JPS6039192A - Nozzle device for spray plating - Google Patents

Abstract

PURPOSE:To plate only the required minimum part by providing an insulating part for controlling the part to be plated at the inner surface of an opening to a part of the inserted part of a nozzle which is inserted into the opening hole of a material to be plated. CONSTITUTION:An insulating body 21 is provided to the inserted part 20 of a nozzle 7 which is inserted into the opening hole 2 of a material 1 to be plated so that the insulating part 21 may be faced the part X not to be plated on the inner surface 11 of the opening hole. The nozzle 7 is used as an anode and the material 1 to be plated as a cathode, and a plating soln. 5 is injected into the opening hole 2 from an injection hole 10 of the nozzle 7. Although the plating soln. 5 flows down along the inner surface 11, the part X not to be plated which is faced the insulating part 21 is not plated because the voltage sufficient for plating is not impressed to the part. Meanwhile, the part Y to be plated which is faced an electroconductive part 22 of the nozzle 7 is impressed with sufficient voltage, and a plating deposit 23 is formed. The area to be plated can be controlled by regulating the length of the insulating body 21.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a nozzle device for spray plating that applies plating to the inner surface of a hole in a plated object having an opening, such as a connector socket used in various electronic devices.

(b) Conventional technology and problems Generally, connectors used in electronic devices, etc. are made of copper or copper@r gold, and when it comes to products that require high reliability, they have excellent conductivity and corrosion resistance. Since performance such as wear resistance and ease of soldering is required, plating is required.Plating is mainly gold plating, but depending on the application, rhodium other than gold plating may be used. Alternatively, various types of associative plating may be applied in addition to silver plating.

As a nozzle device for spray plating for plating the inner surface of an opening such as a bottle insertion part of a connector socket, for example, the "Connector Socket" disclosed in Japanese Patent Application Laid-Open No. 58-37193 as shown in FIG. There is a device like the one used in "Inner surface plating method". According to this disclosed technology, the connector socket 1 as a "plated object" is r 1it! The connector socket 1f has a pin insertion part 2 as a hole, and is held vertically by a metal support 3 which also serves as a cathode, with the opening 4 of the pin insertion part 2 facing downward. socket 1
A plating tank 6 containing a plating solution 5 is provided below the
Further, a nozzle 7 is installed in the plating tank 6 so as to be able to move forward and backward with respect to the bottle insertion portion 2. Then, the plating solution 5 in the plating tank 6 is passed through the inner metal of the pipe 9 by the pump 8, and is injected onto the inner surface 11 of the opening from the injection port 10 of the nozzle 7 inserted into the bottle insertion part 2 of the connector socket 1. The plating solution 5 performs the entire plating process while flowing down the inner surface 11 of the opening, is collected into a plating tank 6 provided below, and is circulated and supplied to the nozzle 7 through the pump 8 and the nozzle 9 again. It is.

However, in recent years, as the prices of precious metals such as gold and gold have soared, and as efforts are being made to conserve precious metal resources, there has been an increasing demand for plating only the minimum necessary parts when plating these precious metals. . When plating the inner surface 11 of the opening of the connector socket 1, it is sufficient to plate only the parts necessary for contact between the connector socket 1 and the pin (not shown) (for example, the part near the opening 4). With this device, the entire inner surface 11 of the aperture of the bottle insertion part 2 is plated, and unnecessary parts of the inner surface 11 of the aperture are also plated, which increases the manufacturing cost, which is uneconomical. There was a point.

(c) Purpose of the invention The present invention has been made by focusing on the above-mentioned problems.
Partially plating the inner surface of the aperture of a plated object having an aperture [first invention], and partially plating the inner surface of the aperture (/(while plating the nozzle and inserting the nozzle into the aperture and positioning the center within the aperture) [Second Invention] It is an object of the present invention to provide a nozzle device for spray plating that can be operated more smoothly and reliably.

B) Structure of the Invention In order to achieve the above object, the present invention includes a part of the nozzle insertion part inserted into the aperture of the plated object, including an insulating part for regulating the part to be plated on the inner surface of the aperture. [First invention]
In addition, together with this insulating portion, a center positioning body which also serves as a guide and has an outer diameter corresponding to the size of the opening and a shape that does not obstruct the flow of the plating solution is provided.

(e) Examples The details of the present invention will be explained below with reference to the drawings.

, 112 to 4 are part of the present invention [first invention] 7+I
An IJ example is shown. In the following description, parts common to those in the prior art are given the same reference numerals, and redundant description will be omitted.

1 is a connector socket as a "plated item", 12
indicates a rotating holder. A cup 12 plate 13 is provided on the outer peripheral surface of this rotary holder 12, and this outer peripheral surface V
A plurality of fixing grooves 15 corresponding to approximately half the outer peripheral surface of the stem 14 of the connector socket 1 are provided at a constant pitch.

