JPH0332634B2 - - Google Patents
Info
- Publication number
- JPH0332634B2 JPH0332634B2 JP58127853A JP12785383A JPH0332634B2 JP H0332634 B2 JPH0332634 B2 JP H0332634B2 JP 58127853 A JP58127853 A JP 58127853A JP 12785383 A JP12785383 A JP 12785383A JP H0332634 B2 JPH0332634 B2 JP H0332634B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- cylindrical inner
- brush
- connector socket
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 104
- 239000007788 liquid Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 12
- 238000003780 insertion Methods 0.000 description 16
- 230000037431 insertion Effects 0.000 description 16
- 238000007796 conventional method Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000010970 precious metal Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
【発明の詳細な説明】
(イ) 発明の技術分野
本発明は小径の筒状内面を有するメツキ物のメ
ツキ方法、特に各種電子機器等に使用するコネク
ターソケツトのピン挿入部の如き小径の筒状内面
をメツキするのに好適なメツキ方法に関する。Detailed Description of the Invention (a) Technical Field of the Invention The present invention relates to a method for plating a plating object having a small-diameter cylindrical inner surface, and in particular to a method for plating a plating object having a small-diameter cylindrical inner surface, particularly a small-diameter cylinder such as a pin insertion part of a connector socket used in various electronic devices. The present invention relates to a plating method suitable for plating a shaped inner surface.
(ロ) 従来技術と問題点
一般に電子機器等に用いられるコネクター類等
は銅又は銅合金で造られていて、高い信頼度を必
要とするものになると優れた導電性のほかに耐蝕
性、耐摩耗性、ハンダ作業の容易性などの性能が
要求されるので、メツキが必要となり、そのメツ
キは主として金メツキが施されるものであるが、
用途に応じては金以外の、ロジウム又は銀メツキ
のほかの種々の合金メツキが施されるものであ
る。(b) Prior art and problems Connectors used in electronic devices are generally made of copper or copper alloys, and if they require high reliability, they have excellent conductivity as well as corrosion resistance and resistance. Since performance such as abrasion resistance and ease of soldering work is required, plating is required, and the plating is mainly gold plating.
Depending on the purpose, various alloy platings other than gold such as rhodium or silver plating may be applied.
そしてコネクターソケツトのピン挿入部の如き
小径の筒状内面にメツキする方法としては、例え
ば第１図に示すような特開昭58−37193号公報に
開示された「コネクターソケツトの内面メツキ方
法」がある。この開示された技術によればコネク
ターソケツト１はピン挿入部２を有し、カソード
を兼ねた金属性の支持台３によりピン挿入部２の
開口４を下に向けてコネクターソケツト１を鉛直
に保持されるようにしてあり、コネクターソケツ
ト１の下方にはメツキ液５の入つたメツキ槽６が
備えられ、またメツキ槽６内にはノズル７がピン
挿入部２に対して進退自在に取付けられている。
そしてメツキ槽６中のメツキ液５はポンプ８によ
りパイプ９内を通つて、コネクターソケツト１の
ピン挿入部２に挿入されたノズル７の先端部１０
より、筒状内面１１に噴射され、噴射されたメツ
キ液５は筒状内面１１を流れ落ちる間にメツキを
行ない、下方に備えられたメツキ槽６内に回収さ
れ、再びポンプ８、パイプ９を通つてノズル７に
循環供給されるようにしてある。 As a method for plating a small-diameter cylindrical inner surface such as a pin insertion part of a connector socket, for example, the method for plating the inner surface of a connector socket disclosed in Japanese Patent Application Laid-Open No. 58-37193 as shown in FIG. ” is there. According to this disclosed technology, the connector socket 1 has a pin insertion part 2, and the connector socket 1 is vertically aligned with the opening 4 of the pin insertion part 2 facing downward by a metal support base 3 which also serves as a cathode. A plating tank 6 containing a plating liquid 5 is provided below the connector socket 1, and a nozzle 7 is provided in the plating tank 6 so as to be able to move forward and backward with respect to the pin insertion portion 2. installed.
The plating liquid 5 in the plating tank 6 is passed through a pipe 9 by a pump 8 to the tip 10 of a nozzle 7 inserted into the pin insertion part 2 of the connector socket 1.
