JPH0330430U - - Google Patents

Info

Publication number
JPH0330430U
JPH0330430U JP8995389U JP8995389U JPH0330430U JP H0330430 U JPH0330430 U JP H0330430U JP 8995389 U JP8995389 U JP 8995389U JP 8995389 U JP8995389 U JP 8995389U JP H0330430 U JPH0330430 U JP H0330430U
Authority
JP
Japan
Prior art keywords
resin
resin sealing
lead frame
sealing device
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8995389U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8995389U priority Critical patent/JPH0330430U/ja
Publication of JPH0330430U publication Critical patent/JPH0330430U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP8995389U 1989-07-31 1989-07-31 Pending JPH0330430U (US07345094-20080318-C00003.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8995389U JPH0330430U (US07345094-20080318-C00003.png) 1989-07-31 1989-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8995389U JPH0330430U (US07345094-20080318-C00003.png) 1989-07-31 1989-07-31

Publications (1)

Publication Number Publication Date
JPH0330430U true JPH0330430U (US07345094-20080318-C00003.png) 1991-03-26

Family

ID=31639502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8995389U Pending JPH0330430U (US07345094-20080318-C00003.png) 1989-07-31 1989-07-31

Country Status (1)

Country Link
JP (1) JPH0330430U (US07345094-20080318-C00003.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0577333U (ja) * 1992-03-24 1993-10-22 有限会社聖建設 外側断熱基礎工事における型枠及び鉄筋の保持具及び型枠緊結金物の接続コネクター
JPH072540U (ja) * 1992-03-05 1995-01-13 靖郎 中西 折りたたみ可能なコンクリート打設用金網型枠。

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH072540U (ja) * 1992-03-05 1995-01-13 靖郎 中西 折りたたみ可能なコンクリート打設用金網型枠。
JPH0577333U (ja) * 1992-03-24 1993-10-22 有限会社聖建設 外側断熱基礎工事における型枠及び鉄筋の保持具及び型枠緊結金物の接続コネクター

Similar Documents

Publication Publication Date Title
JPH0330430U (US07345094-20080318-C00003.png)
JPH0477261U (US07345094-20080318-C00003.png)
JPS61102048U (US07345094-20080318-C00003.png)
JPH0256450U (US07345094-20080318-C00003.png)
JPS61186236U (US07345094-20080318-C00003.png)
JPS6163849U (US07345094-20080318-C00003.png)
JPH02132944U (US07345094-20080318-C00003.png)
JPH03101542U (US07345094-20080318-C00003.png)
JPH0233451U (US07345094-20080318-C00003.png)
JPH028034U (US07345094-20080318-C00003.png)
JPS61102055U (US07345094-20080318-C00003.png)
JPS61146960U (US07345094-20080318-C00003.png)
JPS58140647U (ja) リ−ドフレ−ム
JPS62196352U (US07345094-20080318-C00003.png)
JPS60125730U (ja) 半導体装置の樹脂封止金型
JPH0463153U (US07345094-20080318-C00003.png)
JPS594644U (ja) 樹脂モ−ルド半導体装置
JPS63172139U (US07345094-20080318-C00003.png)
JPS61179746U (US07345094-20080318-C00003.png)
JPS5844841U (ja) 樹脂封止形半導体装置のモ−ルド金型
JPS59135644U (ja) 樹脂封止型半導体装置
JPS6194358U (US07345094-20080318-C00003.png)
JPH01115251U (US07345094-20080318-C00003.png)
JPS6377352U (US07345094-20080318-C00003.png)
JPH0316346U (US07345094-20080318-C00003.png)