The stem 14 of the connector socket 1 is fitted into the fixing groove 15 and is fixed while being prevented from shifting from the rotating holder 12 by the tension of a presser belt 16 covering the outer peripheral surface of the rotating holder 12. A plating liquid receiving tank 17 is provided below the rotating holder 12, and in this plating liquid receiving tank 17, a plurality of nozzles 7 which also serve as anodes are directed onto the bath A-jar 18 with their respective injection ports 10 facing upward. It is installed upright so that it can be replaced freely. The intervals between the nozzles 7 are the same as those of the connector sockets 1 held in the rotary holder 12, that is, each nozzle 7 is positioned directly below each connector socket 1.

Suhassha 18 is an arm 19 of a pressure cylinder (not shown).
It is fixed and can move up and down. The nozzle 7 communicates with the inside of the snout ξ-jar 18 and
The plating liquid 5 supplied into the tank under a constant pressure is injected from an injection port 10. An insulating part 21 made of an insulator is formed on the injection port 10 side of the nozzle insertion part 20, which is the part inserted into the bottle insertion part 2 of the nozzle 7, and the part of the nozzle 7 other than the insulating part 21 is The conductive portion 22 is made of a metal with good conductivity. The opening (length) occupied in the nozzle insertion part 20 of this insulating part 21 is the opening (length) of the opening inner surface 1
This is established by the non-plating target part XI in 1, and as a result, the plating target part Yi is determined.

Next, the action will be explained.

The connector sockets 1 held by the rotary holder 12 are moved in the direction of the arrow N1 by a number corresponding to the number of nozzles 7 in the plating tank 6, that is, in groups of six in the illustrated example. In FIG. 2, 8 indicates the pre-treatment zone, 0 the plating treatment zone, and 'D the post-treatment zone. Also connector socket 1
is in contact with the cathode plate 13 of the rotating holder 12, so that it is always turned into a cathode. When a certain group is positioned directly above the plating tank 6, when the spanner 18 is raised by a pressure cylinder (not shown), the nozzle 7 is first inserted into the bottle insertion part 2 of the connector socket 1, and then positioned within the bottle insertion part 2. Ru.

When the nozzle 7 is positioned within the bottle insertion portion 2, the plating solution 5 is first supplied into the sparner 18 at a constant pressure.
Next, it passes through the inside of the nozzle 7 and is injected into the bottle insertion part 2 from the injection port 10.

The sprayed plating solution 5 is applied to the inner surface 11 of the opening in the bottle insertion part 2.
However, sufficient potential is not applied to the non-plating target area K) facing the insulating part 21 in the nozzle insertion part 20 in the bottle insertion part 2. Since there is no plating, no plating will be applied.

- In this case, a sufficient potential is applied to the plating target part IY) facing the conductive part 22 of the nozzle insertion part 20, so that a precipitate 23 can be obtained on the plating target part Y. Therefore, by adjusting the opening (length) occupied by the insulating part 21 in the nozzle insertion part 20 and by adjusting the vertical movement stroke of the nozzle 7, the area to be plated can be adjusted. can be partially plated.

5 to 7 show examples of the present invention [second invention] (
It is 1. In the nozzle device according to the second invention, the nozzle insertion portion 20 of the nozzle 7 is provided with an insulating portion 21 and a center positioning body 25 which also serves as a guide and has an outer diameter 24 corresponding to the aperture size.

Next, the action will be explained.

First, when the nozzle 7 is inserted into the bottle insertion part 2, the nozzle 7 is smoothly inserted into the bottle insertion part 2 by the guide of the center positioning body 25. At the same time, the nozzle 7 inserted into the bottle insertion part 2 is always positioned at the center Vζ of the bottle insertion part 2 by the center positioning body 25 as shown in FIG. The central position iM determining body 25, which also serves as a guide, is shaped like a ``shape'' (in the case of FIGS. 5 and 6) that does not obstruct the flow of the plating solution 5, so that the plating solution 5 is sprayed. The plating solution 5 is sprayed smoothly from the opening 10, and since the nozzle 7 is positioned at the center 1 of the bottle insertion part 2, the sprayed plating solution 5 is sprayed onto the inner surface 11 of the opening.
All parts of the water fall down equally and are collected. Furthermore, since the distance between the nozzle 7 and the inner surface 11 of the aperture is the same at all parts, an equal potential is applied to the inner surface 11 of the aperture (the bottom part V).

Further, the shape of the center positioning body 25 which also serves as a guide is not limited to the shape shown in FIG.
For example, Fig. 7(a) (b)
) The one shown in (c) is also fully applicable. In FIG. 7(a), four rod-shaped center positioning bodies 25 are provided on the outer peripheral surface of the insulating section 21. The outer diameter 24 of this center positioning body 25 corresponds to the size of the opening, and the plating liquid 5 is sprayed from the injection port 1o at the tip. In FIG. 7(b), the tip is formed of a tapered insulating part 21, and this tapered insulating part 21 is a center positioning member. It also serves as 5. Jet nozzle 10
is provided at the center [one constricted part below the R-determining body 25].

