upper surface of this joint plate 3. Eight heat radiators made of extruded material are arranged in parallel, and each heat radiator 4 has two upper and lower horizontal parts 5, a vertical part 6 provided between the center part of both, and both left and right sides of the vertical part 6. Five fins 7 are provided horizontally at equal intervals from each other.
It is composed of: The upper and lower horizontal portions 5 of adjacent heat sinks 4 and the corresponding edges of the fins 7 are butted against each other. The lower horizontal portion 5 of each heat sink 4 is joined to the base 1 via a joining plate 3. Reference numeral 8 denotes an outer wall plate having an inverted U-shape in cross section and covering all the heat sinks 4, and a plate-shaped aluminum solder is bonded to the inner surface of this wall plate. Upper surface part 8 of outer wall board 8
a is joined to the upper horizontal part 5 of each heat sink 4, both left and right side surfaces 8b are joined to the outer edges of both outer heat sinks 4, and the lower edges of these both side surfaces 8b are fitted into the groove 2. It is joined to base 1 with.
The base 1, the joining plate 3, the heat sink 4, and the outer wall board 8 are assembled together and then joined all at once by a vacuum brazing method. Reference numeral 9 denotes a ventilation passage surrounded by the base 1 and the outer wall plate 8, which is open in the front and rear.

In the cooler, heat generated from semiconductors such as transistors and thyristors attached to the lower surface of the base 1 is transmitted from the base 1 to the heat radiator 4 and the outer wall plate 8 and released, and the heat is released into the ventilation passage 9 by a fan or the like (not shown). Heat is discharged to the outside by forced ventilation.

FIG. 3 shows a second embodiment of this invention, which differs from the first embodiment in the shape of the heat sink 14 made of extruded aluminum. That is, the heat sink 14 is composed of upper and lower horizontal parts 15, a vertical part 16 provided between these parts near the right edge, and a large number of horizontal fins 17. The fins 17 of adjacent heat sinks 14 are arranged with a difference from each other, so that the density of the fins 17 in the ventilation passage 9 is large. The other points of this second embodiment are the same as those of the first embodiment, and the same parts are given the same reference numerals in the drawings.

FIG. 4 shows a modification of the heat sink.
The heat dissipation body 24 is an extruded aluminum member, which has upper and lower horizontal parts 25, a vertical part 26 provided between these right edges, and a vertical part 26 spaced equally apart from each other on the left side of the vertical part 26. It is constituted by three horizontal fins 27 that are provided in a state of protruding in the direction. Although not shown, this heat sink 2
4 can be used in the same manner as in the first embodiment.

In each of the above embodiments, the side edges of the heat sinks 4 and 14 that are adjacent to each other are butted against each other, but the heat sinks 4 and 14 may be placed apart from each other. Also, heat sinks 4, 14, 2
The number of 4 used is arbitrary, as long as it is plural.

As described above, the semiconductor cooler according to this invention has a semiconductor mounting base 1 having a flat upper surface.
and a plurality of extruded aluminum heat sinks 4, 14, 2 attached in parallel to the upper surfaces of these bodies.
4 and an outer wall plate 8 having an inverted U-shape in cross section and covering the heat radiators 4, 14, 24.
24 includes upper and lower horizontal parts 5, 15, 25, vertical parts 6, 16, 26 provided between the two, and fins 7, 17, 27 provided on at least one side of the vertical parts 6, 16, 26. The lower horizontal parts 5, 15, 25 are joined to the upper surface of the base 1, and the upper horizontal parts 5, 15, 25 are joined to the upper surface part 8a of the outer wall board 8. It requires less time and effort to process the grooves 2, etc. on the base 1, and the heat sinks 4, 14, and 24 only need to be arranged on the base 1, so the assembly work of the cooler is very simple, and the manufacture of the cooler is simplified. This can be done easily and inexpensively.
In addition, since the heat sinks 4, 14, and 24 are made of extruded aluminum, it is possible to obtain uniform products with no variation in dimensions, etc.
The heat sinks 4, 14, 24 and the base 1 and the heat sinks 4, 14, 24 and the outer wall plate 8 can be reliably joined, resulting in an extremely excellent heat radiation effect.

[Brief explanation of the drawing]

Figures 1 to 4 show an embodiment of this invention. Figure 1 is a front view of the first embodiment, Figure 2 is an enlarged partially cutaway perspective view of the same exploded state, and Figure 3 is an enlarged perspective view of the first embodiment. A front view of the second embodiment, and FIG. 4 is a front view showing a modification of the heat sink. FIG. 5 is a front view showing a conventional example. 1...Semiconductor mounting base, 2...Groove, 3...
Joint plate, 4, 14, 24... Heat sink, 5, 15,
25... Upper and lower horizontal parts, 6, 16, 26... Vertical parts, 7, 17, 27... Fins, 8... Outer wall boards,
9...Ventilation duct.

Claims (1)

[Scope of utility model registration request] a semiconductor mounting base 1 having a flat top surface;
A plurality of heat sinks 4, 14, 24 made of extruded aluminum are attached in parallel on the upper surface of the heat sink,
It consists of an outer wall plate 8 with an inverted U-shaped cross section that covers the heat sinks 4, 14, 24, and the heat sinks 4, 14, 24 have upper and lower horizontal parts 5, 15, 25, and Vertical parts 6, 16, 26 and vertical parts 6, 1
The lower horizontal portion 5, 1 is provided with fins 7, 17, 27 provided on at least one side of the lower horizontal portion 5, 1.
5, 25 are joined to the upper surface of the base 1, and the upper horizontal portions 5, 15, 25 are joined to the upper surface portion 8a of the outer wall plate 8.