As a result, the injected plating liquid 5 is injected onto the cylindrical inner surface 11, performs plating while flowing down the cylindrical inner surface 11, is collected in the plating tank 6 provided below, and is passed through the pump 8 and the pipe 9 again. The water is supplied to the nozzle 7 in circulation.
しかしながらこのような従来の小径の筒状内面
を有するメツキ物のメツキ方法においては、カソ
ード化されたコネクターソケツト１のピン挿入部
２内に、アノード化されたノズル７を挿入してメ
ツキ液５を噴射するため、もしコネクターソケツ
ト１とノズル７が直接接触すると電気的に短絡
（シヨート）しメツキできなくなるばかりかメツ
キ装置全体の故障の原因にもなりかねないので；
(イ)筒状内面１１とノズル７との間には十分な間隙
が必要とされ、しかも(ロ)メツキ液５がピン挿入部
２内で円滑に噴射され且つ回収されるように、筒
状内面１１とノズル７との間に十分な距離を隔て
た状態でノズル７を位置決めしなければならない
ものであつた。しかしながら、昨今、電子機器部
品全般がそうであるようにコネクターソケツトな
ども小径化する傾向にある中でピン挿入部２のよ
うな小径よりも更に小サイズの外径を有するノズ
ル７の形成は困難でありしかも筒状内面１１と非
接触状態で確実に挿入して上記(イ)、(ロ)の条件を満
足させるという操作は非常に困難なものになりつ
つある。 However, in such a conventional method of plating a plating object having a small-diameter cylindrical inner surface, an anodized nozzle 7 is inserted into a cathodized pin insertion portion 2 of a connector socket 1, and a plating liquid 5 is applied. If the connector socket 1 and the nozzle 7 come into direct contact with each other, it will not only cause an electrical short circuit, making it impossible to plate, but also cause the entire plating device to malfunction;
(b) A sufficient gap is required between the cylindrical inner surface 11 and the nozzle 7, and (b) the cylindrical inner surface 11 is required so that the plating liquid 5 is smoothly injected and collected within the pin insertion part 2. The nozzle 7 had to be positioned with a sufficient distance between the inner surface 11 and the nozzle 7. However, in recent years, there has been a trend toward smaller diameter connector sockets as well as electronic device parts in general, and it is difficult to form a nozzle 7 having an outer diameter even smaller than the small diameter of the pin insertion part 2. It is becoming extremely difficult to perform the operation of reliably inserting the tube without contacting the cylindrical inner surface 11 and satisfying the conditions (a) and (b) above.
また電子機器部品の小径化傾向と同様に近年、
金、銀等の貴金属の価格が高騰していることや貴
金属の省資源を計ることから、これら貴金属のメ
ツキの場合は必要最小限の部位にのみメツキを施
す要望が高まりつつある。コネクターソケツト１
の筒状内面１１にメツキを施す際も、コネクター
ソケツト１とピン（図示せず）とのコンタクトに
必要な部位にのみメツキを施せば良く、従来の方
法だとピン挿入部２の筒状内面１１全部にメツキ
が施こされてしまい、筒状内面１１の不要な部位
にもメツキされることから製造コストがその分高
くなるなどの不経済な点があつた。 In addition, in recent years, as well as the trend toward smaller diameter parts of electronic devices,
Due to the soaring prices of precious metals such as gold and silver and efforts to conserve precious metal resources, there is an increasing demand for plating only the minimum necessary parts when plating these precious metals. Connector socket 1
When plating the cylindrical inner surface 11 of the connector socket 1, it is only necessary to plate the parts necessary for contact between the connector socket 1 and the pin (not shown). Since the entire inner surface 11 is plated and unnecessary portions of the cylindrical inner surface 11 are also plated, the manufacturing cost increases accordingly, which is uneconomical.
