JPH0336729A - Drying method and device therefor - Google Patents

Drying method and device therefor

Info

Publication number
JPH0336729A
JPH0336729A JP17163389A JP17163389A JPH0336729A JP H0336729 A JPH0336729 A JP H0336729A JP 17163389 A JP17163389 A JP 17163389A JP 17163389 A JP17163389 A JP 17163389A JP H0336729 A JPH0336729 A JP H0336729A
Authority
JP
Japan
Prior art keywords
processing tank
treated
valve
drying
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17163389A
Other languages
Japanese (ja)
Inventor
Sadao Mizuguchi
水口 貞夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HANAMI KAGAKU KK
Original Assignee
HANAMI KAGAKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANAMI KAGAKU KK filed Critical HANAMI KAGAKU KK
Priority to JP17163389A priority Critical patent/JPH0336729A/en
Publication of JPH0336729A publication Critical patent/JPH0336729A/en
Pending legal-status Critical Current

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  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To enable an object H to be treated such as an washed IC chip to be dried securely and rapidly by washing the object to be treated, setting the inside of a tank for treating the object to be treated to approximately a vacuum state, and then dehumidified circulating air into the treatment tank. CONSTITUTION:After washing an object H to be treated, this object H is stored in a treatment tank S in closed state. Then, by operating a vacuum pump 1 and opening a valve V1, the inside of the treatment tank S is set to nearly vacuum state. Then, a dehumidifier 3 and a fan 4 are operated and valves V2 and V3 are opened, and a dehumidified air is allowed to circulate within the treatment tank S, thus enabling the object H to be treated to be dried forcedly. After drying the object H to be treated, the valve V4 is opened and external air is introduced into the treatment tank from an air vent, thus enabling the object H to be treated to be taken out.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、例えば、洗浄されたICチップの如き被処理
物を、確実且つ迅速に乾燥せしめるための乾燥方法及び
その乾燥装置に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a drying method and a drying apparatus for reliably and quickly drying a processed object such as a cleaned IC chip.

(従来の技術) 従来、半導体等の製造時に於いて、ICチップ等の被処
理物を超純水等で洗浄して、チップの回路パターン上の
汚れ等を洗浄した後、フロンガス等を使用してこれを乾
燥せしめている。
(Prior art) Conventionally, during the manufacture of semiconductors, etc., objects to be processed such as IC chips are cleaned with ultrapure water, etc. to remove dirt on the circuit patterns of the chips, and then chlorofluorocarbon gas, etc. is used. This is then dried.

(発明が解決しようとする課題) ところが、最近では、フロンガス等の使用による大気汚
染(オゾン層の破壊)が世界的な問題となっており、フ
ロンガス等の使用が全面的に禁止される傾向にある。
(Problem to be solved by the invention) However, recently, air pollution (depletion of the ozone layer) due to the use of fluorocarbon gases has become a worldwide problem, and there is a trend toward a complete ban on the use of fluorocarbon gases. be.

このため、例えば、ICチップ等の被処理物の洗浄後の
乾燥処理を、フロンガス等を使用することなく、これと
同程度以上の処理が行えるようにし、しかも、乾燥処理
にかかるコスト等も十分に抑制できるような手段の開発
が急務となっている。
For this reason, for example, it is possible to perform a drying process after washing an object to be processed, such as an IC chip, without using fluorocarbon gas or the like, and to achieve the same or higher level of drying process, while reducing the cost of the drying process. There is an urgent need to develop methods that can suppress the

(課題を解決するための手段) そこで、本発明の乾燥方法にあっては、適宜被処理物H
の洗浄後に、この被処理物Hを処理槽S内に密閉する。
(Means for Solving the Problems) Therefore, in the drying method of the present invention,
After washing, the object to be processed H is sealed in the processing tank S.

そして、この処理槽S内を略真空状態とする。次に、処
理槽S内に除湿空気を循環せしめて、被処理物Hを強制
的に乾燥せしめる手段を採用することによって、洗浄さ
れたICチップの如き被処理物Hの乾燥処理を、確実且
つ迅速に行えるようにし、被処理物Hの乾燥状態も良好
で、しかも、乾燥処理にかかるコスト等も十分抑制でき
るようにし、前述の如き課題が解決できるようにした。
Then, the inside of this processing tank S is brought into a substantially vacuum state. Next, by circulating dehumidified air in the processing tank S and forcibly drying the object H, the object H such as a cleaned IC chip can be dried reliably. The process can be carried out quickly, the object to be processed H can be dried in a good condition, and the cost of the drying process can be sufficiently suppressed, thereby solving the above-mentioned problems.

