JPH02155595A - Production of brazing material - Google Patents
Production of brazing materialInfo
- Publication number
- JPH02155595A JPH02155595A JP30959588A JP30959588A JPH02155595A JP H02155595 A JPH02155595 A JP H02155595A JP 30959588 A JP30959588 A JP 30959588A JP 30959588 A JP30959588 A JP 30959588A JP H02155595 A JPH02155595 A JP H02155595A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- brazing
- brazing material
- low melting
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 49
- 239000000463 material Substances 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 43
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 27
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 24
- 239000000843 powder Substances 0.000 claims abstract description 24
- 230000005496 eutectics Effects 0.000 claims abstract description 8
- 238000007751 thermal spraying Methods 0.000 claims abstract description 8
- 239000000945 filler Substances 0.000 claims abstract description 5
- 230000001590 oxidative effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 abstract description 23
- 230000008018 melting Effects 0.000 abstract description 20
- 150000002739 metals Chemical class 0.000 abstract description 18
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000010936 titanium Substances 0.000 description 28
- 239000010949 copper Substances 0.000 description 12
- 238000009792 diffusion process Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000007750 plasma spraying Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910018182 Al—Cu Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910018651 Mn—Ni Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- WUOBERCRSABHOT-UHFFFAOYSA-N diantimony Chemical compound [Sb]#[Sb] WUOBERCRSABHOT-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/325—Ti as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
Description
【発明の詳細な説明】
Δ、＆業上の利用分野
本発明は、ロウ材に係り、特にＴｉとＡｌとを主成分と
するロウ材の製造方法に関したものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a brazing material, and particularly to a method for producing a brazing material whose main components are Ti and Al.
Ｂ３発明の概要
本発明は、Ｔｉ（チタン）、 Ａｌ （アルミニウム）
を主成分としたロウ材の製造方法であり、低融点金属を
含有する導電性金属のロウ付接合に適したロウ材を得る
ものである。B3 Summary of the Invention The present invention uses Ti (titanium), Al (aluminum)
This is a method for producing a brazing material whose main component is a brazing material suitable for brazing and joining conductive metals containing low melting point metals.
Ｃ６従来の技術
従来、低融点金属、例えばＢｉ（ビスマス）を含有する
導電性の金属部材として、例えば電気接点がある。C6 Prior Art Conventionally, as a conductive metal member containing a low melting point metal such as Bi (bismuth), there is an electrical contact, for example.
この種の電気接点においては、低融点金属を１．０重１
％以上含有させることが電気的性能の要求から多々行わ
れている。In this type of electrical contact, a low melting point metal of 1.0 weight 1
% or more is often used to improve electrical performance.
しかし、低融点金属を多く含むと、加熱時に、ロウ材の
流動温度以下で低融点金属が接合部の界面に析出（また
は溶出）し、ロウ材の「ぬれ性」を阻害して、結果とし
てロウ付出来ない現象を弓き起こしていた。However, if a large amount of low-melting point metal is included, during heating, the low-melting point metal will precipitate (or elute) at the interface of the joint at a temperature below the flow temperature of the brazing material, inhibiting the "wettability" of the brazing material, and resulting in This caused a phenomenon in which soldering was not possible.
また、接合出来たとしても、低融点金属がロウ付接合部
に存在すると、接合強度が著しく低下し、容易に取れて
しまうものであった。Moreover, even if the bonding is possible, if a low melting point metal is present in the brazed joint, the bonding strength will be significantly reduced and it will easily come off.
上述のようなことから、低融点金属を含有する金属部材
の接合は、機械的に変形（例えば「かしめ」）させるか
、ネジ止め、といった手段で行っている。For the reasons described above, metal members containing low melting point metals are joined by mechanical deformation (for example, "caulking") or screwing.
Ｄ１発明が解決しようとする課題
従来は、低融点金属を含有する金属部材の接合は、機械
的な手段で接合するものであったので、これを電気、電
子機器の接点と導体との接合に用いた場合には、多頻度
の開閉により、接合強度が低下して接触抵抗が増加した
り、またそれに伴う発熱の発生等の問題があった。D1 Problem to be Solved by the Invention Conventionally, metal members containing low melting point metals were joined by mechanical means. When used, there were problems such as frequent opening and closing, resulting in a decrease in bonding strength, an increase in contact resistance, and the generation of heat associated with this.
