JPH03297594A - Brazing filler metal and brazing method - Google Patents
Brazing filler metal and brazing methodInfo
- Publication number
- JPH03297594A JPH03297594A JP10267190A JP10267190A JPH03297594A JP H03297594 A JPH03297594 A JP H03297594A JP 10267190 A JP10267190 A JP 10267190A JP 10267190 A JP10267190 A JP 10267190A JP H03297594 A JPH03297594 A JP H03297594A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- metal
- melting point
- weight
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 title abstract description 61
- 239000002184 metal Substances 0.000 title abstract description 61
- 239000000945 filler Substances 0.000 title abstract 4
- 239000000463 material Substances 0.000 claims abstract description 32
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- 229910052738 indium Inorganic materials 0.000 claims abstract description 9
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000010953 base metal Substances 0.000 claims 2
- 230000009545 invasion Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 description 32
- 230000008018 melting Effects 0.000 description 25
- 150000002739 metals Chemical class 0.000 description 22
- 239000010949 copper Substances 0.000 description 17
- 230000008020 evaporation Effects 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000011651 chromium Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 206010067482 No adverse event Diseases 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- -1 copper Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
Ａ 産業上の利用分野
本発明は、ロウ材とロウ付け方法に係り、母材のＣｕ、
またはＣｕ−Ａｇ１：Ｉｎを添加して形成したロウ材に
関したものである。DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a brazing material and a brazing method.
Or it relates to a brazing material formed by adding Cu-Ag1:In.
Ｂ 発明の概要
本発明は、母材のＣｕ（銅）またはＣｕ（銅）Ａｇ（銀
）に、Ｉｎ（インジウム）を添加して形成したロウ材で
あり、例えば低融点金属を含有する金属部材のロウ付は
接合、及び低融点金属を含有する金属部材の近傍に位置
する部材相互のロウイ」け接合に適したロウ材とロウ付
（Ｊ方法を得るものである。B. Summary of the Invention The present invention is a brazing material formed by adding In (indium) to a base material of Cu (copper) or Cu (copper) Ag (silver), and is suitable for use in metal members containing low melting point metals, for example. The brazing method is to obtain a brazing material and brazing method (J method) suitable for joining and brazing joints of members located in the vicinity of metal members containing a low melting point metal.
Ｃ２従来の技術
従来、低融点金属、例えばＢｉ（ビスマス）を含有する
金属部材として、例えば電極接点がある。C2 Prior Art Conventionally, as a metal member containing a low melting point metal such as Bi (bismuth), there is an electrode contact, for example.
この種の電極接点においては、低融点金属を０．１重量
％以」二含有させることが電気的性能の要求から多々行
われている。In this type of electrode contact, it is often used to contain a low melting point metal of 0.1% by weight or more due to demands for electrical performance.
しかし、低融点金属を多く含むと、ロウ付は加熱時に、
ロウ材の流動温度以下で低融点金属が接合部の界面に析
出（または溶出）し、ロウ材の「ぬれ性」を阻害して、
結果としてロウ付は出来ない現象を引き起こしていた。However, if a large amount of low-melting point metal is included, brazing will occur during heating.
Low melting point metals precipitate (or elute) at the interface of the joint at temperatures below the flow temperature of the brazing material, inhibiting the "wettability" of the brazing material.
As a result, a phenomenon occurred in which soldering was not possible.
また、接合出来たとしても、低融点金属がロウ付は接合
部に存在すると、接合強度が著しく低下し、容易に取れ
てしまうものであった。Further, even if the bonding is possible, if a low-melting point metal is present in the soldered joint, the bonding strength will be significantly reduced and it will easily come off.
」二連のようなことから、低融点金属を含有する金属部
材の接合は、機械的に変形（例えば「かしめ」）させる
か、ネジ止め、といった手段で行っている。Because of the double series, metal members containing low melting point metals are joined by mechanical deformation (for example, caulking) or screwing.
