JPH0336137U - - Google Patents
Info
- Publication number
- JPH0336137U JPH0336137U JP1989097546U JP9754689U JPH0336137U JP H0336137 U JPH0336137 U JP H0336137U JP 1989097546 U JP1989097546 U JP 1989097546U JP 9754689 U JP9754689 U JP 9754689U JP H0336137 U JPH0336137 U JP H0336137U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- package
- sectional
- view
- metal conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
- 
        - H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
 
- 
        - H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
 
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP1989097546U JPH0336137U (enrdf_load_html_response) | 1989-08-21 | 1989-08-21 | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP1989097546U JPH0336137U (enrdf_load_html_response) | 1989-08-21 | 1989-08-21 | 
Publications (1)
| Publication Number | Publication Date | 
|---|---|
| JPH0336137U true JPH0336137U (enrdf_load_html_response) | 1991-04-09 | 
Family
ID=31646682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP1989097546U Pending JPH0336137U (enrdf_load_html_response) | 1989-08-21 | 1989-08-21 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPH0336137U (enrdf_load_html_response) | 
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JP2007112495A (ja) * | 2005-10-21 | 2007-05-10 | Sankosha Engineering:Kk | 衣類の立体包装機 | 
| JP2007136153A (ja) * | 2005-10-21 | 2007-06-07 | Sankosha Engineering:Kk | 立体包装用のハンガー | 
| KR200475299Y1 (ko) * | 2013-07-03 | 2014-11-19 | 이은영 | 자석이 결합된 의류 보관용 비닐 커버 | 
- 
        1989
        - 1989-08-21 JP JP1989097546U patent/JPH0336137U/ja active Pending
 
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JP2007112495A (ja) * | 2005-10-21 | 2007-05-10 | Sankosha Engineering:Kk | 衣類の立体包装機 | 
| JP2007136153A (ja) * | 2005-10-21 | 2007-06-07 | Sankosha Engineering:Kk | 立体包装用のハンガー | 
| KR200475299Y1 (ko) * | 2013-07-03 | 2014-11-19 | 이은영 | 자석이 결합된 의류 보관용 비닐 커버 |