JPH0337577B2 - - Google Patents
Info
- Publication number
- JPH0337577B2 JPH0337577B2 JP58234949A JP23494983A JPH0337577B2 JP H0337577 B2 JPH0337577 B2 JP H0337577B2 JP 58234949 A JP58234949 A JP 58234949A JP 23494983 A JP23494983 A JP 23494983A JP H0337577 B2 JPH0337577 B2 JP H0337577B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- butyl
- electromagnetic wave
- wave shielding
- hydroxyphenyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 claims description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 10
- 239000003963 antioxidant agent Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229920000098 polyolefin Polymers 0.000 claims description 8
- 230000003078 antioxidant effect Effects 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 5
- 229910052717 sulfur Inorganic materials 0.000 claims description 5
- 239000011593 sulfur Substances 0.000 claims description 5
- DXGIRFAFSFKYCF-UHFFFAOYSA-N propanehydrazide Chemical compound CCC(=O)NN DXGIRFAFSFKYCF-UHFFFAOYSA-N 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 6
- 239000005977 Ethylene Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 5
- -1 ethylene, propylene, 1-butene Chemical class 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000008188 pellet Substances 0.000 description 4
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- ROHFBIREHKPELA-UHFFFAOYSA-N 2-[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]prop-2-enoic acid;methane Chemical compound C.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O ROHFBIREHKPELA-UHFFFAOYSA-N 0.000 description 3
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- DOIRQSBPFJWKBE-UHFFFAOYSA-N phthalic acid di-n-butyl ester Natural products CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 3
- 239000012254 powdered material Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000002656 Distearyl thiodipropionate Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 2
- 235000019305 distearyl thiodipropionate Nutrition 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000000344 soap Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- SNTWKPAKVQFCCF-UHFFFAOYSA-N 2,3-dihydro-1h-triazole Chemical compound N1NC=CN1 SNTWKPAKVQFCCF-UHFFFAOYSA-N 0.000 description 1