(ハ) 発明の目的
本発明は上記の如き種々の問題点に着目してな
されたもので、筒状内面がたとえ小径であつて
も、確実に且つ部分的にメツキする方法を提供せ
んとすることを目的としている。(c) Purpose of the Invention The present invention has been made in view of the various problems mentioned above, and it is an object of the present invention to provide a method for reliably and partially plating the inner surface of a cylindrical shape, even if it has a small diameter. The purpose is to
(ニ) 発明の構成
本発明は上記の目的を達成するために、小径の
筒状内面を有するメツキ物を、一定高さの液面を
有するメツキ液が入れられているメツキ槽の上方
に位置させ、前記メツキ物の真下位置に相当する
メツキ液中に、メツキ物の筒状内面に相応する小
径サイズの外面を有するメツキブラシを、上昇自
在に配置し、前記メツキ液中でメツキ液を十分に
含浸した状態のメツキブラシを、メツキ液中から
上昇させてメツキ物の筒状内面内へ挿入させ、前
記筒状内面のうちの、メツキブラシと接触した部
位にのみメツキを施すものである。(d) Structure of the Invention In order to achieve the above object, the present invention has a method of positioning a plating object having a cylindrical inner surface of a small diameter above a plating tank containing a plating liquid having a liquid level of a certain height. A plating brush having an outer surface with a small diameter corresponding to the cylindrical inner surface of the plating object is placed in the plating liquid directly below the object to be plated so as to be able to rise freely, and the plating liquid is sufficiently filled in the plating liquid. The impregnated plating brush is raised from the plating liquid and inserted into the cylindrical inner surface of the object to be plated, and plating is applied only to the portion of the cylindrical inner surface that comes into contact with the plating brush.
ここで、メツキ物をメツキ槽の上方に「位置さ
せ」るとは、メツキ槽の上方へメツキ物を不動状
態で固定してしまうことだけでなく、水平自動搬
送装置にて水平移動しているメツキ物を、メツキ
槽の上方でメツキ操作のためにいつたん停止させ
ることも意味するものである。 Here, "positioning" the plating object above the plating tank means not only fixing the plating object immovably above the plating tank, but also moving it horizontally using a horizontal automatic conveyance device. It also means that the material to be plated is stopped once for the plating operation above the plating tank.
(ホ) 実施例
以下、この発明に係る小径の筒状内面を有する
メツキ物のメツキ方法を、この方法を実施するた
めの一例として示したメツキ装置を参照して説明
する。尚、以下の説明に於いて、従来と共通の部
分については共通の符号を付して重複する説明は
省略する。(E) Example Hereinafter, a method of plating a plating object having a small-diameter cylindrical inner surface according to the present invention will be described with reference to a plating apparatus shown as an example for carrying out this method. In the following description, parts common to those of the prior art are given the same reference numerals, and redundant description will be omitted.
第２図及び第３図に於いて、１は「メツキ物」
としてのコネクターソケツトで、１２は回転ホル
ダーを示す。この回転ホルダー１２の外周面には
カソード板１３が設けてあり、更にこの外周面に
はコネクターソケツト１のステム１４の略半外周
面に相応する複数の固定溝１５が一定のピツチで
設けられている。コネクターソケツト１のステム
１４は、固定溝１５に嵌合されて、また回転ホル
ダー１２の外周面を覆う押えベルト１６のテンシ
ヨンにより回転ホルダー１２からの位置ずれを防
止されつつ固定される。回転ホルダー１２の下方
にはメツキ槽６が備えられており、メツキ槽６中
には一定の液面高さでメツキ液５が保たれてい
る。メツキ槽６内にはメツキ液５中に沈められて
いる形で、アノードを兼ねた複数のメツキブラシ
１７がそのブラシ本体１８をそれぞれ上に向けて
ベース板１９上に立設されている。メツキブラシ
１７が立設されている間隔は回転ホルダー１２に
保持されたコネクターソケツト１と同じピツチ
で、即ち各々のメツキブラシ１７は各々のコネク
ターソケツト１の真下に対応位置決めされてい
る。ベース板１９は図示せぬ圧力シリンダーのア
ーム２０に固定されており上下動自在とされてい
る。メツキブラシ１７のブラシ本体１８はコネク
ターソケツト１のピン挿入部２に相応する円筒状
の外面２１を有していて、ブラシ支持棒２２の先
端部へ交換自在に取付けられているものである。 In Figures 2 and 3, 1 is "metsukimono"
