JPH0335045B2 - - Google Patents
Info
- Publication number
- JPH0335045B2 JPH0335045B2 JP58165661A JP16566183A JPH0335045B2 JP H0335045 B2 JPH0335045 B2 JP H0335045B2 JP 58165661 A JP58165661 A JP 58165661A JP 16566183 A JP16566183 A JP 16566183A JP H0335045 B2 JPH0335045 B2 JP H0335045B2
- Authority
- JP
- Japan
- Prior art keywords
- band
- grinding
- longitudinal direction
- diamond
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910003460 diamond Inorganic materials 0.000 claims description 12
- 239000010432 diamond Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/12—Straight saw blades; Strap saw blades
- B23D61/123—Details of saw blade body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/12—Saw-blades or saw-discs specially adapted for working stone
- B28D1/127—Straight, i.e. flat, saw blades; strap saw blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【発明の詳細な説明】
本発明はダイヤモンドチツプソーにおけるバン
ドに関し、特にバンドの截断端をバンドの長手方
向に研削すると共にその部分を面取りすることを
特徴とするものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a band for a diamond chipsaw, and is particularly characterized in that the cut end of the band is ground in the longitudinal direction of the band and that portion is chamfered.
ダイヤモンドチツプソーは銅製の無端帯状バン
ドに多数のダイヤモンドチツプを間隔的に取付け
たものであつて、石材、金属その他の硬質材料を
加工するに適したものである。ダイヤモンドチツ
プソーを作るに当たつては、先ず、銅製の帯を適
宜な幅に截断してバンドとしたのち、その両縁、
即ち截断端を研削する。次いでこのバンドを所定
の長さに切断し、両端を接合して無端帯状とした
のち、その下縁にダイヤモンドチツプを取付ける
のである。 A diamond chip saw has a large number of diamond chips attached at intervals to an endless band made of copper, and is suitable for machining stone, metal, and other hard materials. To make a diamond chipsaw, first cut a copper band to an appropriate width to make a band, and then cut both edges of the band.
That is, the cut end is ground. Next, this band is cut to a predetermined length, the ends are joined to form an endless band, and a diamond chip is attached to the lower edge.
ところでダイヤモンドチツプソーは上に述べた
様に硬質の材料を加工するのに適していて切削能
力が高いものであるが、バンドにクラツクが入り
易くて寿命が短い欠点がある。本発明者はこの点
について研究した結果、これはバンドの材質が鋼
鉄であることによるのであるが、バンドの截断端
を研削するときに、この部分に付けられる創が原
因してクラツクの発生を助長することが分つた。
即ち、従来はバンドの截断端を研削するときは第
１〜２図に示した様にバンド１をコイル状に巻い
たのち、その上面、即ち截断端２を研削砥石３で
研削したからバンド１の截断端２は平坦な研削面
となり、しかもその面にはバンド１の長手方向に
対してクロスする方向に多数の研削創４が付けら
れている。この研削創４は截断端２の稜の部分に
まで達しているので、この部分にクラツクが入り
易くなるのである。 By the way, as mentioned above, the diamond tip saw is suitable for processing hard materials and has a high cutting ability, but it has the disadvantage that the band is easily cracked and its life is short. As a result of research on this point, the inventor found that this is due to the fact that the material of the band is steel, but when grinding the cut end of the band, cracks are caused by scratches in this part. I found that it helps.
That is, conventionally, when grinding the cut end of a band, the band 1 was wound into a coil shape as shown in FIGS. The cut end 2 becomes a flat ground surface, and a large number of grinding scratches 4 are made on that surface in a direction crossing the longitudinal direction of the band 1. Since this grinding wound 4 reaches as far as the ridge of the cut edge 2, cracks are likely to form in this area.