- GQYJUNDOTRSSIO-UHFFFAOYSA-N 2-methylidenepentadecanethioic s-acid Chemical compound CCCCCCCCCCCCCC(=C)C(S)=O GQYJUNDOTRSSIO-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- ODJQKYXPKWQWNK-UHFFFAOYSA-N 3,3'-Thiobispropanoic acid Chemical compound OC(=O)CCSCCC(O)=O ODJQKYXPKWQWNK-UHFFFAOYSA-N 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003490 Thiodipropionic acid Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- RRZCFXQTVDJDGF-UHFFFAOYSA-N dodecyl 3-(3-octadecoxy-3-oxopropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC RRZCFXQTVDJDGF-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- 235000019303 thiodipropionic acid Nutrition 0.000 description 1
- 150000003852 triazoles Chemical group 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
本発明は電磁波遮蔽性に優れたポリオレフイン
組成物に関する。
近年、産業の高度化および家庭生活の高水準化
にともなつて電波および磁気波の放射源が増大し
ている。このために電波および磁気波を遮蔽する
各種の方法が提案されている。例えば、合成樹脂
にカーボン粉末および/またはアルミニウム粉末
のような添加剤を比較的多量に混合したものが遮
蔽材料として提案されている。
しかしながら、このなかでも、アルミニウム粉
末などの金属フイラーを充填した電磁波遮蔽材料
は、その製造初期には電磁波遮蔽効果が発揮され
るものの使用時間経過とともに電磁波遮蔽効果が
低下し、その傾向は特に高温時の使用において著
しいという欠点があつた。
本発明は、従来知られている電磁波遮蔽性樹脂
組成物の、このような欠点を改良する目的でなさ
れたものであつて、(1)ポリオレフインに、(2)アル
ミニウム金属またはアルミニウム合金の粉末状
物、繊維状物もしくはフレーク状物1〜60重量
%、(3)N,N′−ビス−β−(3,5−ジ−t−ブ
チル−4−ヒドロキシフエニル)プロピオニルヒ
ドラジンまたは3−サリシロイルアミド−1,
2,4−トリアゾール0.01〜2重量%、および(4)
フエノール系および/または硫黄系の酸化防止剤
0.01〜2重量%とを含有することを特徴とする電
磁波遮蔽性ポリオレフイン組成物。
本発明におけるポリオレフインとしては、例え
ばエチレン、プロピレン、1−ブテン、1−ペン
テン、3メチル−1−ペンテンなどの単独重合
体、エチレンとプロピレンとの共重合体、エチレ
ンおよび/またはプロピレンと炭素数が多くとも
7個の他のα−オレフインとの共重合体並びにエ
チレンと酢酸ビニル、アクリル酸エステルおよび
メタクリル酸エステルのようなビニル化合物との
共重合体などのポリオレフインなどがあげられ
る。これらのうちでは、低密度または高密度のポ
リエチレン、ポリプロピレン、エチレンとプロピ
レンとの共重合体またはエチレンもしくはプロピ
レンと他のα−オレフインとの共重合体などが望
ましい。
本発明におけるアルミニウム金属またはアルミ
ニウム合金の粉末状物、繊維状物もしくはフレー
ク状物のうち、粉末状物としては、平均の大きさ
が一般には20〜250メツシユのものがあげられる。
また、繊維状物としては、その平均径が一般には
2〜200μ、長さが10mm以下のものがあげられる。
さらに、フレーク状物としては、断面が一般には
0.1×0.1mmから5×5mmを有する円形、正方形、
長方形、多角形など任意の形状のものがあげられ
るが、その厚さは0.1mm以下のものが望ましい。
これら粉末状物、繊維状物もしくはフレーク状物
は、単独で使用してもよいが、二種以上を併用す
ることもできる。また、アルミニウムの合金中の
アルミニウムの含有量は、通常80重量%以上のも
のが用いられる。このアルミニウム合金は、通常
マグネシウム、鉄、マンガン、銅、けい素、亜
鉛、クロミウム等を含む。
本発明における電磁波遮蔽性低下防止剤は、
N,N′−ビス−β−(3,5−ジ−t−ブチル−
4−ヒドロキシフエニル)プロピオニルヒドラジ
ンまたは3−サリシロイルアミド−1,2,4−
トリアゾールである。
本発明におけるフエノール系酸化防止剤として
は、フエノール性OHのO−位に第三ブチル基な
どの大きな基を導入してフエノール性OHの性質
を消失したいわゆるヒンダードフエノール系化合
物があげられる。例えば、2,6−ジ−t−ブチ
ル−4−メチルフエノール、オクタデシル−3−
(3,5−ジ−t−ブチル−4−ヒドロキシフエ
ニル)プロピオネート、テトラキス〔メチレン−
3−(3,5−ジ−t−ブチル−4−ヒドロキシ
フエニル)プロピオネート〕メタン、1,3,5
−トリス(3−ヒドロキシ−2,6−ジメチル−
4−t−ブチルベンジル)イソシアヌレート、
1,3,5−トリメチル−2,4,6−トリス
(3,5−ジ−t−ブチル−4−ヒドロキシベン
ジル)ベンゼン、4,4′−チオビス−(3−メチ
ル−6−t−ブチルフエノール)、1,1,3−
トリス(2−メチル−4−ヒドロキシ−5−t−
ブチルフエニル)ブタン、トリス(3,5−ジ−
t−ブチル−4−ヒドロキシベンジル)イソシア