Ｄ 発明が解決しようとする課題
従来は、低融点金属を含有する金属部材の接合は、機械
的な手段で接合するものであったので、これを電気、電
子機器の接点と導体との接合に用いた場合には多頻度の
開閉により、接合強度が低下して接触抵抗が増加したり
、またそれに伴う発熱の発生等の問題があった。さらに
は、接点が脱落してしまう場合もあり、耐久性は悪いも
のであった。D Problems to be Solved by the Invention Conventionally, metal members containing low melting point metals were joined by mechanical means. When used, frequent opening and closing causes problems such as a decrease in bonding strength, an increase in contact resistance, and the generation of heat associated with this. Furthermore, the contact points sometimes fall off, resulting in poor durability.
また、ロウ付は加熱時に電極接点表面より蒸発した低融
点金属の蒸気は電極接点のロウ付は接合部以外の各所の
ロウ付は部に飛散侵入して悪影響を及ぼずことがあった
。例えば容器の気密シールのロウイ」け部に侵入して接
合強度を害し、リークに至らしめる恐れがあった。In addition, when brazing, the vapor of a low-melting point metal that evaporates from the surface of the electrode contact during heating scatters and enters the brazing parts of the electrode contact at various locations other than the joint, and has no adverse effect. For example, there is a risk that it may enter the lowered part of the airtight seal of the container, impairing the joint strength and causing a leak.
Ｅ 課題を解決するための手段
本発明者らは、種々の実験を行った結果、■ まず低融
点金属（例えばＢｉ）を含有する金属におけるＢ】の蒸
発飛散が活発となる温度に着目した。E. Means for Solving the Problems As a result of various experiments, the present inventors first focused on the temperature at which evaporation and scattering of B in metals containing low melting point metals (eg, Bi) becomes active.
第２図は、５０Ｃｕ−４０Ｃｒ−１０Ｂｉ （重量％）
の組成からなる金属部材において、加熱温度（横軸）と
重量減少率（縦軸）との関係を不活性雰囲気（真空中）
で調べたものである。Figure 2 shows 50Cu-40Cr-10Bi (wt%)
The relationship between heating temperature (horizontal axis) and weight loss rate (vertical axis) in a metal member with the composition of inert atmosphere (vacuum)
This is what I investigated.
この図から、温度７００℃辺りから急激に重量が減少す
る、っまりＢｉの蒸発飛散が７００ ’Ｃ辺りから活発
となることが判った。換言すれば７゜０°Ｃ以下の温度
でロウ付（Ｊずれば、Ｂｉの蒸発飛散はほとんどなく、
悪影響はないことが判った。From this figure, it was found that the weight suddenly decreased from around 700°C, and the evaporation and scattering of Bi became active from around 700'C. In other words, if brazing is done at a temperature below 7°0°C, there will be almost no evaporation and scattering of Bi.
It was found that there were no adverse effects.
■ 上記■のことから７００℃以下の温度でロウイ」１
）できるロウ材として、Ｃｕ−Ｔｎ、更にはＡｇ−Ｃｕ
−Ｉｎで形成すれば、安定にロウ付は接合できることを
見い出した。■ From the above ■, at a temperature of 700℃ or less,
) As a brazing material that can be used, Cu-Tn, and even Ag-Cu
It has been found that stable brazing bonding can be achieved by using -In.
すなわち、Ｃｕ−Ｉｎ、Ａｇ−Ｃｕ−Ｉｎでロウ材を形
成すれば、Ｂｉの蒸発飛散のない７００℃以下の温度で
ロウ付けできるばかりでなく、ロウ付は部にＣｕ−Ｉｎ
、Ａｇ−Ｃｕ−Ｉｎの拡散層が存在し、これによって低
融点金属の接合界面への侵入を抑制でき、安定にロウ付
けできることが判った。In other words, if the brazing material is made of Cu-In or Ag-Cu-In, not only can brazing be performed at temperatures below 700°C without evaporation and scattering of Bi, but also brazing can be performed using Cu-In in the part.
It was found that there is a diffusion layer of Ag-Cu-In, which suppresses the intrusion of low-melting point metal into the bonding interface and enables stable brazing.