本発明は上記した点に鑑みてなされたものであ
つて、バンドの截断端をバンドの長手方向に並行
に研削し、且つこの部分の面を大きくとつて殆ど
蒲鉾状とし、以つて研削創が稜と交叉することを
なくしてクラツクの入る原因を除去したものであ
る。 The present invention has been made in view of the above-mentioned points, and the cut end of the band is ground in parallel to the longitudinal direction of the band, and the surface of this part is enlarged to almost have a semi-cylindrical shape, thereby preventing grinding scratches. By eliminating the intersection with the ridge, the cause of cracks has been eliminated.
即ち本発明のダイヤモンドチツプソーにおける
バンドは、バンドの長手方向に並行に研削したバ
ンドの上縁と下縁を有し、その断面形状を蒲鉾形
にして稜線を無くしたものであり、研削創はバン
ドの長手方向に平行に付けたものであることを特
徴とするものである。 That is, the band in the diamond chipsaw of the present invention has an upper edge and a lower edge that are ground parallel to the longitudinal direction of the band, and has a semicircular cross-sectional shape with no ridgeline, and the grinding scratches are eliminated. It is characterized by being attached parallel to the longitudinal direction of the band.
以下、本発明を図示の実施例に基づいて具体的
に説明する。図中符号５はバンドである。このバ
ンド５はこれ自体は従来のものと変わるところは
なく、鋼製の帯から成つている。このバンド５の
上縁６と下縁７とを研削するものであり、特にバ
ンドの長手方向に並行に研削すると共に面を大き
くとつて殆ど蒲鉾形に仕上げるのである。研削方
法ついては特に限定はしないが一例として、図に
示すように鼓状の研削砥石８を用い、回転軸をバ
ンド５の送り方向に対して直交させて設けてその
鼓胴面でバンドの上下両縁６，７を研削するので
ある。するとバンド５の上下両縁６及び７の断形
状は研削砥石８の鼓胴面の形状に倣つて蒲鉾形に
研削され、稜線が無なると共に研削創９はバンド
５の長手方向に対して平行なり、バンド５に加え
られる力に対してクラツクの最も入りにくい状態
となるものである。この点ついてはバンド５の共
振や歪をとるなどのためにバンドに穴を穿ける場
合も同様であつて穴１０の内周を鼓状の研削砥石
やリーマ等でさらうのである。 Hereinafter, the present invention will be specifically explained based on illustrated embodiments. Reference numeral 5 in the figure is a band. This band 5 itself is no different from the conventional one, and is made of a steel band. The upper edge 6 and lower edge 7 of this band 5 are ground, and in particular, they are ground in parallel to the longitudinal direction of the band, and the surfaces are made large so that they are finished in an almost semi-cylindrical shape. There are no particular limitations on the grinding method, but as an example, as shown in the figure, a drum-shaped grinding wheel 8 is used, the rotating shaft is set perpendicular to the feeding direction of the band 5, and the drum surface is used to grind both the top and bottom of the band. The edges 6 and 7 are ground. Then, the cross-sectional shape of the upper and lower edges 6 and 7 of the band 5 is ground into a semicircular shape following the shape of the drum surface of the grinding wheel 8, and the ridge line is eliminated and the grinding wound 9 is parallel to the longitudinal direction of the band 5. This is the state in which the band 5 is least likely to crack due to the force applied to it. Regarding this point, the same is true when making a hole in the band 5 to remove resonance or distortion, and the inner periphery of the hole 10 is scraped off with a drum-shaped grinding wheel, reamer, or the like.
尚、バンド５にダイヤモンドチツプを取付ける
方式については特に限定はしない。例えばダイヤ
モンドチツプ１１に取付片１２を固着しておいて
バンドの所定の位置に接着したり、低温溶接をし
たりするのである。勿論この場合、バンド５の所
定の位置に取付孔１３をあけてリベツト等によつ
て取付ける方法（特開昭58−94914号）によつて
も何ら差しつかえないが、この場合にも取付孔１
３の内周は上記と同様にさらうことは云うまでも
ない。 Note that there is no particular limitation on the method of attaching the diamond chip to the band 5. For example, the mounting piece 12 is fixed to the diamond chip 11 and then glued to a predetermined position on the band, or by low-temperature welding. Of course, in this case, there is no problem with the method of drilling the mounting hole 13 at a predetermined position of the band 5 and attaching it with rivets or the like (Japanese Patent Application Laid-Open No. 58-94914), but in this case also, the mounting hole 1
Needless to say, the inner circumference of No. 3 can be removed in the same manner as above.
