JPH0338634U - - Google Patents

Info

Publication number
JPH0338634U
JPH0338634U JP9948789U JP9948789U JPH0338634U JP H0338634 U JPH0338634 U JP H0338634U JP 9948789 U JP9948789 U JP 9948789U JP 9948789 U JP9948789 U JP 9948789U JP H0338634 U JPH0338634 U JP H0338634U
Authority
JP
Japan
Prior art keywords
film substrate
bonded
chip
conductor wiring
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9948789U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9948789U priority Critical patent/JPH0338634U/ja
Publication of JPH0338634U publication Critical patent/JPH0338634U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP9948789U 1989-08-25 1989-08-25 Pending JPH0338634U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9948789U JPH0338634U (enrdf_load_stackoverflow) 1989-08-25 1989-08-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9948789U JPH0338634U (enrdf_load_stackoverflow) 1989-08-25 1989-08-25

Publications (1)

Publication Number Publication Date
JPH0338634U true JPH0338634U (enrdf_load_stackoverflow) 1991-04-15

Family

ID=31648538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9948789U Pending JPH0338634U (enrdf_load_stackoverflow) 1989-08-25 1989-08-25

Country Status (1)

Country Link
JP (1) JPH0338634U (enrdf_load_stackoverflow)

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