従って、本発明は、例えば低融点金属を含有していても
これの悪影響を受けないロウ材とロウ付は方法を提供す
るものであり、
（１）■ Ｃｕが６７重量％、Ｉｎが３３重量％で形成
したロウ材。Therefore, the present invention provides a brazing material and a brazing method that are not adversely affected even if they contain low-melting point metals. % wax material.
■ Ｃｕが２８〜５８重量％、Ａｇカ月１〜５８重量％
、Ｉｎが１３〜３８重量％で形成したロウ材。■Cu 28-58% by weight, Ag 1-58% by weight
, a brazing material containing 13 to 38% by weight of In.
（２）そして、低融点金属を含有する金属部材における
この低融点金属の蒸発飛散が活発とならない７００℃以
下の温度にてロウ付けする方法である。(2) This is a method of brazing at a temperature of 700° C. or lower, at which the evaporation and scattering of the low melting point metal in the metal member containing the low melting point metal does not become active.
しかして、Ａｇ、Ｃｕ、Ｉｎの割合、また温度が上記の
関係より外れる場合には安定したロウ付は接合を得るこ
とが出来なかった。However, if the proportions of Ag, Cu, and In or the temperature deviate from the above relationships, stable brazing could not be achieved.
なお、
■ 低融点金属としては、例えば、Ｂｊ（ビスマス）、
Ｓｂ （アンチモン）等の低融点金属として良く知られ
ている金属が該当する。Note that ■ low melting point metals include, for example, Bj (bismuth),
Metals that are well known as low melting point metals such as Sb (antimony) fall under this category.
■ 低融点金属を含有する金゛属としては、銅、銅合金
、銀、銀合金、等の導電性に富む金属が該当する。■ Metals containing low melting point metals include highly conductive metals such as copper, copper alloys, silver, and silver alloys.
■ ロウ付け各成分の粉末を所定量混合して所定の形状
に加工するのが各成分の特性が活かされるので好ましい
。(2) Brazing It is preferable to mix a predetermined amount of powder of each component and process it into a predetermined shape, since the characteristics of each component can be utilized.
また、所望のロウ材形成は、金型にてリング状、円板状
に圧縮成形する。または、まず板状に圧縮成形した後に
レーザ等にて簡便に得られる。Further, the desired brazing material is formed by compression molding into a ring shape or a disk shape using a mold. Alternatively, it can be easily obtained by first compression molding into a plate shape and then using a laser or the like.
又は、混合粉末に有機バインダーを混ぜてペースト状に
して塗布することでも差し支えない。Alternatively, an organic binder may be mixed with the mixed powder to form a paste and then applied.
なお、粉末は、−１００メツシユ以下（１４９μｍ以下
）の粒径のものが好ましい。The powder preferably has a particle size of -100 mesh or less (149 μm or less).
■ ロウ材の使用条件としては、
ａ：低融点金属が存在する場合のロウ付は温度は、７０
０℃以下。■ The conditions for using brazing metal are as follows: a: For brazing when a low melting point metal is present, the temperature is 70°C.
Below 0℃.
ｂ：低融点金属が存在しない場合のロウ付は温度は、６
００℃以上。b: The temperature for brazing when there is no low melting point metal is 6
00℃ or higher.
Ｃ、ロウ付は雰囲気は、真空中、不活性ガス中。C. The atmosphere for brazing is vacuum or inert gas.
とするのが好ましい。It is preferable that
■ 接合できる金属は、低融点金属を含有したものに限
らず適用できる。■Metals that can be joined are not limited to those containing low melting point metals.
Ｆ１作用
本発明によるロウ材を使用した場合には、加熱温度が７
００°Ｃ以下でロウ付けできるので、低融点金属の蒸発
飛散が活発化しない。従って、低融点金属のロウ付は部
への侵入が無くロウ付けを安定に行うことができる。し
かも、ロウ付は接合部にＡ ｇ ｓ Ｇ ｕ ％ Ｉ
ｎの拡散層が存在することで低融点金属の接合界面へ
の侵入を抑制でき、低融点金属を含有する金属と同種金
属（または含まない金属）を安定にロウ付けすることが
できる。F1 action When using the brazing material according to the present invention, the heating temperature is 7.