さらには、接点が脱落してしまう場合もあり、耐久性は
悪いものであった。Furthermore, the contact points sometimes fall off, resulting in poor durability.
Ｅ９課題を解決するための手段
発明者らは、種々実験を行った結果、ＴｉとＡ１とでロ
ウ材を形成すれば、多量の低融点金属を含ａしていても
、安定にロウ付接合できることを見出した。E9 Means for Solving Problem The inventors conducted various experiments and found that if a brazing material is formed from Ti and A1, stable brazing bonding can be achieved even if it contains a large amount of low melting point metal. I found out what I can do.
また、Ｔ１またはＡｌと共晶を作る材料を添加すると、
Ｔｉ、Ａｔの拡散層を安定化でき、接合を一層確実なも
のにできることを見出した。Also, if a material that forms a eutectic with T1 or Al is added,
It has been found that the Ti and At diffusion layers can be stabilized and the bonding can be made more reliable.
すなわち、ロウ付部にＴｉ、Ａｌの拡散層が存在するこ
とで低融点金属の接合界面への侵入を効果的に防止でき
、安定にロウ材できることが判った。In other words, it was found that the presence of a Ti and Al diffusion layer in the brazed portion effectively prevents low melting point metals from entering the bonding interface, resulting in a stable brazing material.
従って、本発明は、低融点金属を含有する導電性金属の
接合に適したロウ材の製造方法であり、（１）２０〜９
０重量％のＴｉ粉末と、１０〜８０重１％のＡ１粉末と
を非酸化性雰囲気中にて溶射処理して薄い板状のロウ材
を得るロウ材の製造方法。Therefore, the present invention is a method for producing a brazing material suitable for joining conductive metals containing low melting point metals, and includes (1) 20 to 9
A method for producing a brazing material in which a thin plate-shaped brazing material is obtained by spraying 0% by weight Ti powder and 10 to 80% by weight A1 powder in a non-oxidizing atmosphere.
（２） Ｔ ｉと、Ａｌと、これらＴｉまたはＡｔのい
ずれかと共晶を作る材料からなる第３成分とからなり、
ＴｉとＡｌとを合計で２０ｉｊ１％以上含有し、且つ重
ζｊ１比で、Ｔｉ／、Ａｌ−２０／８０〜９０／１０と
し、これら成分の粉末を非酸化性雰囲気中にて溶射処理
して薄い板状のロウ材を得るロウ材の製造方法。(2) Consisting of Ti, Al, and a third component made of a material forming a eutectic with either Ti or At, containing a total of 20ij1% or more of Ti and Al, and with a weight ratio of ζj1, A method for producing a brazing material containing Ti/, Al-20/80 to 90/10, and obtaining a thin plate-shaped brazing material by spraying powder of these components in a non-oxidizing atmosphere.
の要件からなるものである。It consists of the following requirements.
しかして、ＴｉとＡ１との割合、ＴｉとＡｌと第３成分
との割合が玉記の関係より外れる場合には安定したロウ
付接合を得ることが出来なかった。However, if the ratio between Ti and A1 and the ratio between Ti and Al and the third component deviate from the above relationship, a stable brazing joint could not be obtained.
なお、
■低融点金属としては、例えば、Ｂｉ（ビスマス）、Ｓ
ｂ（アンチモン）等の低融点金属として良く知られてい
る金属が該当する。Note that ■As low melting point metals, for example, Bi (bismuth), S
Metals that are well known as low melting point metals such as antimony (antimony) are applicable.
■導電性金属としては、絹、銅合金、銀、銀合金が該当
する。- Conductive metals include silk, copper alloys, silver, and silver alloys.
■ＴｉまたはＡｌのいずれかと共晶を作る材料（第３成
分）としては、例えば、Ｃｕ（銅）。■As a material (third component) that forms a eutectic with either Ti or Al, for example, Cu (copper).
Ｉｎ（インジウム）、Ｎｉにッケル）、Ｍｎ（マンガン
）、Ｆｅ（鉄）のうちの少なくとも１種類が該当する。At least one of In (indium), Ni (nickel), Mn (manganese), and Fe (iron) is applicable.
■原料（Ｔｉ、Ａｌ、第３成分）の粉末は、別々に溶射
する、または混合粉末の状態で溶射する、のいずれであ
っても良い。(2) The powders of the raw materials (Ti, Al, third component) may be sprayed separately or in the form of a mixed powder.
