JPH033779U - - Google Patents
Info
- Publication number
- JPH033779U JPH033779U JP6519389U JP6519389U JPH033779U JP H033779 U JPH033779 U JP H033779U JP 6519389 U JP6519389 U JP 6519389U JP 6519389 U JP6519389 U JP 6519389U JP H033779 U JPH033779 U JP H033779U
- Authority
- JP
- Japan
- Prior art keywords
- unit
- cable
- holding member
- device frame
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6519389U JPH033779U (enrdf_load_html_response) | 1989-06-02 | 1989-06-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6519389U JPH033779U (enrdf_load_html_response) | 1989-06-02 | 1989-06-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH033779U true JPH033779U (enrdf_load_html_response) | 1991-01-16 |
Family
ID=31596804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6519389U Pending JPH033779U (enrdf_load_html_response) | 1989-06-02 | 1989-06-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH033779U (enrdf_load_html_response) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010153020A (ja) * | 2008-12-23 | 2010-07-08 | Nexsan Technologies Ltd | データ記憶装置及びその製造方法 |
JP2010157310A (ja) * | 2008-12-23 | 2010-07-15 | Nexsan Technologies Ltd | データ記憶装置 |
JP2018054542A (ja) * | 2016-09-30 | 2018-04-05 | シャープ株式会社 | 移動体 |
-
1989
- 1989-06-02 JP JP6519389U patent/JPH033779U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010153020A (ja) * | 2008-12-23 | 2010-07-08 | Nexsan Technologies Ltd | データ記憶装置及びその製造方法 |
JP2010157310A (ja) * | 2008-12-23 | 2010-07-15 | Nexsan Technologies Ltd | データ記憶装置 |
JP2018054542A (ja) * | 2016-09-30 | 2018-04-05 | シャープ株式会社 | 移動体 |
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