また、本発明の乾燥装置にあっては、適宜被処理物Hを
密閉状に収納可能な処理槽Sを形成する。
In addition, in the drying apparatus of the present invention, a processing tank S is formed in which the object to be processed H can be appropriately accommodated in a sealed manner.

そして、この処理槽SにバルブV1を介して真空ポンプ
1を接続して、処理槽S内を略真空可能に形成する。更
に、処理槽SにパルプV2.V3を介して除湿機3及び
ファン4を接続せしめて、処理槽S内に除湿空気を循環
せしめられるよう構成する手段を採用することによって
、前述の如き乾燥方法の実施に際して最適となる装置の
提供が図れるようにした。
A vacuum pump 1 is connected to the processing tank S via a valve V1, so that the inside of the processing tank S can be substantially evacuated. Furthermore, pulp V2. To provide an apparatus that is optimal for carrying out the above-described drying method by connecting a dehumidifier 3 and a fan 4 via V3 and employing a means configured to circulate dehumidified air within the processing tank S. We made it possible to achieve this.

(作用) しかして、乾燥方法にあっては、被処理物Hは処理槽S
内に密閉状態に内装され、真空ポンプ1、タンク2によ
り、この処理槽S内を略真空状態にすると、被処理物H
の狭隙部分等に付着している水滴等も被処理物8表面に
集り、これら水滴等は、除湿機3、ファン4によって処
理槽S内を循環している除湿空気中に蒸発し、被処理物
Hに付着した水滴等が確実に無くなって乾燥状態となる
(Function) However, in the drying method, the material to be processed H is in the processing tank S.
When the inside of this processing tank S is brought into a substantially vacuum state using the vacuum pump 1 and the tank 2, the workpiece H
Water droplets adhering to narrow gaps etc. also collect on the surface of the object to be treated 8, and these water droplets are evaporated into the dehumidified air circulating inside the treatment tank S by the dehumidifier 3 and fan 4. Water droplets etc. adhering to the processed material H are reliably removed, resulting in a dry state.

また、乾燥装置にあっては、処理槽Sには真空ポンプ1
が接続され、バルブv1及び真空ポンプ1の作動により
処理槽S内は略真空状態となる。
In addition, in the drying device, a vacuum pump 1 is provided in the processing tank S.
is connected, and the inside of the processing tank S is brought into a substantially vacuum state by the operation of the valve v1 and the vacuum pump 1.

そして、処理槽Sには除湿機3及びファン4が接続され
、パルプV2.V3、除湿機3及びファン4の作動によ
り処理Is内には除湿空気が強制的に循環するようにな
る。
A dehumidifier 3 and a fan 4 are connected to the processing tank S, and the pulp V2. By operating V3, the dehumidifier 3, and the fan 4, dehumidified air is forced to circulate within the processing Is.

(実施例) 以下、本発明を図示例について説明する。(Example) Hereinafter, the present invention will be explained with reference to illustrated examples.

先ず、本発明の乾燥装置は、例えば、ICチップやその
他の適宜被処理物Hを密閉状に収納可能に形成される処
理槽Sと、この処理槽Sに接続される真空ポンプ1と、
処理槽Sに接続される除湿機3と、処理槽Sに接続され
るエアー抜き5とを備えた構成となっている。
First, the drying apparatus of the present invention includes, for example, a processing tank S formed to be able to hermetically store an IC chip or other appropriate processing object H, a vacuum pump 1 connected to this processing tank S,
It has a configuration including a dehumidifier 3 connected to the processing tank S, and an air vent 5 connected to the processing tank S.

そして、処理槽Sは、適宜被処理物Hを出入れ自在に収
納でき、しかも、収納時にあっては、密閉状態を維持で
きるよう構成されている。尚、図示例にあっては、処理
槽Sは、上部が開放された略箱状の処理槽基体と、この
処理槽基体の上部開口部を施蓋可能な蓋体とによって構
成されているが、これに限定されることなく適宜自由に
設定できる。
The processing tank S is configured to be able to store the objects H to be processed in and out of the tank as appropriate, and to maintain a closed state during storage. In the illustrated example, the processing tank S is composed of a substantially box-shaped processing tank base with an open top and a lid that can cover the upper opening of the processing tank base. , but can be freely set as appropriate without being limited to this.

真空ポンプ1は、前記処理槽Sにバルブv1及びタンク
2を介して接続され、その作動により処理槽S内を略真
空状態にできるよう構成されている。
The vacuum pump 1 is connected to the processing tank S via a valve v1 and a tank 2, and is configured to be able to bring the inside of the processing tank S into a substantially vacuum state by its operation.

