JPH0336423U - - Google Patents
Info
- Publication number
- JPH0336423U JPH0336423U JP9377889U JP9377889U JPH0336423U JP H0336423 U JPH0336423 U JP H0336423U JP 9377889 U JP9377889 U JP 9377889U JP 9377889 U JP9377889 U JP 9377889U JP H0336423 U JPH0336423 U JP H0336423U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- skin material
- molding
- mold body
- heat shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Description
第１図は本考案実施例の表皮材成形用金型の斜
視図、第２図は該金型の断面図、第３図及び第４
図は該金型に設けた遮熱板の斜視図、第５図は該
金型を用いた成形方法の行程説明図である。
Ａ……表皮材成形用金型、１……金型本体、３
……遮熱板、４……空隙、１２……型温度高温部
位、１４……外面、３０……透孔、５０……熱可
塑性樹脂材料。
FIG. 1 is a perspective view of a mold for forming a skin material according to an embodiment of the present invention, FIG. 2 is a sectional view of the mold, and FIGS.
The figure is a perspective view of a heat shield plate provided in the mold, and FIG. 5 is a process explanatory diagram of a molding method using the mold. A... Mold for molding skin material, 1... Mold body, 3
...Heat shield plate, 4...Void, 12...Mold temperature high temperature region, 14...Outer surface, 30...Through hole, 50...Thermoplastic resin material.
Claims (1)
料を溶融させて表皮材を成形する表皮材成形用金
型において、 前記金型本体の型温度高温部位に、金型本体外
面との間に空隙を介して遮熱板が取り付けられ、 該遮熱板には、透孔が形成されていることを特
徴とする表皮材成形用金型。[Scope of Claim for Utility Model Registration] In a skin material molding mold for molding a skin material by melting a resin material attached to the molding surface of a heated mold body, in a high-temperature part of the mold body, A mold for forming a skin material, characterized in that a heat shield plate is attached to an outer surface of the mold body through a gap, and a through hole is formed in the heat shield plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9377889U JPH061388Y2 (en) | 1989-08-09 | 1989-08-09 | Mold for forming skin material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9377889U JPH061388Y2 (en) | 1989-08-09 | 1989-08-09 | Mold for forming skin material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0336423U true JPH0336423U (en) | 1991-04-09 |
| JPH061388Y2 JPH061388Y2 (en) | 1994-01-12 |
Family
ID=31643145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9377889U Expired - Lifetime JPH061388Y2 (en) | 1989-08-09 | 1989-08-09 | Mold for forming skin material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH061388Y2 (en) |
-
1989
- 1989-08-09 JP JP9377889U patent/JPH061388Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH061388Y2 (en) | 1994-01-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |