JPH033742U - - Google Patents
Info
- Publication number
- JPH033742U JPH033742U JP6452689U JP6452689U JPH033742U JP H033742 U JPH033742 U JP H033742U JP 6452689 U JP6452689 U JP 6452689U JP 6452689 U JP6452689 U JP 6452689U JP H033742 U JPH033742 U JP H033742U
- Authority
- JP
- Japan
- Prior art keywords
- thermocompression bonding
- semiconductor element
- flat surface
- tape carrier
- outer lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000002470 thermal conductor Substances 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6452689U JPH033742U (zh) | 1989-06-01 | 1989-06-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6452689U JPH033742U (zh) | 1989-06-01 | 1989-06-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH033742U true JPH033742U (zh) | 1991-01-16 |
Family
ID=31595553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6452689U Pending JPH033742U (zh) | 1989-06-01 | 1989-06-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH033742U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54137411U (zh) * | 1978-03-15 | 1979-09-22 |
-
1989
- 1989-06-01 JP JP6452689U patent/JPH033742U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54137411U (zh) * | 1978-03-15 | 1979-09-22 |