ヌレートなどがあげられる。これらのうちでは
2,6−ジ−t−ブチル−4−メチルフエノー
ル、オクタデシル−3−(3,5−ジ−t−ブチ
ル−4−ヒドロキシフエニル)プロピオネート、
テトラキス〔メチレン−3(3,5−ジ−t−ブ
チル−4−ヒドロキシフエニル)プロピオネー
ト〕メタンなどが好ましい。
また、硫黄系の酸化防止剤としては、チオジプ
ロピオン酸のエステル、例えばジラウリルチオジ
プロピオネート、ジステアリルチオジプロピオネ
ート、ラウリルステアリルチオジプロピオネー
ト、ジミリスチルチオジプロピオネート、テトラ
キス−(メチレン−3−ドデシルチオプロピオネ
ート)メタンなどがあげられる。
本発明における電磁波遮蔽性ポリオレフイン組
成物中のアルミニウム金属またはアルミニウム合
金の粉末状物、繊維状物もしくはフレーク状物の
含有量は、1〜60重量%であり、また電磁波遮蔽
性低下防止剤は0.01〜2重量%、好ましくは0.1
〜0.5重量%である。また、組成物中のフエノー
ル系および/または硫黄系の酸化防止剤は0.01〜
2重量%、好ましくは0.03〜0.5重量%である。
本発明によつて得られる樹脂組成物中のアルミ
ニウム金属またはアルミニウム合金の粉末状物、
繊維状物もしくはフレーク状物が1重量%未満で
は電磁波の遮蔽効果がなく、一方60重量%を越え
る場合は、組成物の成形性および機械的強度が低
下するので好ましくない。また、置換ヒドラジン
または置換アミドトリアゾール並びにフエノール
系および/または硫黄系の酸化防止剤がそれぞれ
0.01重量%未満では電磁波遮蔽性低下を防止する
効果がなく、一方2重量部を越える場合は、電磁
波遮蔽性低下防止効果はそれ以上に改善されず、
逆に成形時における金型の汚れや成形物表面への
プレートアウトが著しくなるために好ましくな
い。
本発明の組成物は、前述の各成分を配合して均
一に混合することによつて得られる。例えば、前
述の各成分をヘンシエルミキサー、タンブラーブ
レンダーなどでドライブレンドした後、スクリユ
ー式押出機、バンバリーミキサー、ニーダー、ロ
ールなどで溶融混練することによつて均一な組成
物が得られる。この際、各成分の混合はマスター
バツチ方式よる添加あるいは各成分をあらかじめ
練込みペレツト状としたものを原料として使用す
ることが効果的である。また、溶融混練して得ら
れる組成物は、一般にはペレツト状に成形した
後、各種の成形に供される。成形法としては、射
出成形法、圧縮成形法、押出成形法などがあげら
れる。さらには、スタンピング法、押出シートを
用いての圧縮成形法、真空成形法のごとき熱可塑
性樹脂の分野において一般に使われている成形法
も適用できる。
なお、上記の組成物を製造する際には、熱可塑
性樹脂に一般に用いられている紫外線吸収剤、充
填剤、滑剤、造核剤、金属石けん、難燃剤、帯電
防止剤、顔料などの各種添加剤をさらに添加して
もよい。
以上、本発明の組成物は、電磁波遮蔽性に優れ
るのみならずその遮蔽性の経時低下の防止効果も
良好なものであり、軽量で任意の形状に加工や成
形が可能である。従つて、フアクシミリ、プリン
ター、ワードプロセツサーなどの事務機器やテレ
ビ、ビデオ、電子計算機などの電子機器のハウジ
ング材およびそれらの内部物品などに好適であ
る。
以下、実施例によつて本発明をさらに詳細に説
明する。なお、実施例および比較例における%は
重量を示し、電磁波遮蔽性の低下防止効果の評価
は、体積固有抵抗の経時測定で行つた。体積固有
抵抗試験は、温度23℃、湿度60%の雰囲気で厚さ
2mmの試験片の抵抗を測定し、次式によつて算出
した。
体積固有抵抗(Ω・cm)=R×T×W/L
ここで、Rは実測抵抗値(Ω)、Tは試験片の
厚さ(cm)、Wは試験片の巾(cm)およびLは電
極間の距離(cm)を表わす。
実施例1〜6 比較例1
メルトフローインデツクス(JIS K6758による
温度230℃、荷重2.16Kgの条件で測定)20g/10
分のプロピレン−エチレンブロツクコポリマー
(エチレン合有量7重量%)に、表−1に示す割
合のアルミニウム合金繊維(以下Al合金繊維と
いう)、N,N′−ビス−β−(3,5−ジ−t−
ブチル−4−ヒドロキシフエニル)プロピオニル
ヒドラジン〔以下電磁波遮蔽性低下防止剤(A)とい
う〕、3−サリシロイルアミド−1,2,4−ト
リアゾール〔以下電磁波遮蔽性低下防止剤(B)とい
う〕、2,6−ジ−t−ブチル−4−メチルフエ
ノール〔以下酸化防止剤(A)という〕、テトラキス
〔メチレン−3−(3,5−ジ−t−ブチル−4−
ヒドロキシフエニル)プロピオネート〕メタン
〔以下酸化防止剤(B)という〕、ジステアリルチオジ
プロピオネート〔以下酸化防止剤(C)という〕およ
び金属石けん(ステアリン酸カルシウム)0.03%
とを配合し、ヘンシエルミキサーでドライブレン
ドを行い、次いで混合物を200℃の押出機で溶融
混練してペレツト化した。このペレツトを用いて
射出成形により厚さ2mmのシートを成形した。こ
のシートを試験片として加熱処理前および150℃
空気オーブン中で加熱処理したものの体積固有抵
抗の経時変化の測定並びに耐熱寿命(変色迄の日
数)を観察し、その結果を表−1に示した。
