JPH0333054Y2 - - Google Patents

Description

[Detailed Description of the Invention] <Industrial Field of Application> This invention relates to a multilayer chip capacitor used in various electronic circuits.

<Prior Art> As shown in FIG. 4, a conventional multilayer chip capacitor has external electrodes 2 and 3 provided at both ends of a dielectric material 1 made of ceramic or the like, and internal electrodes 4 and 3 connected to both external electrodes. 5 are alternately embedded in 1 within the dielectric.

<Problems to be solved by the invention> In the conventional multilayer chip capacitor as described above, the internal electrodes 4 and 5 for capacitance are all embedded in the dielectric 1, so each internal electrode is 4 and 5 must be fired together with the ceramic that will become the dielectric 1. Therefore, it is necessary to use a heat-resistant metal such as palladium for the internal electrodes 4 and 5, but such heat-resistant metals are expensive and have poor electrical conductivity when used in high frequency ranges. It is quite bad, and when used in high frequency circuits there is a problem of large losses due to electrical resistance.

<Means for solving the problem> This idea was made to solve the above problem.In a multilayer chip capacitor, multiple internal electrodes embedded in the dielectric are connected to one electrode. The other electrode facing this is only an external electrode that is applied after firing the ceramic, and this external electrode is made of a material with high conductivity of 5 × 10 ^-8 Ωm or less, and a side electrode that is connected to the external electrode is provided. It is something.

<Embodiment> FIGS. 1 to 3 show an embodiment of this invention. Reference numeral 11 is a dielectric material made of ceramic, and two internal electrodes 12 are embedded inside the dielectric material in the case of FIG. 1.

A known method is used for this, and the dielectric 11
When the ceramic is fired, the internal electrode 12 is already embedded in the ceramic, so a high melting point metal such as palladium, platinum, etc. must be used as the material for the electrode.

Reference numerals 13 and 14 are external electrodes, and one external electrode 13 is widely applied to the front and back surfaces of the dielectric 11 to provide electrostatic capacitance between the external electrode 13 and the internal electrode 12 on the front and back sides. Further, the other external electrode 14 is short, and the internal electrode 12 is attached to this external electrode 14.
Connect.

The materials for these external electrodes 13 and 14 can be applied after firing the ceramic, so they should be made of silver, copper, or aluminum with high conductivity (5×
(10 ^-8 Ωm or less) metal can be used.

In the embodiment shown in FIG. 1, there are two internal electrodes 12, but in the case of FIG. 2, there are four internal electrodes.

By increasing the number of internal electrodes and connecting each internal electrode 12 in parallel to the external electrode 14 in this way, even if the resistance value of each internal electrode 12 is high, the resistance value of the internal electrode 12 as a whole can be lowered. I can do it.

Further, FIG. 3 is a perspective view of this invention, in which external electrodes 13 provided on the front and back sides are connected by electrodes 15 on the side surfaces, thereby making it possible to reduce residual inductance.

<Effects> As mentioned above, this invention has a plurality of internal electrodes embedded in the dielectric with only one electrode, and the other electrode facing this is only an external electrode that is applied after firing the ceramic. ×
It is made of a material with high conductivity, such as silver, copper, or aluminum, with a conductivity of 10 ^-8 Ωm or less, and is further provided with side electrodes that are connected to the external electrodes.
A chip capacitor with an extremely small equivalent series resistance can be obtained compared to a conventional capacitor that obtains capacitance between internal electrodes.

Therefore, when this capacitor is used in a resonant circuit, the Q of the circuit increases and the gain of the circuit can be increased.

Furthermore, when used as a bypass capacitor, a large insertion loss can be obtained.

Furthermore, by reducing the residual inductance, the self-resonant frequency of the capacitor becomes higher, and there are effects such as being able to expand the high-frequency usage limit of the capacitor.

[Brief explanation of the drawing]

1 and 2 are longitudinal sectional views showing each embodiment of the chip capacitor of this invention, FIG. 3 is a perspective view of the embodiment, and FIG. 4 is a longitudinal sectional side view of a conventional chip capacitor. 11...Dielectric material, 12...Internal electrode, 13,1
4... External electrode, 15... Side electrode.

Claims (1)

[Scope of utility model registration request] In a multilayer chip capacitor, only one of the plurality of internal electrodes is embedded in the dielectric, and the other electrode facing it is only an external electrode that is applied after firing the ceramic. A chip capacitor characterized by being made of a material with high conductivity of ^-8 Ωm or less and having a side electrode connected to the external electrode.