Since brazing can be performed at temperatures below 00°C, the evaporation and scattering of low melting point metals does not become active. Therefore, brazing with low melting point metals can be performed stably without intrusion into the parts. Moreover, brazing has A g s Gu % I at the joint part.
The presence of the n diffusion layer makes it possible to suppress the intrusion of the low melting point metal into the bonding interface, making it possible to stably braze the same type of metal as the metal containing the low melting point metal (or the metal not containing it).
Ｇ、実施例 本発明を以下の実施例に基づいて詳細に説明する。G. Example The present invention will be explained in detail based on the following examples.
（実施例−１）
Ｃｕが５０重量％、Ｃｒが４０重量％、Ｂｉが１０重量
％の成分からなる、低融点金属含有の金肩部材と無酸素
銅との接合例である。(Example-1) This is an example of joining a gold shoulder member containing a low melting point metal and oxygen-free copper, which is composed of components of 50% by weight of Cu, 40% by weight of Cr, and 10% by weight of Bi.
（ａ）低融点金属を含有した部材について１００メツシ
ユの粒径のＣｒ（クロム）粉末を、アルミナ容器（内径
６８ｍｍ）に約１６０ｇ入れ、このＣｒ粉末上にＣｕ−
Ｂ１合金（約４００ｇ）を載置し、容器に蓋をかぶせ、
これを真空炉内にて脱ガスと共にＣｕ−Ｂ１合金の融点
以下の温度で加熱処理して、まずＣｒ粒子を拡散結合さ
せて多孔質の溶浸母材を形成する。(a) For a member containing a low melting point metal, approximately 160 g of Cr (chromium) powder with a particle size of 100 mesh is placed in an alumina container (inner diameter 68 mm), and Cu-
Place B1 alloy (approximately 400 g) and cover the container with a lid.
This is degassed and heat treated in a vacuum furnace at a temperature below the melting point of the Cu-B1 alloy to first diffusely bond the Cr particles to form a porous infiltrated base material.
その後温度を上げて、Ｃｕ、Ｂｉを溶浸母材に溶浸させ
る。Thereafter, the temperature is raised to infiltrate Cu and Bi into the infiltration base material.
この際にアルミナ容器内は、Ｂｉ蒸気を含んだ雰囲気と
なり、Ｂ１を多量に含有した複合金属が得られる。At this time, the inside of the alumina container becomes an atmosphere containing Bi vapor, and a composite metal containing a large amount of B1 is obtained.
こうして得られた金属材料を、容器から取り出し、外面
を機械加工して所定の寸法形状にする。The metal material thus obtained is removed from the container and its outer surface is machined into a predetermined size and shape.
（ｂ）ロウ材について
３２５メツシユの粒径のＡｇ、Ｃｕ、ｒｎの粉末を用意
し、Ａｇを４５ｇ、Ｃｕを３０ｇ１１ｎを２５ｇの割合
（第１図のイ点）で混合機にて充分に混合する。(b) For the brazing material, prepare Ag, Cu, and rn powders with a particle size of 325 mesh, and thoroughly mix them in a mixer at a ratio of 45 g of Ag, 30 g of Cu, and 25 g of 11n (point A in Figure 1). do.
得られた混合粉末から約１．５ｇ分取し、径が４０ ｍ
ｍの金型に均一に充填し、３０トンで加圧成形して厚
さ約０．４ｍｍの円形状の薄い成形体を得る。Approximately 1.5 g was collected from the obtained mixed powder, and the diameter was 40 m.
The mixture was uniformly filled into a mold of 300 m in diameter and press-molded at 30 tons to obtain a circular thin molded product with a thickness of about 0.4 mm.
（ｃ）ロウ付けについて
上記ロウ材（Ａｇ−Ｃｕ−Ｉ ｎ）を、前記ＣｕＣｒ−
Ｂ１重合部祠と、無酸素銅からなる部材との間に入れ、
これらをアルミナ容器内に設置し、且つ蓋をし、真空炉
にて加熱処理（６６０℃、１１
２
５分間）して接合した。(c) About brazing The brazing material (Ag-Cu-In) is
Insert between the B1 polymerization part shrine and a member made of oxygen-free copper,
These were placed in an alumina container, covered with a lid, and heat-treated in a vacuum furnace (660° C., 11 2 5 minutes) to bond them.