また、非酸化性雰囲気としては、真空中、不活性ガス中
が、溶射処理としては、プラズマ溶射、減圧プラズマ溶
射が、板としては、厚みが１０μｍ以にのもの、が各々
該当する。The non-oxidizing atmosphere includes a vacuum or an inert gas, the thermal spraying includes plasma spraying and reduced pressure plasma spraying, and the plate has a thickness of 10 μm or more.
溶射は、薄い板状材を得るために樹脂等の剥がしが容易
な部材上で行うのが好ましい。または、接合する部材の
表面に直接溶射してロウ材層を形成しても差し支えない
ものである。In order to obtain a thin plate-like material, thermal spraying is preferably carried out on a member such as a resin that can be easily peeled off. Alternatively, the brazing material layer may be formed by thermal spraying directly onto the surfaces of the members to be joined.
■ロウ材の使用条件としては、
ユ、ロウ付温度は、６５０〜１０００℃ｂ、ロウ付雰囲
気は、真空中、不活性ガス中。■The conditions for using the brazing material are as follows: The brazing temperature is 650 to 1000°C, and the brazing atmosphere is in a vacuum or inert gas.
とするのが好ましい。It is preferable that
Ｆ８作用
原料粉末を溶射処理するので、任意の薄い板状のロウ材
を得ることができ、しかも薄いものであるから切断、打
ち抜き等の加工が容易であり、適応箇所に制限の無い板
状のロウ材を容易に得ることができる。Since the F8 action raw material powder is thermally sprayed, it is possible to obtain any thin plate-shaped brazing material. Moreover, since it is thin, it is easy to process such as cutting and punching, and it can be applied to any place without restrictions. Brazing material can be easily obtained.
しかも、本発明によるロウ材を使用した場合には、ロウ
付接合部にＴｉ、Ａｌの拡散層が存在することで低融点
金属の接合界面への侵入を効果的に防止でき、低融点金
属を含有する導電性金属と同種金属（または含まない金
属）を安定にロウ材することができる。Moreover, when the brazing material according to the present invention is used, the presence of a Ti and Al diffusion layer in the brazed joint can effectively prevent low melting point metals from entering the joint interface, and the low melting point metals can be effectively prevented from entering the joint interface. The same kind of metal as the conductive metal contained (or the metal not contained) can be stably brazed.
Ｇ、実施例 本発明を以下の実施例に基づいて詳細に説明する。G. Example The present invention will be explained in detail based on the following examples.
（実施例−１）
Ｃｕが５０重９％、Ｃｒが３４重量％、Ｂｉが１６重量
％の成分からなる、低融点金属含有の金属印材と無酸素
銅との接合例である。(Example 1) This is an example of bonding a metal stamp material containing a low melting point metal and oxygen-free copper, which is composed of 50% by weight of Cu, 34% by weight of Cr, and 16% by weight of Bi.
（ａ）低融点金属を含有した部材について１００メツン
ユの粒径のＣｒ（クロム）粉末を、アルミナ容器（内径
６８１３１）に約１６０ｇ入れ、このＣｒ粉末上にＣｕ
−Ｂ１合金（約４００ｇ）を載置し、容器に蓋をかぶせ
、これを真空炉内にて脱ガスと共にＣｕ−Ｂ１合金の融
点以下の温度で加熱処理して、まずＯｒ粒子を拡散結合
させて多孔質の溶浸母材を形成する。(a) For parts containing low-melting point metals: Approximately 160 g of Cr (chromium) powder with a particle size of 100 meters is placed in an alumina container (inner diameter 68131), and Cu powder is placed on top of the Cr powder.
- B1 alloy (approximately 400 g) is placed, the container is covered with a lid, and the container is degassed and heat treated at a temperature below the melting point of the Cu-B1 alloy in a vacuum furnace to first diffusely bond the Or particles. to form a porous infiltration matrix.
その後温度を上げて、Ｃｕ、Ｂｉを溶浸母材に浸漬させ
る。Thereafter, the temperature is raised to immerse Cu and Bi into the infiltrated base material.
この際にアルミナ容器内は、Ｂｉ蒸気を含んだ雰囲気と
なり、Ｂｉを多■に含有した複合金属が得られる。At this time, the inside of the alumina container becomes an atmosphere containing Bi vapor, and a composite metal containing a large amount of Bi is obtained.
