JPH0338629U - - Google Patents
Info
- Publication number
- JPH0338629U JPH0338629U JP9980389U JP9980389U JPH0338629U JP H0338629 U JPH0338629 U JP H0338629U JP 9980389 U JP9980389 U JP 9980389U JP 9980389 U JP9980389 U JP 9980389U JP H0338629 U JPH0338629 U JP H0338629U
- Authority
- JP
- Japan
- Prior art keywords
- processing
- liquid
- carrier
- large number
- semiconductor wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 claims 2
Landscapes
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9980389U JPH0338629U (sh) | 1989-08-25 | 1989-08-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9980389U JPH0338629U (sh) | 1989-08-25 | 1989-08-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0338629U true JPH0338629U (sh) | 1991-04-15 |
Family
ID=31648842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9980389U Pending JPH0338629U (sh) | 1989-08-25 | 1989-08-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0338629U (sh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012064646A (ja) * | 2010-09-14 | 2012-03-29 | Tokyo Electron Ltd | 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体及び基板処理装置 |
-
1989
- 1989-08-25 JP JP9980389U patent/JPH0338629U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012064646A (ja) * | 2010-09-14 | 2012-03-29 | Tokyo Electron Ltd | 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体及び基板処理装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0338629U (sh) | ||
JPS55128834A (en) | Method of ultrasonically cleaning semiconductor wafer | |
JPS6329934U (sh) | ||
JPH0330427U (sh) | ||
JPS6232531U (sh) | ||
JPH0296726U (sh) | ||
JPS5850741A (ja) | シリコンウエ−ハのハンドリング方法 | |
JPH0379872U (sh) | ||
JPH0314156U (sh) | ||
JPS6329931U (sh) | ||
JPS625637U (sh) | ||
JPS6278746U (sh) | ||
JPS6314570U (sh) | ||
JPH02132942U (sh) | ||
JPS63174439U (sh) | ||
JPS63127126U (sh) | ||
JPH03109328U (sh) | ||
JPH0321846U (sh) | ||
JPS617030U (ja) | 半導体製造装置 | |
JPH01116435U (sh) | ||
JPH0379424U (sh) | ||
JPH01140824U (sh) | ||
JPS637171U (sh) | ||
JPS63143577U (sh) | ||
JPS6194344U (sh) |