除湿機3は、処理槽Sにファン4及びバルブV2、v3
を介して接続され、バルブV2.V3の開閉操作によっ
て処理槽S内の湿った空気を除湿するよう構成されてい
る。
The dehumidifier 3 has a fan 4 and valves V2 and v3 in the processing tank S.
connected via valve V2. It is configured to dehumidify the humid air in the processing tank S by opening and closing V3.

ファン4は、除湿機3によって除湿された空気を処理槽
S内に強制的に送給すると・共に、処理槽S内の湿った
空気を除湿機3まで強制的に送給し、しかも、これらを
連続的に循環して行えるよう構成されている。
The fan 4 forcibly feeds the air dehumidified by the dehumidifier 3 into the processing tank S, and also forcibly feeds the humid air in the processing tank S to the dehumidifier 3. It is configured so that it can be cycled continuously.

エアー抜き5は、処理槽S上部にバルブv4を介して接
続され、バルブV4の開閉操作によって処理槽S内に空
気を導入できるよう構成されている。
The air vent 5 is connected to the upper part of the processing tank S via a valve v4, and is configured to introduce air into the processing tank S by opening and closing the valve V4.

ところで、処理檜Sの具体的構成、形状、寸法、材質、
真空ポンプ1及びタンク2の具体的構成、形状、寸法、
配設状態、除湿機3及びファン4の具体的構成、処理槽
Sへの取付は位置、エアー抜き5の具体的構成、処理槽
Sへの取付は位置、バルブVl、V2.V3.V4の具
体的構成、取付は位置等は図示例のもの等に限定される
ことなく適宜自由に設定できる。
By the way, the specific structure, shape, dimensions, material, and
Specific configuration, shape, and dimensions of the vacuum pump 1 and tank 2,
The installation state, the specific configuration of the dehumidifier 3 and the fan 4, the location of the installation to the processing tank S, the specific configuration of the air vent 5, the location of the installation to the processing tank S, valves Vl, V2. V3. The specific configuration, mounting position, etc. of V4 are not limited to those shown in the illustrations, and can be freely set as appropriate.

また、本発明の乾燥方法は、適宜被処理物Hの洗浄後に
、この被処理物Hを処理槽S内に密閉状態で収納する。
Further, in the drying method of the present invention, after the object to be processed H is appropriately washed, the object to be processed H is stored in the processing tank S in a sealed state.

そして、真空ポンプ1を作動すると共にバルブv1を開
いて、処理Fe3内を略真空状態とする。次に、除湿機
3及びファン4を作動すると共にバルブV2.V3を開
いて、処理槽S内に除湿空気を循環せしめて、被処理物
Hを強制的に乾燥せしめる。被処理物Hの乾燥後は、バ
ルブV4を開いてエアー抜き5から処理槽S内に外の空
気を導入して、被処理物Hを取出す。
Then, the vacuum pump 1 is operated and the valve v1 is opened to bring the interior of the treated Fe3 into a substantially vacuum state. Next, the dehumidifier 3 and fan 4 are activated, and the valve V2. V3 is opened to circulate dehumidified air in the processing tank S and forcefully dry the object H to be processed. After drying the object H, the valve V4 is opened to introduce outside air into the processing tank S from the air vent 5, and the object H is taken out.

尚、処理槽Sに、バルブを介して適宜洗浄液用のタンク
を接続すると共に、バルブを介してドレンを接続して、
処理槽S内で被処理物Hの洗浄作業が行えるよう構成し
ても良い(図示せず)。すなわち、処理槽S内を真空ポ
ンプ1によって略真空状態としてパルプV1を閉じ、前
記バルブを開いてタンク内の適宜洗浄液を処理槽S内に
入れ、この洗浄液内に被処理物Hを浸漬させて洗浄する
In addition, an appropriate tank for cleaning liquid is connected to the processing tank S via a valve, and a drain is connected via a valve.
It may be configured such that cleaning work of the object to be processed H can be performed within the processing tank S (not shown). That is, the inside of the processing tank S is brought into a substantially vacuum state by the vacuum pump 1, the pulp V1 is closed, the valve is opened, a suitable cleaning liquid in the tank is poured into the processing tank S, and the object to be processed H is immersed in this cleaning liquid. Wash.

それから、バルブを開いて処理槽S内の洗浄液をドレン
から排出する。
Then, the valve is opened and the cleaning liquid in the processing tank S is discharged from the drain.

