JPH0280422U - - Google Patents
Info
- Publication number
- JPH0280422U JPH0280422U JP15917588U JP15917588U JPH0280422U JP H0280422 U JPH0280422 U JP H0280422U JP 15917588 U JP15917588 U JP 15917588U JP 15917588 U JP15917588 U JP 15917588U JP H0280422 U JPH0280422 U JP H0280422U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- cut pin
- hole
- cavity
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Description
図面は本考案の実施例を示し、第１図は金型の
断面図、第２図は主要部分の拡大断面図、第３図
は円孔の打抜状態を示す拡大断面図である。
図中１は可動金型、２は固定金型、３はカツト
ピン、４は隙間、５は通孔、９はキヤビテイ、１
２及び１４は加熱手段、１３及び１５は温度検出
手段を示す。
The drawings show an embodiment of the present invention; FIG. 1 is a sectional view of a mold, FIG. 2 is an enlarged sectional view of the main part, and FIG. 3 is an enlarged sectional view showing the state of punching a circular hole. In the figure, 1 is a movable mold, 2 is a fixed mold, 3 is a cut pin, 4 is a gap, 5 is a through hole, 9 is a cavity, 1
2 and 14 are heating means, and 13 and 15 are temperature detection means.
Claims (1)
付けられた可動金型と、上記カツトピンが所定の
隙間をもつて嵌入する通孔が開設された固定金型
とからなり、これら金型を型閉め密閉してキヤビ
テイを構成し、該キヤビテイ内に樹脂材料を射出
して円盤状の記録基板を成形する射出成形用金型
であつて、上記カツトピンの先端部及び／または
通孔の近傍の固定金型に、加熱手段と温度検出手
段とを設けてあることを特徴とする射出成形用金
型。 It consists of a movable mold equipped with a cut pin for punching a circular hole in the recording board, and a fixed mold with a through hole into which the cut pin is inserted with a predetermined gap, and these molds are closed. An injection mold that forms a sealed cavity and injects a resin material into the cavity to form a disc-shaped recording substrate, the mold having a fixed metal near the tip of the cut pin and/or the through hole. A mold for injection molding, characterized in that the mold is provided with heating means and temperature detection means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15917588U JPH0280422U (en) | 1988-12-07 | 1988-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15917588U JPH0280422U (en) | 1988-12-07 | 1988-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0280422U true JPH0280422U (en) | 1990-06-21 |
Family
ID=31440154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15917588U Pending JPH0280422U (en) | 1988-12-07 | 1988-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0280422U (en) |
-
1988
- 1988-12-07 JP JP15917588U patent/JPH0280422U/ja active Pending
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