The present invention relates to a polyolefin composition with excellent electromagnetic wave shielding properties. BACKGROUND ART In recent years, with the advancement of industry and higher standard of household life, the number of sources of radiation of radio waves and magnetic waves has increased. For this purpose, various methods of shielding radio waves and magnetic waves have been proposed. For example, synthetic resins mixed with relatively large amounts of additives such as carbon powder and/or aluminum powder have been proposed as shielding materials. However, among these materials, electromagnetic wave shielding materials filled with metal fillers such as aluminum powder exhibit an electromagnetic wave shielding effect in the initial stage of manufacture, but the electromagnetic wave shielding effect decreases over time, especially at high temperatures. There were significant drawbacks in the use of The present invention was made for the purpose of improving such drawbacks of conventionally known electromagnetic wave shielding resin compositions, and consists of (1) polyolefin and (2) powdered aluminum metal or aluminum alloy. (3)N,N'-bis-β-(3,5-di-t-butyl-4-hydroxyphenyl)propionylhydrazine or 3-sali Shiloylamide-1,
0.01-2% by weight of 2,4-triazole, and (4)
Phenolic and/or sulfur-based antioxidants
An electromagnetic wave shielding polyolefin composition characterized by containing 0.01 to 2% by weight. Examples of the polyolefin in the present invention include homopolymers such as ethylene, propylene, 1-butene, 1-pentene, and 3-methyl-1-pentene, copolymers of ethylene and propylene, and ethylene and/or propylene with carbon numbers. Mention may be made of polyolefins such as copolymers with at most seven other alpha-olefins and copolymers of ethylene with vinyl compounds such as vinyl acetate, acrylic esters and methacrylic esters. Among these, low-density or high-density polyethylene, polypropylene, copolymers of ethylene and propylene, or copolymers of ethylene or propylene with other α-olefins are preferred. Among the powdered, fibrous or flaky materials of aluminum metal or aluminum alloy in the present invention, the powdered materials generally have an average size of 20 to 250 meshes.
In addition, the fibrous material generally has an average diameter of 2 to 200 microns and a length of 10 mm or less.
Furthermore, as a flake-like material, the cross section is generally
Round, square, with dimensions from 0.1×0.1mm to 5×5mm
It can be of any shape, such as rectangular or polygonal, but preferably has a thickness of 0.1 mm or less.
