JPH03295011A - Magnetic head - Google Patents

Magnetic head

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Publication number
JPH03295011A
JPH03295011A JP9642690A JP9642690A JPH03295011A JP H03295011 A JPH03295011 A JP H03295011A JP 9642690 A JP9642690 A JP 9642690A JP 9642690 A JP9642690 A JP 9642690A JP H03295011 A JPH03295011 A JP H03295011A
Authority
JP
Japan
Prior art keywords
thin film
magnetic
film
magnetic head
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9642690A
Other languages
Japanese (ja)
Inventor
Hisashi Katahashi
片橋 久
Yoshitsugu Miura
義從 三浦
Yuiko Matsubara
松原 結子
Masaya Yasukochi
正也 安河内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9642690A priority Critical patent/JPH03295011A/en
Publication of JPH03295011A publication Critical patent/JPH03295011A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To eliminate the layer peeling and to eliminate the magnetization of a head caused by magnetic powder by providing a non-magnetic joining thin film on a part of the interface of a magnetic thin film and an electric insulation thin film. CONSTITUTION:A multi-layer thin film part 4 of a magnetic head 1 consists of a five-layer structure in which a magnetic thin film 5, a non-magnetic joining thin film 6, an electric insulation thin film 7, the non-magnetic joining thin film 6, and the magnetic thin film 5 are successively laminated. This nonmagnetic joining thin film 6 consists of a Cr thin film of 0.03mum, this Cr is connected with oxygen in SiO2 of the electric insulation thin film 7 and generates CrO2 and strong adhesion is obtained. Also, the Cr thin film is subjected to metallic bond to the magnetic thin film 5 consisting of CoHbZr amorphous magnetic alloy film, therefore, strong adhesion is obtained therein, as well. Accordingly, peeling-off of the magnetic thin film 5 and the electric insulation film 7 can be prevented by the joining thin film 6.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、磁気コアの少なくとも一部が磁性薄膜と電気
絶縁薄膜との積層構造をとる磁気ヘッドに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a magnetic head in which at least a portion of the magnetic core has a laminated structure of a magnetic thin film and an electrically insulating thin film.

[従来の技術] コア基体と、該コア基体上に形成された高飽和磁束密度
、高透磁率の磁性薄膜とからなるコア半休同志を接合し
た構造をとる磁気ヘッドは公知であり、近時、例えばV
TRなどにおG1て多用され始めている。
[Prior Art] A magnetic head is known which has a structure in which a half-dead core consisting of a core substrate and a magnetic thin film with high saturation magnetic flux density and high magnetic permeability formed on the core substrate is bonded. For example, V
It is starting to be widely used in G1 for TR etc.

核種、コア基体と磁性薄膜とでコア半休を形成する磁気
ヘッドの中には、特開昭61−250810号公報の中
でその1変形例として開示されているように、うず電流
損失の低減を図るため、コア基体上に磁性薄膜、電気絶
縁薄膜、磁性薄膜を順次積層して成膜した多層薄膜構造
(多層磁性層構造)をとるものが知られており、磁性薄
膜間に設けられた層間絶縁g(電気絶縁薄膜)としては
SiO□等の酸化物が用いられていた。
Some magnetic heads, in which a half-core is formed by a nuclide, a core substrate, and a magnetic thin film, are designed to reduce eddy current loss, as disclosed as a modification in Japanese Patent Laid-Open No. 61-250810. To achieve this, a multilayer thin film structure (multilayer magnetic layer structure) is known in which a magnetic thin film, an electrically insulating thin film, and a magnetic thin film are sequentially laminated on a core substrate. As the insulation g (electrical insulation thin film), oxides such as SiO□ have been used.

[発明が解決しようとする課題] ところで本願発明者等の実験によれば、上記した従来技
術の如く磁性薄膜間にSin、等の酸化物よりなる電気
絶縁薄膜を介在させた構造を採った場合、磁性薄膜と電
気絶縁薄膜との界面において充分な付着力が得られず、
層間剥離が起き易いということが判明した。そして、こ
の眉間剥離が起きると空隙が生じ、媒体摺動に伴って空
隙部分に磁性粉が溜るため、−度記録した信号が消され
がちになり、ヘッド特性が劣化するという問題があった
[Problems to be Solved by the Invention] According to experiments conducted by the inventors of the present application, when a structure is adopted in which an electrically insulating thin film made of an oxide such as Sin is interposed between magnetic thin films as in the prior art described above, , sufficient adhesion force cannot be obtained at the interface between the magnetic thin film and the electrically insulating thin film,
It has been found that delamination is likely to occur. When this glabella peeling occurs, a gap is created, and magnetic powder accumulates in the gap as the medium slides, so that recorded signals tend to be erased, resulting in a problem of deterioration of head characteristics.