ところで、被処理物Hとしては、IC等の超小型チップ
等の他に、適宜合成樹脂材でできているものや、適宜ゴ
ム材でできているものや、適宜金属材でできたもの等が
利用できる。
By the way, the objects to be processed H include, in addition to ultra-small chips such as ICs, objects made of synthetic resin materials, rubber materials, metal materials, etc. Available.

(発明の効果) 従って、本発明の乾燥方法は、適宜被処理物Hの洗浄後
に、被処理物Hを処理槽S内に密閉し、この処理槽S内
を略真空状態とし、次に、処理槽S内に除湿空気を循環
せしめて、被処理物Hを強制的に乾燥せしめるので、洗
浄されたICチップの如き被処理物Hの乾燥処理が、確
実且つ迅速に行え、被処理物Hの乾燥状態も良好で、し
かも、乾燥処理のコスト等も十分抑制できるようになる
(Effects of the Invention) Therefore, in the drying method of the present invention, after washing the object H as appropriate, the object H is hermetically sealed in the processing tank S, the inside of the processing tank S is brought into a substantially vacuum state, and then, Since dehumidified air is circulated in the processing tank S to forcibly dry the object H, the object H such as a cleaned IC chip can be dried reliably and quickly. The drying condition is also good, and the cost of drying treatment can be sufficiently suppressed.

すなわち、フロンガス等を使用することなく、これと同
程度以上の乾燥処理が可能となり、更に、種々の被処理
物Hの乾燥処理に適し、汎用性の優れた乾燥方法となる
That is, the drying process can be performed to the same degree or higher without using fluorocarbon gas or the like, and is suitable for drying various objects to be processed H, and is a highly versatile drying method.

特に、処理槽S内を略真空状態とし、処理槽S内に除湿
空気を循環せしめて乾燥させるので、被処理物Hを低温
状態のまま乾燥処理することができ、加熱による乾燥方
法の如く被処理物Hを変質させたり、変形させたりする
虞れが全くなく、被処理物Hにとって最良の状態で、こ
れを確実に乾燥せしめることができるようになる。
In particular, since the inside of the processing tank S is kept in a substantially vacuum state and the dehumidified air is circulated within the processing tank S for drying, the processing object H can be dried in a low-temperature state, and unlike drying methods using heating, it is possible to dry the processing object H. There is no risk of deterioration or deformation of the object H, and the object H can be reliably dried in the best condition.

更に、処理槽S内を略真空状態とするので、例えば、被
処理物Hの狭隙空間部分にある洗浄用水滴等を、狭隙空
間部分から確実に除去して乾燥させることができるよう
になると共に、処理時間の短縮化に役立つようになる。
Furthermore, since the inside of the processing tank S is kept in a substantially vacuum state, for example, water droplets for cleaning in the narrow space of the object to be processed H can be reliably removed from the narrow space and dried. This also helps shorten processing time.

すなわち、極小孔や幅の狭い溝等の狭隙空間部分に残り
易い洗浄用水滴等を確実に排除できるようになると共に
、この狭隙空間部分を確実に乾燥できるようになり、例
えば、IC等の製造時の乾燥工程に於いて不良品の発生
率を大幅に低減できるようになる。しかも、乾燥作業の
作業能率向上も大幅に図れるようになる。
In other words, it becomes possible to reliably remove cleaning water droplets that tend to remain in narrow spaces such as extremely small holes and narrow grooves, and it also becomes possible to reliably dry these narrow spaces. This makes it possible to significantly reduce the incidence of defective products during the drying process during manufacturing. Moreover, the efficiency of drying work can be greatly improved.

