JPH0336145U - - Google Patents
Info
- Publication number
- JPH0336145U JPH0336145U JP9627489U JP9627489U JPH0336145U JP H0336145 U JPH0336145 U JP H0336145U JP 9627489 U JP9627489 U JP 9627489U JP 9627489 U JP9627489 U JP 9627489U JP H0336145 U JPH0336145 U JP H0336145U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- high frequency
- thick film
- hybrid integrated
- highly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例による高周波厚膜
混成集積回路装置を示す展開断面図、第２図は第
１図の展開斜視図、第３図は従来の高周波厚膜混
成集積回路装置の展開断面図、第４図は第３図の
展開斜視図である。 図において、１……保護ケース、２……絶縁性
基板、５……高熱伝導性でかつ高電気伝導性の樹
脂を示す。なお、図中、同一符号は同一、又は相
当部分を示す。
混成集積回路装置を示す展開断面図、第２図は第
１図の展開斜視図、第３図は従来の高周波厚膜混
成集積回路装置の展開断面図、第４図は第３図の
展開斜視図である。 図において、１……保護ケース、２……絶縁性
基板、５……高熱伝導性でかつ高電気伝導性の樹
脂を示す。なお、図中、同一符号は同一、又は相
当部分を示す。
Claims (1)
- 回路が形成された絶縁性基板の裏面に高熱伝導
性でかつ高電気伝導性の樹脂が接着され、回路を
保護するケースにより封止されていることを特徴
とする高周波厚膜混成集積回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9627489U JPH0336145U (ja) | 1989-08-17 | 1989-08-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9627489U JPH0336145U (ja) | 1989-08-17 | 1989-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0336145U true JPH0336145U (ja) | 1991-04-09 |
Family
ID=31645491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9627489U Pending JPH0336145U (ja) | 1989-08-17 | 1989-08-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0336145U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008022653A (ja) * | 2006-07-13 | 2008-01-31 | Fujitsu Ten Ltd | 電動モータの制御装置及び電動式パワーステアリング装置 |
-
1989
- 1989-08-17 JP JP9627489U patent/JPH0336145U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008022653A (ja) * | 2006-07-13 | 2008-01-31 | Fujitsu Ten Ltd | 電動モータの制御装置及び電動式パワーステアリング装置 |