These powdered materials, fibrous materials, and flaky materials may be used alone, but two or more types can also be used in combination. Further, the aluminum content in the aluminum alloy is usually 80% by weight or more. This aluminum alloy typically contains magnesium, iron, manganese, copper, silicon, zinc, chromium, etc. The electromagnetic wave shielding property deterioration prevention agent in the present invention is
N,N'-bis-β-(3,5-di-t-butyl-
4-hydroxyphenyl)propionylhydrazine or 3-salicyloylamide-1,2,4-
It is a triazole. Examples of the phenolic antioxidant in the present invention include so-called hindered phenolic compounds in which a large group such as a tert-butyl group is introduced into the O-position of the phenolic OH to eliminate the properties of the phenolic OH. For example, 2,6-di-t-butyl-4-methylphenol, octadecyl-3-
(3,5-di-t-butyl-4-hydroxyphenyl)propionate, tetrakis[methylene-
3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate]methane, 1,3,5
-Tris(3-hydroxy-2,6-dimethyl-
4-t-butylbenzyl) isocyanurate,
1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, 4,4'-thiobis-(3-methyl-6-t-butyl phenol), 1,1,3-
Tris(2-methyl-4-hydroxy-5-t-
butylphenyl)butane, tris(3,5-di-
Examples include t-butyl-4-hydroxybenzyl) isocyanurate. Among these, 2,6-di-t-butyl-4-methylphenol, octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate,
Tetrakis[methylene-3(3,5-di-t-butyl-4-hydroxyphenyl)propionate]methane and the like are preferred. Examples of sulfur-based antioxidants include esters of thiodipropionic acid, such as dilaurylthiodipropionate, distearylthiodipropionate, laurylstearylthiodipropionate, dimyristylthiodipropionate, and tetrakis-( Examples include methylene-3-dodecylthiopropionate) methane. The content of aluminum metal or aluminum alloy powder, fibers, or flakes in the electromagnetic shielding polyolefin composition of the present invention is 1 to 60% by weight, and the electromagnetic shielding property deterioration prevention agent is 0.01% by weight. ~2% by weight, preferably 0.1
~0.5% by weight. In addition, the phenolic and/or sulfur-based antioxidant in the composition is 0.01~
2% by weight, preferably 0.03-0.5% by weight. Powdered material of aluminum metal or aluminum alloy in the resin composition obtained by the present invention,
If the content of the fibrous or flake-like material is less than 1% by weight, there will be no shielding effect against electromagnetic waves, while if it exceeds 60% by weight, the moldability and mechanical strength of the composition will deteriorate, which is not preferred. In addition, substituted hydrazines or substituted amidotriazoles and phenolic and/or sulfur-based antioxidants, respectively.
If it is less than 0.01% by weight, it will not be effective in preventing the deterioration of electromagnetic wave shielding property, while if it exceeds 2 parts by weight, the effect of preventing deterioration in electromagnetic wave shielding property will not be further improved.