12 indicates a rotating holder. A cathode plate 13 is provided on the outer peripheral surface of this rotary holder 12, and a plurality of fixing grooves 15 corresponding to approximately half the outer peripheral surface of the stem 14 of the connector socket 1 are provided at a constant pitch on this outer peripheral surface. ing. The stem 14 of the connector socket 1 is fitted into the fixing groove 15 and is fixed while being prevented from shifting from the rotation holder 12 by the tension of a presser belt 16 covering the outer peripheral surface of the rotation holder 12. A plating tank 6 is provided below the rotary holder 12, and the plating liquid 5 is maintained in the plating tank 6 at a constant level. In the plating tank 6, a plurality of plating brushes 17, which also serve as anodes, are erected on a base plate 19 with their brush bodies 18 facing upward, while being submerged in the plating liquid 5. The spacing between the plating brushes 17 is the same as that of the connector sockets 1 held on the rotary holder 12, that is, each plating brush 17 is positioned directly below each connector socket 1. The base plate 19 is fixed to an arm 20 of a pressure cylinder (not shown) and is movable up and down. The brush body 18 of the plating brush 17 has a cylindrical outer surface 21 corresponding to the pin insertion portion 2 of the connector socket 1, and is attached to the tip of a brush support rod 22 so as to be replaceable.
回転ホルダー１２に保持されたコネクターソケ
ツト１はメツキ槽６の中のメツキブラシ１７に対
応する数だけ、即ち図示の例で６個づつのグルー
プで矢印Ａ方向へ移動する。第２図中Ｂが前処
理、Ｃがメツキ処理そしてＤが後処理の各ゾーン
を示している。またコネクターソケツト１は回転
ホルダー１２のカソード板１３に接触しているこ
とで常にカソード化されている。あるグループが
メツキ槽６の真上に位置した時にベース板１９が
図示せぬ圧力シリンダーにより上昇すると、メツ
キ槽６中でメツキ液５を十分に含浸したメツキブ
ラシ１７は真上のコネクターソケツト１のピン挿
入部２内へメツキブラシ１７の外面２１とコネク
ターソケツト１の筒状内面１１を接触させながら
挿入される。メツキブラシ１７はアノード兼用な
ので、コネクターソケツト１の筒状内面１１とメ
ツキブラシ１７の外面２１が接触した部位にのみ
にメツキが施される。従つてメツキブラシ１７の
上下動ストローク量を調整することによりメツキ
が施される面積の調整を計ることができる。メツ
キが終るメツキブラシ１７は再びメツキ槽６中に
下降してブラシ本体１８に新しいメツキ液５が含
浸させられる。そして、このメツキ槽６中のメツ
キ液５は循環されていて常に新しいメツキ液５で
満たされた状態とされるものである。 The connector sockets 1 held by the rotary holder 12 are moved in the direction of the arrow A by the number corresponding to the number of plating brushes 17 in the plating tank 6, that is, in groups of six in the illustrated example. In FIG. 2, B indicates the pre-processing zone, C indicates the plating process, and D indicates the post-processing zone. Furthermore, the connector socket 1 is in contact with the cathode plate 13 of the rotary holder 12, so that it is always made into a cathode. When a certain group is located directly above the plating tank 6 and the base plate 19 is raised by a pressure cylinder (not shown), the plating brush 17 sufficiently impregnated with the plating liquid 5 in the plating tank 6 is moved to the connector socket 1 directly above. The plating brush 17 is inserted into the pin insertion portion 2 while the outer surface 21 of the plating brush 17 and the cylindrical inner surface 11 of the connector socket 1 are in contact with each other. Since the plating brush 17 also serves as an anode, plating is applied only to the area where the cylindrical inner surface 11 of the connector socket 1 and the outer surface 21 of the plating brush 17 are in contact. Therefore, by adjusting the vertical movement stroke amount of the plating brush 17, the area to be plated can be adjusted. After plating, the plating brush 17 descends into the plating tank 6 again, and the brush body 18 is impregnated with new plating liquid 5. The plating solution 5 in the plating tank 6 is circulated so that it is always filled with new plating solution 5.