従って、本発明の解決すべき技術的課題は上記した従来
技術のもつ問題点を解消することにあり、その目的とす
るところは、磁気コアの少なくとも一部が磁性薄膜と電
気絶縁薄膜との積層構造をとる磁気ヘッドにおいて、層
間剥離をなくし以って磁性粉が溜ることによるヘッドの
帯磁を防止できる磁気ヘッドを提供することにある。
Therefore, the technical problem to be solved by the present invention is to solve the above-mentioned problems of the prior art. It is an object of the present invention to provide a magnetic head having a structure in which delamination between layers is eliminated and magnetization of the head due to accumulation of magnetic powder can be prevented.

[課題を解決するための手段] 本発明は上記した目的を達成するため、磁気コアの少な
くとも一部が薄膜によって形成され、且つ該薄膜が磁性
薄膜と電気絶縁薄膜との積層構造(多層磁性層構造)を
とる磁気ヘッドにおいて、前記磁性薄膜と電気絶縁薄膜
との界面の少なくとも一部に、例えば、Cr薄膜よりな
る非磁性接合用薄膜を設けた、構成とされる。
[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention has a structure in which at least a part of the magnetic core is formed of a thin film, and the thin film has a laminated structure (multilayer magnetic layer) of a magnetic thin film and an electrically insulating thin film. In the magnetic head having the above structure, a non-magnetic bonding thin film made of, for example, a Cr thin film is provided on at least a part of the interface between the magnetic thin film and the electrically insulating thin film.

[作用] 磁性薄膜と電気絶縁薄膜との間に介在するCr薄膜(非
磁性接合用薄膜)は、例えばS i O,薄膜よりなる
電気絶縁薄膜とは、S i O,中の酸素と結びついて
Cr Ozを生成し易く、この化学結合によって強固な
付着力が得られ、また、例えばCoNbZr非晶質磁性
合金膜よりなる磁性薄膜とは、金属結合をするためここ
でも強固な付着力が得られる。よって、非磁性接合用薄
膜は磁性薄膜と電気絶縁薄膜の両者に対して強い付着力
を持つため、従来の如く眉間剥離が生じることが無く、
剥離空隙に磁性粉が溜ることに起因するヘッドの帯磁を
防止することができる。
[Function] The Cr thin film (non-magnetic bonding thin film) interposed between the magnetic thin film and the electrically insulating thin film is, for example, an electrically insulating thin film made of S i O, which combines with the oxygen in it. It easily generates CrOz, and this chemical bond provides strong adhesion, and for example, with a magnetic thin film made of a CoNbZr amorphous magnetic alloy film, strong adhesion is also obtained due to metallic bonding. . Therefore, since the non-magnetic bonding thin film has strong adhesion to both the magnetic thin film and the electrically insulating thin film, peeling between the eyebrows does not occur as in the past.
It is possible to prevent the head from being magnetized due to the accumulation of magnetic powder in the separation gap.

[実施例] 以下、本発明の一実施例を第1図〜第4図によって説明
する。
[Example] Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 4.

第1図は本実施例に係る磁気ヘッドの摺動面側の要部拡
大平面図、第2図は磁気ヘッドの斜視図である。
FIG. 1 is an enlarged plan view of the main part of the sliding surface side of the magnetic head according to this embodiment, and FIG. 2 is a perspective view of the magnetic head.

