JPH0337236Y2 - - Google Patents

Info

Publication number

JPH0337236Y2

JPH0337236Y2 JP11715985U JP11715985U JPH0337236Y2 JP H0337236 Y2 JPH0337236 Y2 JP H0337236Y2 JP 11715985 U JP11715985 U JP 11715985U JP 11715985 U JP11715985 U JP 11715985U JP H0337236 Y2 JPH0337236 Y2 JP H0337236Y2

Authority

JP

Japan

Prior art keywords

base

brazing

semiconductor cooler

brazing material

flowing down

Prior art date

1985-07-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 238000005219 brazing Methods 0.000 claims description 30
• 239000004065 semiconductor Substances 0.000 claims description 21
• 229910052782 aluminium Inorganic materials 0.000 claims description 7
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
• 229910052751 metal Inorganic materials 0.000 claims description 7
• 239000002184 metal Substances 0.000 claims description 7
• 229910000679 solder Inorganic materials 0.000 claims 1
• 239000000463 material Substances 0.000 description 15
• 239000000945 filler Substances 0.000 description 4
• 230000017525 heat dissipation Effects 0.000 description 2
• QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1