On the other hand, this is not preferable because it causes contamination of the mold during molding and significant plate-out on the surface of the molded product. The composition of the present invention can be obtained by blending and uniformly mixing the above-mentioned components. For example, a uniform composition can be obtained by dry blending the above-mentioned components using a Henschel mixer, tumbler blender, etc., and then melt-kneading them using a screw extruder, Banbury mixer, kneader, roll, etc. At this time, it is effective to mix each component by adding by a master batch method or by kneading each component in advance and using a pellet form as a raw material. Furthermore, the composition obtained by melt-kneading is generally formed into pellets and then subjected to various molding processes. Examples of the molding method include injection molding, compression molding, and extrusion molding. Furthermore, molding methods commonly used in the field of thermoplastic resins such as stamping, compression molding using an extruded sheet, and vacuum molding can also be applied. In addition, when manufacturing the above composition, various additives such as ultraviolet absorbers, fillers, lubricants, nucleating agents, metal soaps, flame retardants, antistatic agents, pigments, etc. commonly used in thermoplastic resins are added. Additional agents may be added. As described above, the composition of the present invention not only has excellent electromagnetic wave shielding properties, but also has a good effect of preventing deterioration of the shielding properties over time, is lightweight, and can be processed and molded into any shape. Therefore, it is suitable for housing materials of office equipment such as facsimile machines, printers, and word processors, and electronic equipment such as televisions, video cameras, and electronic computers, as well as internal articles thereof. Hereinafter, the present invention will be explained in more detail with reference to Examples. Note that % in Examples and Comparative Examples indicates weight, and the effect of preventing a decrease in electromagnetic wave shielding property was evaluated by measuring the volume resistivity over time. In the volume resistivity test, the resistance of a 2 mm thick test piece was measured in an atmosphere with a temperature of 23° C. and a humidity of 60%, and the resistance was calculated using the following formula. Volume resistivity (Ω・cm)=R×T×W/L Here, R is the measured resistance value (Ω), T is the thickness of the test piece (cm), W is the width of the test piece (cm), and L represents the distance (cm) between the electrodes. Examples 1 to 6 Comparative Example 1 Melt flow index (measured under the conditions of temperature 230℃ and load 2.16Kg according to JIS K6758) 20g/10
of propylene-ethylene block copolymer (ethylene content: 7% by weight), aluminum alloy fibers (hereinafter referred to as Al alloy fibers) in the proportions shown in Table 1, N,N'-bis-β-(3,5- G-t-
butyl-4-hydroxyphenyl)propionylhydrazine [hereinafter referred to as electromagnetic shielding property deterioration inhibitor (A)], 3-salicyloylamide-1,2,4-triazole [hereinafter referred to as electromagnetic shielding property deterioration inhibitor (B)] ], 2,6-di-t-butyl-4-methylphenol [hereinafter referred to as antioxidant (A)], tetrakis[methylene-3-(3,5-di-t-butyl-4-
hydroxyphenyl) propionate] methane [hereinafter referred to as antioxidant (B)], distearyl thiodipropionate [hereinafter referred to as antioxidant (C)], and metal soap (calcium stearate) 0.03%
were blended and dry blended using a Henschel mixer, and then the mixture was melt-kneaded using an extruder at 200°C to form pellets. Using this pellet, a sheet with a thickness of 2 mm was molded by injection molding. This sheet was used as a test piece before heat treatment and at 150℃.
After heat treatment in an air oven, the changes in volume resistivity over time and the heat resistance life (number of days until discoloration) were observed, and the results are shown in Table 1.
【表】【table】
【表】
実施例7〜9 比較例2
実施例1において、プロピレン−エチレンブロ
ツクコポリマーに代りメルトインデツクス(JIS
K6760による温度190℃、荷重2.16Kgの条件で測
定)20g/10分、密度0.960g/cm3の高密度ポリ
エチレンを用いて、Al合金繊維、電磁波遮蔽性
低下防止剤および酸化防止剤とを表−2に示す割
合で配合した以外は同様にして体積固有抵抗を測
定し、その結果を表−2に示した。[Table] Examples 7 to 9 Comparative Example 2 In Example 1, melt index (JIS
Using high-density polyethylene with a density of 0.960 g/cm 3 (measured using K6760 at a temperature of 190°C and a load of 2.16 kg) at 20 g/10 minutes, Al alloy fibers, an electromagnetic shielding property deterioration inhibitor, and an antioxidant were prepared. The volume resistivity was measured in the same manner except that the ratio shown in Table 2 was used, and the results are shown in Table 2.
