JPH03106363U - - Google Patents
Info
- Publication number
- JPH03106363U JPH03106363U JP1659690U JP1659690U JPH03106363U JP H03106363 U JPH03106363 U JP H03106363U JP 1659690 U JP1659690 U JP 1659690U JP 1659690 U JP1659690 U JP 1659690U JP H03106363 U JPH03106363 U JP H03106363U
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- mold
- electroplating device
- layer
- resist layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第１図は本考案の電気メツキ装置の一例を示す
断面概略図、第２図は他の実施例を示す一部断面
概略図、第３図は従来の電気メツキ装置の一部断
面概略図である。
１……金型、２……電極部材、３……レジスト
層、４……絶縁層。
FIG. 1 is a schematic sectional view showing an example of the electroplating device of the present invention, FIG. 2 is a schematic partial sectional view showing another embodiment, and FIG. 3 is a schematic partial sectional view of a conventional electroplating device. be. 1... Mold, 2... Electrode member, 3... Resist layer, 4... Insulating layer.
Claims (1)
した後、キヤビテイー内へ合成樹脂を注入して、
樹脂基材を成形すると同時に樹脂基材上へ上記金
属メツキ層を転写させ一体化する型内メツキ成形
用の電気メツキ装置であつて、導電性を有する金
型１のキヤビテイー内面の金属メツキパターン以
外の部分にレジスト層３を設けると共に、上記キ
ヤビテイー内面に近接して電極部材２を設け、電
極部材２の表面に、上記レジスト層３と同一パタ
ーンでかつレジスト層３の幅よりも広幅の絶縁層
４を設けたことを特徴とする型内メツキ成形用の
電気メツキ装置。 After forming a metal plating layer on the inner surface of the mold cavity, a synthetic resin is injected into the cavity.
An electroplating device for in-mold plating molding that transfers and integrates the metal plating layer onto the resin base material at the same time as molding the resin base material, and is an electroplating device other than the metal plating pattern on the inner surface of the cavity of the mold 1 having conductivity. A resist layer 3 is provided in the area, an electrode member 2 is provided close to the inner surface of the cavity, and an insulating layer having the same pattern as the resist layer 3 and wider than the width of the resist layer 3 is formed on the surface of the electrode member 2. 4. An electroplating device for in-mold plating forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1659690U JPH03106363U (en) | 1990-02-21 | 1990-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1659690U JPH03106363U (en) | 1990-02-21 | 1990-02-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03106363U true JPH03106363U (en) | 1991-11-01 |
Family
ID=31519857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1659690U Pending JPH03106363U (en) | 1990-02-21 | 1990-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03106363U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006255877A (en) * | 2005-02-15 | 2006-09-28 | Carl Manufacturing Co Ltd | Punch, auxiliary tool of punch, and punch with auxiliary tool |
-
1990
- 1990-02-21 JP JP1659690U patent/JPH03106363U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006255877A (en) * | 2005-02-15 | 2006-09-28 | Carl Manufacturing Co Ltd | Punch, auxiliary tool of punch, and punch with auxiliary tool |
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