JPH0334230B2 - - Google Patents

Info

Publication number
JPH0334230B2
JPH0334230B2 JP60208203A JP20820385A JPH0334230B2 JP H0334230 B2 JPH0334230 B2 JP H0334230B2 JP 60208203 A JP60208203 A JP 60208203A JP 20820385 A JP20820385 A JP 20820385A JP H0334230 B2 JPH0334230 B2 JP H0334230B2
Authority
JP
Japan
Prior art keywords
refrigerant
bellows
cooling
electronic component
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60208203A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6267844A (ja
Inventor
Izumi Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60208203A priority Critical patent/JPS6267844A/ja
Priority to DE8686112568T priority patent/DE3677884D1/de
Priority to EP86112568A priority patent/EP0219674B1/en
Priority to US06/909,229 priority patent/US4688147A/en
Publication of JPS6267844A publication Critical patent/JPS6267844A/ja
Publication of JPH0334230B2 publication Critical patent/JPH0334230B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60208203A 1985-09-20 1985-09-20 冷却構造 Granted JPS6267844A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60208203A JPS6267844A (ja) 1985-09-20 1985-09-20 冷却構造
DE8686112568T DE3677884D1 (de) 1985-09-20 1986-09-11 Kuehlungsanordnung fuer elektronische bauelemente.
EP86112568A EP0219674B1 (en) 1985-09-20 1986-09-11 Cooling device for electronic parts
US06/909,229 US4688147A (en) 1985-09-20 1986-09-19 Cooling device attached to each surface of electronic parts on a printed-wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60208203A JPS6267844A (ja) 1985-09-20 1985-09-20 冷却構造

Publications (2)

Publication Number Publication Date
JPS6267844A JPS6267844A (ja) 1987-03-27
JPH0334230B2 true JPH0334230B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-05-21

Family

ID=16552369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60208203A Granted JPS6267844A (ja) 1985-09-20 1985-09-20 冷却構造

Country Status (4)

Country Link
US (1) US4688147A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0219674B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS6267844A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3677884D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0217676B1 (en) * 1985-10-04 1993-09-01 Fujitsu Limited Cooling system for electronic circuit device
US4758927A (en) * 1987-01-21 1988-07-19 Tektronix, Inc. Method of mounting a substrate structure to a circuit board
JPH0530394Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1987-08-26 1993-08-03
CA1303238C (en) * 1988-05-09 1992-06-09 Kazuhiko Umezawa Flat cooling structure of integrated circuit
JPH06342990A (ja) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> 統合冷却システム
US7007741B2 (en) * 2002-10-18 2006-03-07 Sun Microsystems, Inc. Conformal heat spreader
WO2005061972A1 (en) * 2002-12-06 2005-07-07 Nanocoolers, Inc. Cooling of electronics by electrically conducting fluids
RU2256946C2 (ru) * 2003-08-04 2005-07-20 Дагестанский государственный технический университет (ДГТУ) Термоэлектрическое устройство терморегулирования компьютерного процессора с применением плавящегося вещества
US7269005B2 (en) * 2003-11-21 2007-09-11 Intel Corporation Pumped loop cooling with remote heat exchanger and display cooling
US20050150536A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Method for forming a monolithic thin-film thermoelectric device including complementary thermoelectric materials
US20050150539A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Monolithic thin-film thermoelectric device including complementary thermoelectric materials
US20050150537A1 (en) * 2004-01-13 2005-07-14 Nanocoolers Inc. Thermoelectric devices
US20050150535A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Method for forming a thin-film thermoelectric device including a phonon-blocking thermal conductor
US20050189089A1 (en) * 2004-02-27 2005-09-01 Nanocoolers Inc. Fluidic apparatus and method for cooling a non-uniformly heated power device
US20060076046A1 (en) * 2004-10-08 2006-04-13 Nanocoolers, Inc. Thermoelectric device structure and apparatus incorporating same
US7296417B2 (en) * 2004-12-23 2007-11-20 Nanocoolers, Inc. Thermoelectric configuration employing thermal transfer fluid flow(s) with recuperator
US7293416B2 (en) * 2004-12-23 2007-11-13 Nanocoolers, Inc. Counterflow thermoelectric configuration employing thermal transfer fluid in closed cycle
US7475551B2 (en) 2004-12-23 2009-01-13 Nanocoolers, Inc. System employing temporal integration of thermoelectric action
RU2341833C1 (ru) * 2007-07-16 2008-12-20 Государственное Образовательное Учреждение Высшего Профессионального Образования "Дагестанский Государственный Технический Университет" (Дгту) Устройство для охлаждения и термостабилизации элементов радиоэлектронной аппаратуры (рэа), работающих при циклических тепловых воздействиях
US7701716B2 (en) * 2008-06-18 2010-04-20 Apple Inc. Heat-transfer mechanism including a liquid-metal thermal coupling
WO2012048432A1 (en) * 2010-10-15 2012-04-19 John David Lugtu Device for cooling high power broadcast transmitters
KR102116568B1 (ko) * 2013-10-14 2020-06-01 엘지전자 주식회사 공기 조화기
DE102016220265A1 (de) * 2016-10-17 2018-04-19 Zf Friedrichshafen Ag Wärme ableitende Anordnung und Verfahren zur Herstellung
US10976119B2 (en) * 2018-07-30 2021-04-13 The Boeing Company Heat transfer devices and methods of transfering heat
CN113038808A (zh) * 2021-04-01 2021-06-25 武平飞天电子科技有限公司 一种使用循环油制冷的高功率5g基站线路板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138692A (en) * 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
US4193445A (en) * 1978-06-29 1980-03-18 International Business Machines Corporation Conduction cooled module
JPS60160149A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路装置の冷却方式

Also Published As

Publication number Publication date
EP0219674A1 (en) 1987-04-29
EP0219674B1 (en) 1991-03-06
US4688147A (en) 1987-08-18
DE3677884D1 (de) 1991-04-11
JPS6267844A (ja) 1987-03-27

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