Claims (1)
たはアルミニウム合金の粉末状物、繊維状物もし
くはフレーク状物1〜60重量%、(3)N,N′−ビ
ス−β−(3,5−ジ−t−ブチル−4−ヒドロ
キシフエニル)プロピオニルヒドラジンまたは3
−サリシロイルアミド−1,2,4−トリアゾー
ル0.01〜2重量%、および(4)フエノール系およ
び/または硫黄系の酸化防止剤0.01〜2重量%と
を含有することを特徴とする電磁波遮蔽性ポリオ
レフイン組成物。1 (1) Polyolefin, (2) 1 to 60% by weight of aluminum metal or aluminum alloy powder, fibers, or flakes, (3) N,N'-bis-β-(3,5- di-t-butyl-4-hydroxyphenyl)propionylhydrazine or 3
- electromagnetic wave shielding characterized by containing 0.01 to 2% by weight of salicilloylamide-1,2,4-triazole, and (4) 0.01 to 2% by weight of a phenolic and/or sulfur-based antioxidant. polyolefin composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23494983A JPS60127366A (en) | 1983-12-15 | 1983-12-15 | Thermoplastic resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23494983A JPS60127366A (en) | 1983-12-15 | 1983-12-15 | Thermoplastic resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60127366A JPS60127366A (en) | 1985-07-08 |
JPH0337577B2 true JPH0337577B2 (en) | 1991-06-06 |
Family
ID=16978781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23494983A Granted JPS60127366A (en) | 1983-12-15 | 1983-12-15 | Thermoplastic resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60127366A (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6377971A (en) * | 1986-09-22 | 1988-04-08 | Idemitsu Petrochem Co Ltd | Thermoplastic resin composition containing stainless steel fiber |
JPS63238162A (en) * | 1987-03-27 | 1988-10-04 | Toshiba Chem Corp | Electrically conductive resin composition and molded article thereof |
JPS63238163A (en) * | 1987-03-27 | 1988-10-04 | Toshiba Chem Corp | Electrically conductive resin composition |
JPS63235368A (en) * | 1987-03-25 | 1988-09-30 | Toshiba Chem Corp | Electrically conductive resin composition and molded product thereof |
FR2736647B1 (en) * | 1988-11-17 | 1998-05-15 | Alsthom Cge Alcatel | POLYMERIC MATERIAL FOR THE ABSORPTION OF ELECTROMAGNETIC WAVES |
JPH02178356A (en) * | 1988-12-29 | 1990-07-11 | Kawasaki Techno Res Kk | Colored material for shielding electromagnetic wave |
US5270364A (en) * | 1991-09-24 | 1993-12-14 | Chomerics, Inc. | Corrosion resistant metallic fillers and compositions containing same |
JPH05109516A (en) * | 1991-10-18 | 1993-04-30 | I C I Japan Kk | Composition for formation of bonded magnet, and bonded magnet |
AU4247893A (en) * | 1992-05-13 | 1993-12-13 | Chomerics Inc. | Injection co-molded EMI/RFI shielding gasket |
US7852269B2 (en) | 2006-08-09 | 2010-12-14 | Daido Tokushuko Kabushiki Kaisha | Ultrawideband communication antenna |
JP2008236705A (en) * | 2006-08-09 | 2008-10-02 | Daido Steel Co Ltd | Super-broadband communication antenna |
WO2017082231A1 (en) * | 2015-11-12 | 2017-05-18 | ユニチカ株式会社 | Polyamide resin composition and molded article obtained by molding same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4974690A (en) * | 1972-11-21 | 1974-07-18 | ||
JPS5056383A (en) * | 1973-09-20 | 1975-05-17 | ||
JPS5341347A (en) * | 1976-09-29 | 1978-04-14 | Ube Ind Ltd | Polyolefin composition |
-
1983
- 1983-12-15 JP JP23494983A patent/JPS60127366A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4974690A (en) * | 1972-11-21 | 1974-07-18 | ||
JPS5056383A (en) * | 1973-09-20 | 1975-05-17 | ||
JPS5341347A (en) * | 1976-09-29 | 1978-04-14 | Ube Ind Ltd | Polyolefin composition |
Also Published As
Publication number | Publication date |
---|---|
JPS60127366A (en) | 1985-07-08 |
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