JPH03297523A - Blanking die for substrate - Google Patents

Abstract

PURPOSE:To enable continuous blanking for unmanned operation by providing a cutting edge for blanking a substrate on the lower surface of an upper die and providing a recessed part near the cutting edge and on the lower surface of the upper die so that a fixed clearance is formed on the upper surface of the substrate when blanking is performed. CONSTITUTION:Since the upper die 3 is mounted on the lower die 1, the substrate 2 arranged on the lower die 1 is blanked by the cutting edge 4 provided on the lower surface of the upper die 3 in a prescribed shape. The scrap (a) generated when it is blanked by the cutting edge 4 is positioned on the recessed part 5 recessed on the lower surface of the upper die 3, therefore, when blanking is performed it does not come in direct contact with the upper surface of the substrate 2. Even when the base plate 2 is blanked continuously the substrate 2 is prevented from a dent and a flaw. Consequently, no frequent sweeping is required and the base plate can be blanked continuously.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a substrate punching die for punching a pre-fired ceramic substrate into a predetermined shape.

[Prior Art] Conventionally, when punching a ceramic substrate before firing to form it into a predetermined shape, it has been common practice to punch out the substrate placed on a lower die into the predetermined shape using an upper die having a cutting blade. is being carried out.

[Problems to be Solved by the Invention] By the way, when a substrate is punched out using the upper mold, chips may be generated due to cutting by the cutting blade. If these chips adhere to the lower surface of the upper die, if punching is continued in this state, the chips may cause dents or scratches on the top surface of the substrate. For this reason, in the conventional example as described above, it was necessary for an operator to periodically clean the inside of the mold with a brush or the like to remove chips.

The present invention is intended to solve the above problems, and its purpose is to provide a board punching die that does not cause dents or scratches on the punched board due to chips generated during punching. be.

[Means for Solving the Problems] In order to achieve the above object, the substrate punching die of the present invention includes an upper die 3 for punching a substrate 2 placed on a lower die 1 into a predetermined shape. A cutting blade 4 for punching the substrate is provided on the lower surface of the upper mold 3, and the cutting blade 4 is placed close to the cutting blade 4 so as to form a certain gap with the two sides of the substrate 2 during punching. A recessed portion 5 is provided on the lower surface of the mold 3.

1 Action 1 By placing the -L type 3 on the lower mold 1, the lower mold 1-1
The substrate 2 placed in ) is punched into a predetermined shape by a cutting blade 4 provided on the lower surface of a die 3 .

Then, chips a generated during punching by the cutting blade 4
By being located in the recessed part 5 formed on the lower surface of the die 3, it does not directly hit the upper surface of the substrate 2 during punching, and even when punching the substrates 2 continuously, it does not touch the substrate 2. No dents or scratches.

[Example] Hereinafter, the present invention will be explained in detail based on illustrated embodiments.

The substrate punching die is a lower die 1 as shown in Figure 1.
The main body is composed of two molds 3, and the upper mold 3 is placed on the lower mold 1.
The substrate 2 before firing, which is continuously supplied onto the lower mold 1, is punched out into a predetermined shape. A cutting blade 4 for cutting the substrate 2 is provided on the lower surface of the second mold 3, and the cutting blade 4 is used to punch out the substrate 2. The lower surface of the upper mold 3 is provided with a concave portion 5 which is recessed inwardly in the vicinity of the cutting blade 4 indicated by J-. As shown in FIG. 4, this recessed portion 5 is formed inside the cutting blade 4 in plan view.

6, after punching the substrate 2, the punched substrate 2 is placed in the upper mold 3.
These bottles are placed in multiple locations to prevent them from sticking to the skin. In other words, the bottle 6 is fixed and the type 111 type 3
When the upper die 3 rises by 1 after punching, the tip of the bottle 6 moves upward as the upper die 3 moves upward.
A through hole 3a formed in the mold 3 protrudes from the bottom side of the mold 3, and is designed to drop the substrate 2 when it is attached to the mold 3.

When punching the substrate 2 into a predetermined shape, a lower mold 1. is used as shown in FIG. l2 board 2
The substrate 2 is punched out into a predetermined shape by lowering the mold 3 and lowering the upper mold 3 until the cutting blade 4 hits the upper surface of the lower mold 1. And,”1
By continuously performing the above operations, the substrate 2 is continuously punched out.

Here, when cutting and punching the substrate 2 with the cutting blade 4, chips a are generated, but the chips a are located in the recessed portion 5 as shown in Figure 3 and There is no possibility that the negative side of the substrate 2 will be hit during punching of the substrate 2, and no dents or scratches will be generated on the substrate 2. In this way, the chips a
Since it is located in the recessed part 5 and does not touch the top surface of the board 2, there is no need to frequently remove and clean the chips a, and the board 2 can be punched out continuously while being unmanned. It is something that can be done. After the board 2 is punched out into a predetermined shape and is fired, a printed surface is formed on the surface, and the board 2 is used as a printed circuit board.

[Effects of the Invention] As described above, the outer die for punching out substrates of the present invention is provided with a cutting blade for outer punching of substrates on the lower surface of the upper die, so that a certain gap is formed with the upper surface of the substrate during punching. Since a recessed portion is provided on the bottom surface of the second mold close to the cutting blade, the chips generated when cutting the substrate with the cutting blade are located in the recessed portion, and the substrate is punched when punching. It does not cause dents or scratches on the two sides of the board due to contact with the two sides of the board, and there is no need for frequent cleaning, allowing continuous punching of the board and unmanned operation. is possible.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of one embodiment of the present invention, FIG. 2 is a cross-sectional view showing the punched state of the same substrate, FIG. 3 is a cross-sectional view showing the effect of the same, and FIG. 1 is a plan view of , 1 is a lower die, 2 is a substrate, 3 is a second die, 4 is a cutting blade, and 5 is a recessed portion.

Claims (1)

[Claims] [1] A mold having an upper mold for punching a substrate placed on a lower mold into a predetermined shape, and a cutting blade for punching the substrate is provided on the lower surface of the upper mold, and the cutting blade is fixed to the upper surface of the substrate during punching. A substrate punching die characterized in that a recessed portion is provided on the lower surface of the upper die close to the cutting blade so as to form a gap.