また、ピン挿入部２へのメツキブラシ本体１８
の挿入に際しては第４図で示すガイド２３を利用
できる。即ちラツパ状のガイド２３が、その上側
の狭口開口２４をコネクターソケツト１のピン挿
入部２の開口４に相応させた状態で、しかも下側
の広口開口２５はメツキブラシ本体１８に対応位
置決めされる状態で設けられている。従つてコネ
クターソケツト１がメツキ槽６上に位置した時
に、各ガイド２３の上側の狭口開口２４はコネク
ターソケツト１の開口４の真上に必ず位置せしめ
られるようにされている。よつて、メツキブラシ
１７はガイド２３に導びかれより確実にピン挿入
部２内へ挿入されるものである。尚、メツキ物の
筒状内面１１は丸に限らず、角、その他を含む広
概念のもので特にその断面形状が「丸」に限定さ
れるものではない。その他の構成及び作用につい
ては先の実施例と同様に付き、重複説明を省略す
る。 In addition, the brush body 18 is inserted into the pin insertion portion 2.
A guide 23 shown in FIG. 4 can be used for insertion. That is, the wrap-shaped guide 23 is in a state in which its upper narrow opening 24 corresponds to the opening 4 of the pin insertion part 2 of the connector socket 1, and the lower wide opening 25 is positioned correspondingly to the brush body 18. It is set up in a state where Therefore, when the connector socket 1 is positioned on the plating tank 6, the upper narrow opening 24 of each guide 23 is always positioned directly above the opening 4 of the connector socket 1. Therefore, the plating brush 17 is guided by the guide 23 and inserted into the pin insertion portion 2 more reliably. Incidentally, the cylindrical inner surface 11 of the plated material is not limited to a round shape, but has a broader concept including corners and the like, and its cross-sectional shape is not particularly limited to a "round" shape. The other configurations and operations are the same as those in the previous embodiment, and redundant explanation will be omitted.
(ヘ) 発明の効果
この発明に係る小径の筒状内面を有するメツキ
物のメツキ方法は、以上説明してきた如き内容の
ものなので、ノズルの外径を従来のように筒状内
面の小径よりも更に小径なものにして間隙を残す
必要がなく筒状内面の小径に相応する小径サイズ
の外面を有するメツキブラシを使用すればよいの
で、従来の方法などに比べて筒状内面の小径化に
対応できるものであり、またシヨートなどしてメ
ツキできなくなつたり、メツキ装置の故障の原因
となる等の不具合が完全に解消されるものであ
る。(f) Effects of the Invention Since the method of plating a plating object having a small diameter cylindrical inner surface according to the present invention has the contents as explained above, the outer diameter of the nozzle is set to be smaller than the small diameter of the cylindrical inner surface as in the conventional method. Furthermore, there is no need to make the diameter smaller and leave a gap, and it is sufficient to use a plating brush that has an outer surface with a small diameter corresponding to the small diameter of the cylindrical inner surface, so it can accommodate smaller diameters of the cylindrical inner surface compared to conventional methods. Moreover, it completely eliminates problems such as the inability to plate due to shortening or the like, or the failure of the plating device.
またメツキブラシを挿入する際にストローク量
を調整することにより、筒状内面とメツキブラシ
の外面とが接触する面積を調整自在とできるの
で、筒状内面を部分的にメツキできて金その他の
貴金属などの節約ができるという効果もある。 In addition, by adjusting the stroke amount when inserting the plating brush, you can freely adjust the contact area between the inner surface of the cylindrical surface and the outer surface of the plating brush, allowing you to partially plate the inner surface of the cylindrical surface with gold and other precious metals. It also has the effect of saving money.
