JPH0332421U - - Google Patents
Info
- Publication number
- JPH0332421U JPH0332421U JP1989092074U JP9207489U JPH0332421U JP H0332421 U JPH0332421 U JP H0332421U JP 1989092074 U JP1989092074 U JP 1989092074U JP 9207489 U JP9207489 U JP 9207489U JP H0332421 U JPH0332421 U JP H0332421U
- Authority
- JP
- Japan
- Prior art keywords
- stem
- die
- semiconductor
- bonding
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/0711—
-
- H10W72/073—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989092074U JPH0810187Y2 (ja) | 1989-08-04 | 1989-08-04 | ダイボンディング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989092074U JPH0810187Y2 (ja) | 1989-08-04 | 1989-08-04 | ダイボンディング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0332421U true JPH0332421U (enExample) | 1991-03-29 |
| JPH0810187Y2 JPH0810187Y2 (ja) | 1996-03-27 |
Family
ID=31641520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989092074U Expired - Lifetime JPH0810187Y2 (ja) | 1989-08-04 | 1989-08-04 | ダイボンディング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810187Y2 (enExample) |
-
1989
- 1989-08-04 JP JP1989092074U patent/JPH0810187Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0810187Y2 (ja) | 1996-03-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |