JPH033743U - - Google Patents
Info
- Publication number
- JPH033743U JPH033743U JP6375489U JP6375489U JPH033743U JP H033743 U JPH033743 U JP H033743U JP 6375489 U JP6375489 U JP 6375489U JP 6375489 U JP6375489 U JP 6375489U JP H033743 U JPH033743 U JP H033743U
- Authority
- JP
- Japan
- Prior art keywords
- suction
- wafer
- suction surface
- handling device
- wafer handling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6375489U JPH033743U (uk) | 1989-05-31 | 1989-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6375489U JPH033743U (uk) | 1989-05-31 | 1989-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH033743U true JPH033743U (uk) | 1991-01-16 |
Family
ID=31594083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6375489U Pending JPH033743U (uk) | 1989-05-31 | 1989-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033743U (uk) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101394387B1 (ko) * | 2007-06-25 | 2014-05-14 | 세메스 주식회사 | 기판 로딩 유닛 및 이를 갖는 다이 본딩 장치 |
| CN114260670A (zh) * | 2021-12-13 | 2022-04-01 | 奥美森智能装备股份有限公司 | 一种自动插弯头机 |
| CN114260688A (zh) * | 2021-12-13 | 2022-04-01 | 奥美森智能装备股份有限公司 | 一种真空弯头匣 |
-
1989
- 1989-05-31 JP JP6375489U patent/JPH033743U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101394387B1 (ko) * | 2007-06-25 | 2014-05-14 | 세메스 주식회사 | 기판 로딩 유닛 및 이를 갖는 다이 본딩 장치 |
| CN114260670A (zh) * | 2021-12-13 | 2022-04-01 | 奥美森智能装备股份有限公司 | 一种自动插弯头机 |
| CN114260688A (zh) * | 2021-12-13 | 2022-04-01 | 奥美森智能装备股份有限公司 | 一种真空弯头匣 |