JPH0338644U - - Google Patents

Info

Publication number
JPH0338644U
JPH0338644U JP1989098546U JP9854689U JPH0338644U JP H0338644 U JPH0338644 U JP H0338644U JP 1989098546 U JP1989098546 U JP 1989098546U JP 9854689 U JP9854689 U JP 9854689U JP H0338644 U JPH0338644 U JP H0338644U
Authority
JP
Japan
Prior art keywords
resin
chip
semiconductor device
injection molding
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989098546U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989098546U priority Critical patent/JPH0338644U/ja
Publication of JPH0338644U publication Critical patent/JPH0338644U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/754—
JP1989098546U 1989-08-25 1989-08-25 Pending JPH0338644U (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989098546U JPH0338644U (en:Method) 1989-08-25 1989-08-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989098546U JPH0338644U (en:Method) 1989-08-25 1989-08-25

Publications (1)

Publication Number Publication Date
JPH0338644U true JPH0338644U (en:Method) 1991-04-15

Family

ID=31647640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989098546U Pending JPH0338644U (en:Method) 1989-08-25 1989-08-25

Country Status (1)

Country Link
JP (1) JPH0338644U (en:Method)

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