こうして得られた金属材料を、容器から取り出し、外面
を機械加工して所定の寸法形状にする。The metal material thus obtained is removed from the container and its outer surface is machined into a predetermined size and shape.
（ｂ）ロウ材について
３２５メツシユの粒径のＴｉとＡｌの粉末と、これらＴ
ｉ、Ａｌと共晶を作る第３成分としてのＣｕ扮末（−３
２５メツシユ）とを用、０し、Ｔｉが３５重１％、Ａ１
が３０重量％、Ｃｕが３５重量％となるように秤量する
。(b) Ti and Al powders with a particle size of 325 mesh and these T
i, Cu powder (-3
25 mesh), 0, Ti is 35 weight 1%, A1
are weighed so that Cu is 30% by weight and Cu is 35% by weight.
これらの粉末を、−射的に知られているプラズマ溶射装
置を用いて、真空雰囲気中のターゲットに溶融噴射して
、Ｔｉ−Ａｌ−Ｃｕの膜を形成する。These powders are melted and sprayed onto a target in a vacuum atmosphere using a known plasma spraying device to form a Ti--Al--Cu film.
この際にターゲット上には、形成したＴｉＡ ｌ −Ｃ
ｕの膜を容易に剥がすことができるように、例えば樹脂
のシートを設けておき、樹脂層上にＴｉ−Ａｌ−Ｃｕの
膜を形成する。At this time, the formed TiAl-C
For example, a resin sheet is provided so that the film u can be easily peeled off, and a Ti-Al-Cu film is formed on the resin layer.
形成した膜を複数枚重ねて約０．５ｚｘの箔状のロウ材
にする。A plurality of the formed films are stacked to form a foil-shaped brazing material of about 0.5zx.
（ｃ）ロウ材について
上記ロウ材（Ｔｉ−Ａｌ−Ｃｕ）を、ＣｕＣｒ−Ｂ１合
金部材と、無酸素銅からなる部材との間に入れ、これら
をアルミナ容器内に設置し、且つ蓋をし、真空炉にて加
熱処理（９５０℃、１５分間）して接合した。(c) About the brazing material The above brazing material (Ti-Al-Cu) is placed between a CuCr-B1 alloy member and a member made of oxygen-free copper, and these are placed in an alumina container and covered with a lid. Then, they were bonded by heat treatment (950° C., 15 minutes) in a vacuum furnace.
（ｄ）ロウ材の結果について
−Ｆ記のようにして得られた接合物は、強固に接合され
ており、しかもロウ材も十分に流動していることが確認
された。(d) Regarding the results of the brazing material - It was confirmed that the bonded product obtained as described in F was firmly bonded and that the brazing material was sufficiently fluid.
また、Ｘ線マイクロアナライザにて接合部の断面を観察
すると、Ｔｉ、Ａｌの拡散層によって、Ｂｉの界面への
析出は防止され、安定したロウ付接合層が形成されてい
ることが確認された。Furthermore, when the cross section of the joint was observed using an X-ray microanalyzer, it was confirmed that the diffusion layer of Ti and Al prevented Bi from precipitating at the interface, forming a stable brazed joint layer. .
（実施例−２〜３８）
上述の実施例−１と同様な条件で、ロウ材の成分を変え
てロウ付接合について調べた。(Examples 2 to 38) Under the same conditions as in Example 1 described above, brazing joints were investigated by changing the components of the brazing material.
その結果は図及び下表に示す通りであった。The results were as shown in the figure and table below.
なお、実施例−３０〜３５，３７．３８における、接合
強度は良好であり、引っ張り試験の結果、ロウ付部では
なく、接合した母材の部分が破壊する結果であった。In Examples 30 to 35 and 37 and 38, the bonding strength was good, and the result of the tensile test was that the bonded base material part, not the brazed part, broke.
従ってこれらの結果から、
■ロウ材をＴｉとＡ１とで形成し、且つ両者の成分比（
重！４比）を、Ｔｉ／Δ１が２０／８０〜９０／１０と
すれば良いことが判った。Therefore, from these results, it can be concluded that: (1) the brazing material is formed of Ti and A1, and the component ratio of the two (
Heavy! It was found that Ti/Δ1 may be set to 20/80 to 90/10.