また、本発明の乾燥装置は、被処理物Hを密閉状に収納
可能な処理槽Sを形成し、この処理槽Sにパルプv1を
介して真空ポンプ1を接続して、処理槽S内を略真空可
能に形成し、処理槽SにパルプV2.V3を介して除湿
機3及びファン4を接続せしめて、処理槽S内に除湿空
気を循環せしめられるよう構成したので、処理槽S内に
被処理物Hを密閉状に収納でき、パルプv1及び真空ポ
ンプ1の作動により処理槽S内を略真空状態にでき、パ
ルプV2.V3、除湿機3及びファン4の作動により処
理槽S内に除湿空気を容易且つ確実に連続送給でき、狭
隙空間部分等を備えた被処理物Hの乾燥処理に最適な装
置となる。しかも、装置自体の構成が簡素で、製造し易
く、故障し難く、耐久性に優れ、安価に提供できるよう
になるー。すなわち、前述の如き乾燥方法の実施に際し
て最適な乾燥装置となる。
In addition, the drying apparatus of the present invention forms a processing tank S that can hermetically store the object to be processed H, and connects a vacuum pump 1 to this processing tank S via a pulp v1 to operate the inside of the processing tank S. The pulp V2. Since the dehumidifier 3 and the fan 4 are connected via V3 and the dehumidified air is circulated in the processing tank S, the material to be processed H can be stored in the processing tank S in a sealed manner, and the pulp v1 and By operating the vacuum pump 1, the inside of the processing tank S can be brought into a substantially vacuum state, and the pulp V2. By operating V3, the dehumidifier 3, and the fan 4, dehumidified air can be easily and reliably continuously fed into the processing tank S, making the apparatus ideal for drying processing of objects H having narrow spaces and the like. Moreover, the device itself has a simple configuration, is easy to manufacture, is difficult to break down, has excellent durability, and can be provided at low cost. In other words, it becomes an optimal drying apparatus when carrying out the drying method as described above.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本発明の装置の概略図である。 S・・・処理槽、1・・・真空ポンプ、2・・・タンク
、3・・・除湿機、4・・・ファン、5・・・エアー抜
き、Vl・・・バルブ、v2・・・バルブ、v3・・・
バルブ、v4・・・バルブ、 H・・・被処理物。
The drawing is a schematic representation of the device of the invention. S...Processing tank, 1...Vacuum pump, 2...Tank, 3...Dehumidifier, 4...Fan, 5...Air bleed, Vl...Valve, v2... Valve, v3...
Valve, v4... Valve, H... Object to be processed.

Claims (1)

【特許請求の範囲】 1、適宜被処理物の洗浄後に、被処理物を処理槽内に密
閉し、この処理槽内を略真空状態とし、次に、処理槽内
に除湿空気を循環せしめて、被処理物を強制的に乾燥せ
しめることを特徴とした乾燥方法。 2、被処理物を密閉状に収納可能な処理槽を形成し、こ
の処理槽にバルブを介して真空ポンプを接続して、処理
槽内を略真空可能に形成し、処理槽にバルブ を介して除湿機及びファンを接続せしめ て、処理槽内に除湿空気を循環せしめられるよう構成し
たことを特徴とする乾燥装置。
[Claims] 1. After washing the object to be treated as appropriate, the object to be treated is sealed in a processing tank, the inside of this processing tank is brought into a substantially vacuum state, and then dehumidified air is circulated in the processing tank. , a drying method characterized by forcibly drying the object to be processed. 2. A processing tank is formed in which the material to be processed can be hermetically stored, a vacuum pump is connected to the processing tank via a valve to create a substantially vacuum inside the processing tank, and a vacuum pump is connected to the processing tank via a valve. 1. A drying device characterized in that it is configured to connect a dehumidifier and a fan to circulate dehumidified air within a processing tank.
JP17163389A 1989-07-03 1989-07-03 Drying method and device therefor Pending JPH0336729A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17163389A JPH0336729A (en) 1989-07-03 1989-07-03 Drying method and device therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17163389A JPH0336729A (en) 1989-07-03 1989-07-03 Drying method and device therefor

Publications (1)

Publication Number Publication Date
JPH0336729A true JPH0336729A (en) 1991-02-18

Family

ID=15926809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17163389A Pending JPH0336729A (en) 1989-07-03 1989-07-03 Drying method and device therefor

Country Status (1)

Country Link
JP (1) JPH0336729A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650660A (en) * 1992-06-11 1994-02-25 Nakamura Seisakusho:Yugen Reduced pressure drying method for warm air
JP2008161951A (en) * 2006-12-27 2008-07-17 Nsk Ltd Main spindle device, machining center furnished with it and assembling method of main spindle device
JP2009074717A (en) * 2007-09-19 2009-04-09 Shin Ootsuka Kk Treated object drying device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63302521A (en) * 1987-06-02 1988-12-09 Mitsubishi Electric Corp Drier for semiconductor substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63302521A (en) * 1987-06-02 1988-12-09 Mitsubishi Electric Corp Drier for semiconductor substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650660A (en) * 1992-06-11 1994-02-25 Nakamura Seisakusho:Yugen Reduced pressure drying method for warm air
JP2008161951A (en) * 2006-12-27 2008-07-17 Nsk Ltd Main spindle device, machining center furnished with it and assembling method of main spindle device
JP2009074717A (en) * 2007-09-19 2009-04-09 Shin Ootsuka Kk Treated object drying device

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