以上詳述した様に本発明はバンドの長手方向に
並行に研削したバンドの上縁と下縁とを有し、そ
の断面形状を蒲鉾形にして稜線を無くし、且つ研
削創がバンドの長手方向に平行に付くようにした
ものである。従つて、バンドに対してこれを湾曲
しようとする力が作用しても、研削創がバンドの
長手方向に対して平行に付けられていて、これが
クラツクを発生する原因とならないので、バンド
は従来のものと比べて格段にクラツクが発生し難
くなるのである。そのため、ダイヤモンドチツプ
ソーは長期間の使用に耐える極めて優れたものと
なるのである。 As detailed above, the present invention has an upper edge and a lower edge of the band which are ground parallel to the longitudinal direction of the band, whose cross-sectional shape is semi-cylindrical to eliminate ridge lines, and where the grinding scratches are formed in the longitudinal direction of the band. It is attached parallel to. Therefore, even if a force acts on the band to bend it, the grinding scratches are made parallel to the band's longitudinal direction, and this will not cause cracks, so the band will Cracks are much less likely to occur compared to the previous model. Therefore, diamond tip saws are extremely durable and can withstand long-term use.
第１図は従来のダイヤモンドチツプソー用バン
ドを示す一部拡大斜視図、第２図は同上研削方向
を示す斜視図、第３図は本発明の一実施例を示す
斜視図である。
５……バンド、６……上縁、７……下縁、８…
…研削砥石、９……研削創。
FIG. 1 is a partially enlarged perspective view showing a conventional band for a diamond chipsaw, FIG. 2 is a perspective view showing the same grinding direction, and FIG. 3 is a perspective view showing an embodiment of the present invention. 5... Band, 6... Upper edge, 7... Lower edge, 8...
...Grinding wheel, 9...Grinding wound.
Claims (1)
上縁と下縁を有し、その断面形状を蒲鉾形にして
稜線を無くしたものであり、研削創はバンドの長
手方向に平行に付けたものであることを特徴とす
るダイヤモンドチツプソーにおけるバンド。1 The upper and lower edges of the band are ground parallel to the longitudinal direction of the band, and the cross-sectional shape is semi-cylindrical with no ridgeline, and the grinding scratches are made parallel to the longitudinal direction of the band. A band in a diamond chipsaw characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16566183A JPS6056820A (en) | 1983-09-08 | 1983-09-08 | Band in diamond tip saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16566183A JPS6056820A (en) | 1983-09-08 | 1983-09-08 | Band in diamond tip saw |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6056820A JPS6056820A (en) | 1985-04-02 |
| JPH0335045B2 true JPH0335045B2 (en) | 1991-05-24 |
Family
ID=15816609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16566183A Granted JPS6056820A (en) | 1983-09-08 | 1983-09-08 | Band in diamond tip saw |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6056820A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750497A (en) * | 1993-08-05 | 1995-02-21 | Hitachi Ferrite Ltd | Radiowave-absorbing panel |
| JPH0774495A (en) * | 1993-08-31 | 1995-03-17 | Hitachi Ferrite Ltd | Radio-wave absorptive panel |
| JP2677510B2 (en) * | 1993-08-31 | 1997-11-17 | 日立金属株式会社 | Radio wave absorption panel |
| JP4898380B2 (en) * | 2006-10-16 | 2012-03-14 | Ｎｔｎ株式会社 | Flat belt idler pulley device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50133593A (en) * | 1974-04-08 | 1975-10-22 |
-
1983
- 1983-09-08 JP JP16566183A patent/JPS6056820A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50133593A (en) * | 1974-04-08 | 1975-10-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6056820A (en) | 1985-04-02 |
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