第１図は筒状内面を有するメツキ物のメツキ方
法の従来例を示す説明図、第２図は本発明の一実
施例に用いる装置の斜視図、第３図は、第２図中
の矢示−線に沿う概略断面図、第４図はガイ
ドを用いる本発明の他の実施例を示す第３図相当
の断面図である。
１……コネクターソケツト、２……ピン挿入
部、３……支持台、４……開口、５……メツキ
液、６……メツキ槽、７……ノズル、８……ポン
プ、９……パイプ、１０……先端部、１１……筒
状内面、１２……回転ホルダー、１３……カソー
ド板、１４……ステム、１５……固定溝、１６…
…押えベルト、１７……メツキブラシ、１８……
ブラシ本体、１９……ベース板、２０……アー
ム、２１……外面、２２……ブラシ支持棒、２３
……ガイド、２４……狭口開口、２５……広口開
口。
FIG. 1 is an explanatory diagram showing a conventional method for plating a plated object having a cylindrical inner surface, FIG. 2 is a perspective view of an apparatus used in an embodiment of the present invention, and FIG. FIG. 4 is a sectional view corresponding to FIG. 3 showing another embodiment of the present invention using a guide. DESCRIPTION OF SYMBOLS 1... Connector socket, 2... Pin insertion part, 3... Support stand, 4... Opening, 5... Plating liquid, 6... Plating tank, 7... Nozzle, 8... Pump, 9... Pipe, 10... Tip, 11... Cylindrical inner surface, 12... Rotating holder, 13... Cathode plate, 14... Stem, 15... Fixing groove, 16...
...Presser belt, 17...Metsuki brush, 18...
Brush body, 19...Base plate, 20...Arm, 21...Outer surface, 22...Brush support rod, 23
...Guide, 24...Narrow opening, 25...Wide opening.
Claims (1)
さの液面を有するメツキ液が入れられているメツ
キ槽の上方に位置させ、 前記メツキ物の真下位置に相当するメツキ液中
に、メツキ物の筒状内面に相応する小径サイズの
外面を有するメツキブラシを、上昇自在に配置
し、 前記メツキ液中でメツキ液を十分に含浸した状
態のメツキブラシを、メツキ液中から上昇させて
メツキ物の筒状内面内へ挿入させ、 前記筒状内面のうちの、メツキブラシと接触し
た部位にのみメツキを施すことを特徴とする小径
の筒状内面を有するメツキ物のメツキ方法。[Claims] 1. A plating object having a small-diameter cylindrical inner surface is positioned above a plating tank containing a plating liquid having a liquid level of a certain height, and corresponds to a position directly below the plating object. A plating brush having an outer surface with a small diameter corresponding to the cylindrical inner surface of the object to be plated is placed in the plating liquid so as to be able to rise freely, and the plating brush sufficiently impregnated with the plating liquid is removed from the plating liquid. A method for plating a plating object having a small-diameter cylindrical inner surface, characterized in that the object is raised and inserted into the cylindrical inner surface of the object, and the plating is applied only to the portion of the cylindrical inner surface that comes into contact with a plating brush.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12785383A JPS6021395A (en) | 1983-07-15 | 1983-07-15 | Method for plating article having cylindrical inside of small diameter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12785383A JPS6021395A (en) | 1983-07-15 | 1983-07-15 | Method for plating article having cylindrical inside of small diameter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6021395A JPS6021395A (en) | 1985-02-02 |
| JPH0332634B2 true JPH0332634B2 (en) | 1991-05-14 |
Family
ID=14970283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12785383A Granted JPS6021395A (en) | 1983-07-15 | 1983-07-15 | Method for plating article having cylindrical inside of small diameter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6021395A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8811982D0 (en) * | 1988-05-20 | 1988-06-22 | Metal Box Plc | Apparatus for electrolytic treatment of articles |
| CN104532315B (en) * | 2014-12-16 | 2017-01-04 | 广西大学 | Horizontal components with holes electro-brush plating machine tool |
| CN109056013B (en) * | 2018-08-22 | 2020-04-10 | 东北石油大学 | Remanufacturing device for brush plating of inner surfaces of parts with ultra-long inner holes |
| CN114318442B (en) * | 2022-03-07 | 2022-05-24 | 河南科技学院 | Pulse-assisted electrochemical deposition metal pipeline inner wall coating device and preparation method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5240182U (en) * | 1975-09-12 | 1977-03-22 |
-
1983
- 1983-07-15 JP JP12785383A patent/JPS6021395A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5240182U (en) * | 1975-09-12 | 1977-03-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6021395A (en) | 1985-02-02 |
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