（ｄ）ロウ付けの結果について
上記のようにして得られた接合物は、強固に接合されて
おり、しかもロウ材も十分に流動していることが確認さ
れた。(d) Results of brazing It was confirmed that the bonded product obtained as described above was firmly bonded, and that the brazing material was sufficiently fluid.
また、Ｘ線マイクロアナライザにて接合部の断面を観察
すると、Ａｇ、Ｃｕ、Ｔｎの拡散層によって、Ｂｉの界
面への析出は防止され、安定したロウ付は接合層が形成
されていることが確認された。Furthermore, when observing the cross section of the joint using an X-ray microanalyzer, it was found that the diffusion layer of Ag, Cu, and Tn prevents Bi from precipitating at the interface, and that stable brazing results in the formation of a joint layer. confirmed.
（その他の実施例）
」二連の実施例−１と同様な条件で、ロウ材の成分を変
えてロウ付は接合について調べた。その結果は第１図に
示す成分範囲であれば上述の場合と同様の結果が得られ
ることが判った。すなわち、■ ロウ材をＣｕ−Ｉｎで
形成し、且つ両者の成分比（重量比）を、Ｃｕが６７重
量％、Ｉｎが３３重量％とすれば良いことが判った。(Other Examples) Under the same conditions as in Example 1, brazing and joining were investigated by changing the components of the brazing material. The results showed that the same results as in the above case could be obtained within the component range shown in FIG. That is, (2) it has been found that it is sufficient to form the brazing material with Cu--In, and to set the component ratio (weight ratio) of the two to 67% by weight of Cu and 33% by weight of In.
■ また、ロウ材をＡｇ−Ｃｕ−Ｉｎで形成し、且つ３
者の成分比（重量比）を、Ｃｕが２８〜５８重量％、Ａ
ｇが１１〜５８重量％、Ｉｎが１３〜３８重量％とすれ
ば良いこ七が判った。■Also, the brazing material is made of Ag-Cu-In, and
The component ratio (weight ratio) of Cu is 28 to 58% by weight, A
It has been found that it is sufficient to set g to 11 to 58% by weight and In to 13 to 38% by weight.
（比較例）
比較のために一般的に知られている、ＣｕＭ ｎ −Ｎ
ｉ系ロウ材を用い、温度条件を９５０℃とし、且つ他
の条件は上記実施例−■と同様にしてロウ付けを試みた
が剥離し、ロウ付けができなかった。(Comparative example) For comparison, generally known CuM n -N
Brazing was attempted using i-series brazing material and the temperature condition was 950° C., and other conditions were the same as in Example-2 above, but peeling occurred and brazing could not be performed.
Ｈ０発明の効果 本発明によるロウ付け、Ａｇ−Ｃｕ−Ｉｎ。Effect of H0 invention Brazing according to the invention, Ag-Cu-In.
Ｃｕ−Ｉｎを主成分としていることから、ロウ付げ加熱
温度を７００℃以下で行うことができるので、低融点金
属の蒸発飛散を効果的に防止でき、これによってロウ付
は部に低融点金属の侵入がなくなる。Since the main component is Cu-In, the brazing heating temperature can be performed at 700°C or lower, which effectively prevents the evaporation and scattering of low melting point metals. This eliminates the intrusion of
しかも、ロウ付は部にＡｇ、Ｃｕ、Ｉｎの拡散層が形成
されるので、この拡散層が低融点金属の接合界面への侵
入を抑制できることから、従来ロウ付けが不可能であっ
た多量（１０重量％以上）の低融点金属を含有する導電
性金属のロウ付けができるようになった。Moreover, since a diffusion layer of Ag, Cu, and In is formed in the brazing process, this diffusion layer can suppress the intrusion of low-melting point metals into the bonding interface. It is now possible to braze conductive metals containing low melting point metals (10% by weight or more).