■Ｔｉ、Ａｌと共晶を作る第３成分を添加すると、Ｔｉ
、Ａｌの拡散層を安定化させる効果があり、含有させる
上限は８０重量％であることが判った。■When adding a third component that forms a eutectic with Ti and Al, Ti
, has the effect of stabilizing the Al diffusion layer, and it was found that the upper limit of its content is 80% by weight.
■好ましい組成は、ＴｉとＡｌと共晶を作る材料（第３
成分）との組み合わせであり、且つ成分比（重ｔＲ比）
を、
Ｔ ｉ ／ Ａ Ｉ ＝ ４０ ／ ６０〜８０／２０
（Ｔｉ＋Ａｌ）／（第３成分）＝２０／８０〜９０／Ｉ
Ｃとすれば良いことが判った。■The preferred composition is a material that forms a eutectic with Ti and Al (tertiary
component), and the component ratio (heavy tR ratio)
, T i / A I = 40/60 ~ 80/20
(Ti+Al)/(third component)=20/80~90/I
It turns out that C should be used.
（その他の実施例）
接合する一方の金属部材を、Ａｇｌ：Ｂｉを添加して形
成し、これを無酸素銅からなる部材に重連の各実施例と
同様なロウ材を用いてロウ材した結果、而述の場合と同
様な結果が得られることを確認した。(Other Examples) One of the metal members to be joined was formed by adding Agl:Bi, and this was brazed to a member made of oxygen-free copper using the same brazing material as in each of the following Examples. As a result, it was confirmed that the same results as in the case described above were obtained.
（比較例）
比較のために一般的に知られている、ＡｇＣｕ−Ｉｎ系
ロウ材、及びＣｕ−Ｍｎ−Ｎｉ系ロウ材を用い、温度条
件を前者は８００℃、後者は９５０℃とし、且つ他の条
件はＬ記実施例−１と同様にしてロウ材を試みたが、い
ずれも剥離し、ロウ材ができなかった。(Comparative Example) For comparison, commonly known AgCu-In brazing filler metal and Cu-Mn-Ni brazing filler metal were used, and the temperature conditions were 800°C for the former and 950°C for the latter. Other conditions were the same as those in Example 1, but the brazing material peeled off and no brazing material could be formed.
１−（、発明の効果
本発明によるロウ材は、Ｔｉ、Ａｌを主成分としている
ことから、ロウ付部にＴｉ、Ａｌの拡散層を形成し、こ
の拡散層が低融点金属の接合界面への侵入を効果的に防
止できることから、従来ロウ材が不可能であった多量（
１０重量％以上）の低融点金属を含有する導電性金属の
ロウ材ができるようになった。1-(, Effects of the Invention Since the brazing material according to the present invention mainly contains Ti and Al, it forms a diffusion layer of Ti and Al in the brazed part, and this diffusion layer spreads to the bonding interface of low melting point metals. Because it can effectively prevent the intrusion of
It has now become possible to produce a conductive metal brazing material containing a low melting point metal (10% by weight or more).
しかも、Ｔｉ、Ａｌと共晶を作る金属材料を添加すると
ロウ付接合を一層安定に行うことができる。Moreover, by adding a metal material that forms a eutectic with Ti and Al, the brazing joint can be performed more stably.
また、ロウ材は、原料の各粉末を溶射処理して製造する
ので、薄い板状に形成でき、しかも薄い板であるから切
断、打ち抜き等の加工が容易であり、適応箇所に応じた
ロウ材を容易に得ることができる。In addition, since brazing filler metal is manufactured by thermal spraying each raw material powder, it can be formed into a thin plate shape, and since it is a thin plate, it is easy to process such as cutting and punching. can be easily obtained.
従って、電気、電子機器における低融点金属を含有する
接点の接合に適用した場合には、接触抵抗の低減、安定
化及び発熱防止、を図ることができ、さらには、耐久性
の向上が図れ、品質向上に寄与できるものである。Therefore, when applied to the joining of contacts containing low melting point metals in electrical and electronic equipment, it is possible to reduce contact resistance, stabilize and prevent heat generation, and further improve durability. This can contribute to quality improvement.