Furthermore, in the case of FIG. 7(c), unlike the other cases, a conductive part 22 is provided at the tip of the truer, an insulating part 21 is provided below the conductive part 22, and a center positioning body that also serves as a guide is provided on the outer peripheral surface of the conductive part 22. 25 are provided.

The injection port 10 is provided at an inclined angle on the outer peripheral surface of the insulating section 21 so that the plating solution 5 hits the circular bottom surface of the bottle insertion section 2. Therefore, when plating is performed using the nozzle 7 of (c), the plating is applied only to the vicinity of the bottom surface of the bottle insertion portion 2 facing the conductive portion 22. still,
The other configurations and functions of the second invention are the same as those of the first invention, and therefore their explanations will be omitted.

In addition, in the above WW and Akira, the connector socket 1 side was fixed and the nozzle 7 side was made movable, but of course it is also possible to conversely make the plated object 1 side movable and the nozzle 7 side fixed. Furthermore, it is also possible to make both of them movable, and the point is that as long as the nozzle 7 can be inserted into the opening 2 of the plated object 1, the plated object 1 and the nozzle 7 can be arranged in any state. All of these are also covered by the present invention.

Also, the inner surface of the hole 11 of the plated object 1 is connected to the connector socket 1.
Needless to say, it is not limited to a cylindrical inner surface like the cylindrical insertion part 2.

(f) As described in detail, according to the present invention, the structure is such that a part of the nozzle insertion part inserted into the aperture of the plated object is provided with a part for regulating the part to be plated on the inner surface of the aperture. The structure includes an insulating part [first invention] and, together with the insulating part, a center positioning body that also serves as a guide and has an outer diameter corresponding to the aperture size and a shape that does not obstruct the flow of the plating solution [second invention]. Therefore, plating is not applied to the inner surface of the opening facing the insulating part of the nozzle insertion part, that is, the non-plating target area. Therefore, the area to be plated can be adjusted by adjusting the proportion (length) occupied by the insulating part of the nozzle insertion part, or by adjusting the dynamic stroke F on the nozzle. When the inner surface of the opening can be partially plated with gold or other noble metal, the 'ft metal can be saved [first invention].

In addition to the above-mentioned effects, the nozzle can be inserted into the aperture smoothly by the center positioning body that also serves as a guide provided in the nozzle insertion part, and the nozzle inserted into the aperture is Similarly, the centering body ensures that the plating is centered within the aperture. Therefore, there is less risk of a short circuit caused by contact between the conductive part of the nozzle, which also serves as an anode, and the inner surface of the aperture, which is a cathode. is the same on all parts, so a uniform potential can be applied to the plating target area on the inner surface of the hole.At the same time, the injected plating solution flows down evenly on all parts of the inner surface of the hole, so it is possible to apply a uniform potential to the plating target area on the inner surface of the hole. Effect of being able to plate only a portion with a uniform thickness [Second invention]
There is.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing a conventional example of a nozzle device for spray plating. Fig. 2 is a perspective view of a nozzle device for spray plating showing one embodiment of the present invention (gJfJ1 invention). Fig. 3 is a schematic sectional view taken along the arrow II-III line in Fig. 2. is the arrow in Figure 3 that indicates the nozzle inserted state■
An enlarged sectional view of the section. FIG. 5 is a sectional view corresponding to FIG. 4 showing an embodiment of the present invention [second invention]. 6 is a sectional view taken along the arrow vr-vrs in FIG. 5, and FIGS. 7(a), 7(b), and 7(c) respectively show modified examples of the center positioning body that also serves as a guide according to the second invention. FIG. 1... Plated object (connector socket) 2... Opening hole (bottle insertion part) 5... Plating liquid 7... Nozzle 10... Spray port 11... Opening inner surface 20... Nozzle Insertion part 21...Insulating part 24...Outer diameter 25...Center positioning body Y...Plating target Fig. 1 Fig. 2 587 Fig. 3 Fig. 5 Cow Fig. 6 Fig. 7 (O) (b) (C') 4

Claims (2)

[Claims] (1) For injection plating, the nozzle inserted into the opening of the plating object is inserted into the opening of the plated object, and the plating liquid is sprayed through the injection port of the nozzle insertion part, which is inserted into the opening of the plated object, and the inner surface of the opening of the plating object that has been turned into a cathode is plated. In nozzle equipment. A nozzle device for spray plating, characterized in that the nozzle insertion portion includes an insulating portion in a part thereof for regulating a portion to be plated on the inner surface of the opening. (2) A nozzle device for spray plating that sprays plating solution from the injection port of the nozzle insertion part that also serves as an anode and is inserted into the aperture of the plating object to plate the inner surface of the aperture of the plating object that has become a cathode. In. The nozzle insertion part includes an insulating part in a part thereof for regulating the plating target area on the inner surface of the opening, and has an outer diameter corresponding to the opening size and a shape that does not interfere with the flow of the plating solution. A nozzle device for spray plating characterized by being provided with a center positioning body that also serves as a guide.