従って、ロウ付は安定化を一層図れるばかりでなく、電
気、電子機器における低融点金属を含有する電極接点を
備えた機器に適用した場合には、接触抵抗の低減、安定
化及び発熱防止等の特性安定化を図ることができ、さら
には、耐久性の向上が図れ、品質向上に寄与できるもの
である。Therefore, brazing not only improves stability, but also reduces contact resistance, stabilizes, and prevents heat generation when applied to electrical and electronic devices with electrode contacts containing low-melting point metals. Characteristics can be stabilized, durability can be improved, and quality can be improved.
第１図は、本発明のロウ材に係る組成範囲の説明図、第
２図は、加熱温度と重量減少率との関係２図である。
崖（°Ｃ）
平成 ２年７月６
日
第１図
本発明に用いるロウ材の組成範囲の説明図１゜
事件の表示
平成２年特許願第１０２６７１号
ｎ
２゜
発明の名称
ロウ材とロウ付方法
３゜
補正をする者
事件との関係FIG. 1 is an explanatory diagram of the composition range of the brazing material of the present invention, and FIG. 2 is a diagram showing the relationship between heating temperature and weight reduction rate. Cliff (°C) July 6, 1990 Figure 1 Explanatory diagram of the composition range of the brazing material used in the present invention 1° Display of the incident 1990 Patent Application No. 102671 n 2° Name of the invention Brazing material and wax Attachment method 3゜Relationship with the person making the amendment case
Claims (4)
Ｃｕを用い、ＣｕとＩｎとの関係を、Ｃｕが６７重量％
、Ｉｎが３３重量％としたことを特徴とするロウ材。(1) A brazing material containing In, using Cu as the base metal, with the relationship between Cu and In being 67% by weight.
, In is 33% by weight.
ＣｕとＡｇを用い、ＣｕとＡｇとＩｎとの関係を、Ｃｕ
が２８〜５８重量％、Ａｇが１１〜５８重量％、Ｉｎが
１３〜３８重量％としたことを特徴とするロウ材。(2) A brazing material containing In, using Cu and Ag as base metals, and the relationship between Cu, Ag, and In
28-58% by weight of Ag, 11-58% by weight of Ag, and 13-38% by weight of In.
、接合部材間に配置して７００℃以下の温度にてロウ付
け接合することを特徴とするロウ付け方法。(3) A brazing method characterized in that a brazing material containing 67% by weight of Cu and 33% by weight of In is placed between joining members and brazed and joined at a temperature of 700° C. or lower.
％、Ｉｎが１３〜３８重量％のロウ材を、接合部材間に
配置して７００℃以下の温度にてロウ付け接合すること
を特徴とするロウ付け方法。(4) A brazing material containing 28 to 58% by weight of Cu, 11 to 58% by weight of Ag, and 13 to 38% by weight of In is placed between the joining members and brazed and joined at a temperature of 700°C or less. A brazing method characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267190A JPH03297594A (en) | 1990-04-18 | 1990-04-18 | Brazing filler metal and brazing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267190A JPH03297594A (en) | 1990-04-18 | 1990-04-18 | Brazing filler metal and brazing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03297594A true JPH03297594A (en) | 1991-12-27 |
Family
ID=14333699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10267190A Pending JPH03297594A (en) | 1990-04-18 | 1990-04-18 | Brazing filler metal and brazing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03297594A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01259547A (en) * | 1988-04-08 | 1989-10-17 | Sumitomo Electric Ind Ltd | Component for semiconductor device |
| JPH03264187A (en) * | 1990-03-12 | 1991-11-25 | Tanaka Kikinzoku Kogyo Kk | Powder sintered preform brazing material |
-
1990
- 1990-04-18 JP JP10267190A patent/JPH03297594A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01259547A (en) * | 1988-04-08 | 1989-10-17 | Sumitomo Electric Ind Ltd | Component for semiconductor device |
| JPH03264187A (en) * | 1990-03-12 | 1991-11-25 | Tanaka Kikinzoku Kogyo Kk | Powder sintered preform brazing material |
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