図は、各実施例における成分と評価の説明図である。 実施例における成分と評価の説明図 ｕ 外２名 The figure is an explanatory diagram of components and evaluation in each example. Explanatory diagram of ingredients and evaluation in Examples u 2 people outside
Claims (2)
０〜９０重量％のＴｉ粉末と、１０〜８０重量％のＡｌ
粉末とを非酸化性雰囲気中にて溶射処理して薄い板状に
形成したことを特徴とするロウ材の製造方法。(1) A brazing material whose main components are Ti and Al,
0-90% by weight Ti powder and 10-80% by weight Al
1. A method for producing brazing filler metal, which comprises forming a thin plate by thermal spraying a powder in a non-oxidizing atmosphere.
かと共晶を作る材料からなる第３成分とからなるロウ材
であって、 ＴｉとＡｌとを合計で２０重量％以上含有すると共に重
量比で、Ｔｉ／Ａｌ＝２０／８０〜９０／１０とし、且
つＴｉ粉末とＡｌ粉末と、第３成分粉末とを、非酸化性
雰囲気中にて溶射処理して薄い板状のロウ材を形成した
ことを特徴とするロウ材の製造方法。(2) A brazing material consisting of Ti, Al, and a third component consisting of a material that forms a eutectic with either Ti or Al, which contains Ti and Al in a total of 20% by weight or more, and has a The ratio of Ti/Al is 20/80 to 90/10, and Ti powder, Al powder, and third component powder are thermally sprayed in a non-oxidizing atmosphere to form a thin plate-shaped brazing material. A method for manufacturing wax material characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30959588A JPH02155595A (en) | 1988-12-07 | 1988-12-07 | Production of brazing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30959588A JPH02155595A (en) | 1988-12-07 | 1988-12-07 | Production of brazing material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02155595A true JPH02155595A (en) | 1990-06-14 |
Family
ID=17994922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30959588A Pending JPH02155595A (en) | 1988-12-07 | 1988-12-07 | Production of brazing material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02155595A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7025488B2 (en) | 1999-12-17 | 2006-04-11 | Koninklijke Philips Electronics N.V. | Backlight for LCD's |
| JP2013540489A (en) * | 2010-09-20 | 2013-11-07 | シンセス ゲゼルシャフト ミット ベシュレンクテル ハフツング | Method for connecting two or more segments of a surgical implant |
-
1988
- 1988-12-07 JP JP30959588A patent/JPH02155595A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7025488B2 (en) | 1999-12-17 | 2006-04-11 | Koninklijke Philips Electronics N.V. | Backlight for LCD's |
| JP2013540489A (en) * | 2010-09-20 | 2013-11-07 | シンセス ゲゼルシャフト ミット ベシュレンクテル ハフツング | Method for connecting two or more segments of a surgical implant |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR910004024B1 (en) | Titanium-copper-nickel braze filler metal and method of brazing | |
| CN101641176A (en) | High temperature solder materials | |
| US4448605A (en) | Ductile brazing alloys containing reactive metals | |
| JP2009538984A (en) | Cold compressed sputter target | |
| TW201522667A (en) | Au-sn-ag series solder alloy, electronic component sealed using same au-sn-ag series solder alloy, and electronic component-equipped device | |
| JPH06244330A (en) | Heat-controlling composite material used in electronic circuit device, and manufacture thereof | |
| KR100775140B1 (en) | Process for manufacturing an evaporation source | |
| US4756754A (en) | Cermet composite | |
| JPS62212095A (en) | Brazing filler metal | |
| CN100404193C (en) | Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device | |
| US4405391A (en) | Homogeneous, ductile nickel-palladium brazing foils | |
| JPS62197292A (en) | Solder material for assembling semiconductor device with less residual thermal strain | |
| JPH02155595A (en) | Production of brazing material | |
| US5466538A (en) | Multi-layer sliding member | |
| JPH0455086A (en) | Production of brazing material | |
| US4376806A (en) | Highly adhesive coatings for beryllia | |
| EP0128356B1 (en) | Homogeneous low melting point copper based alloys | |
| JP2748658B2 (en) | Manufacturing method of brazing material | |
| JPS61269998A (en) | Sn alloy solder having excellent thermal fatigue characteristic | |
| JPH02155594A (en) | Alloy brazing material | |
| JP2679268B2 (en) | Manufacturing method of brazing material | |
| JPH03297593A (en) | Brazing filler metal and brazing method | |
| JPS63169348A (en) | Amorphous alloy foil for jointing ceramics | |
| JPS5884973A (en) | Production of composite material consisting basically of stainless steel plate or the like | |
| JPH0215874A (en) | Method and material for joining metal and ceramics |