第2図において、符号1で総括的に示す磁気ヘッドは、
対をなすコア半休2A、2Bを低融点のガラス8で接合
したものでヘッドチップが構成されている。上記各コア
半体2A、2Bは、フェライトよりなるコア基体3と、
該コア基体3の突き合わせ・対向面側に形成された多層
薄膜部4からなっており、多層薄膜部4は、第1図に示
すように、磁性薄膜5.非磁性接合用薄膜6.電気絶縁
薄膜7.非磁性接合用薄膜6.磁性薄膜5が順次積層さ
れた5層構造となっている。また、前記対をなすコア基
体3の対向面には三角形状の突部3aがそれぞれ形成さ
れ、該突部3aの頂部においで前記多層薄膜部4はトラ
ック幅相当分の幅をもつように平坦化されている0本実
施例においては、上記磁性薄膜5は膜厚が15μmのC
oNbZr非晶質薄膜よりなり、前記非磁性接合用薄膜
6は膜厚が0.03μmのCr1l膜よりなり、電気絶
縁薄膜7は膜厚が0.05μmのS i O,薄膜より
なっており、これらは後述するようにスパッタリング等
の薄膜形成技術で順次成膜されている。
In FIG. 2, the magnetic head generally designated by numeral 1 is:
The head chip is composed of a pair of half-core cores 2A and 2B bonded together with a glass 8 having a low melting point. Each of the core halves 2A and 2B includes a core base 3 made of ferrite,
It consists of a multilayer thin film section 4 formed on the abutting and opposing surfaces of the core substrate 3, and the multilayer thin film section 4 includes a magnetic thin film 5, as shown in FIG. Thin film for non-magnetic bonding 6. Electrical insulation thin film7. Thin film for non-magnetic bonding 6. It has a five-layer structure in which magnetic thin films 5 are sequentially laminated. Furthermore, triangular protrusions 3a are formed on opposing surfaces of the pair of core substrates 3, and at the tops of the protrusions 3a, the multilayer thin film portion 4 is flat so as to have a width equivalent to the track width. In this embodiment, the magnetic thin film 5 is made of carbon having a thickness of 15 μm.
The non-magnetic bonding thin film 6 is made of an oNbZr amorphous thin film, the non-magnetic bonding thin film 6 is made of a Crl film with a thickness of 0.03 μm, and the electrically insulating thin film 7 is made of a SiO thin film with a thickness of 0.05 μm. These are sequentially formed using a thin film forming technique such as sputtering, as will be described later.

なお、9は膜厚が0.2μmのSin、薄膜よりなるギ
ャップ規制薄膜、10は巻線窓、11はコイルである。
Note that 9 is a gap regulating thin film made of a thin film of Sin having a film thickness of 0.2 μm, 10 is a winding window, and 11 is a coil.

上記したように本実施例においては、前記磁性薄膜5と
電気絶縁薄膜7との間に゛層間接合材料としてCrより
なる非磁性接合用薄膜6が介在した構成となっている。
As described above, in this embodiment, a non-magnetic bonding thin film 6 made of Cr is interposed between the magnetic thin film 5 and the electrically insulating thin film 7 as an interlayer bonding material.

このCrは、Sin、薄膜よりなる電気絶縁薄膜6とは
、Sin、中の酸素と結びついてCr Oxを生成し易
く、この化学結合によって強固な付着力が得られ、また
、Co N bZr非晶質磁性合金膜よりなる磁性層I
J5とは、金属結合をするためここでも強固な付着力が
得られる。よって、非磁性接合用薄膜6は磁性薄膜5゜
電気絶縁薄膜7の両者に対して強い付着力を持つため、
従来の如く層間剥離が生じることがない。
This Cr easily combines with the oxygen in the electrically insulating thin film 6 made of a Sin thin film to form CrOx, and this chemical bond provides strong adhesion. Magnetic layer I made of a magnetic alloy film
Since J5 is metallically bonded, strong adhesion can be obtained here as well. Therefore, since the non-magnetic bonding thin film 6 has strong adhesion to both the magnetic thin film 5° and the electrically insulating thin film 7,
No delamination occurs as in the conventional case.

第3図は、第1,2図に示した磁気ヘッドの製造方法を
示す工程説明図である。
FIG. 3 is a process explanatory diagram showing a method of manufacturing the magnetic head shown in FIGS. 1 and 2. FIG.

先ず同図(、)に示すように、前記コア基体3の母材と
なるフェライト基板3’ 、3’上に、ダイシングソー
などにより前記した突部3aを形づくるためにW字形の
溝20を形成し、この際、方のフェライト基板3′には
前記した巻線窓10を形成するための溝21を併せて切
削加工する。
First, as shown in the same figure (,), a W-shaped groove 20 is formed on the ferrite substrates 3', 3', which are the base materials of the core base 3, using a dicing saw or the like to form the above-mentioned protrusion 3a. At this time, a groove 21 for forming the winding window 10 described above is also cut into the ferrite substrate 3'.

次に、上記したように溝加工を施したフェライト基板3
′上に、前記磁性薄膜5となるC o N bZr薄膜
を成膜しく同図(b)) 、統いて、前記非磁性接合用
薄膜6となるCr薄膜、前記電気絶縁薄膜7となるS 
i O,薄膜を順次成膜した後、再び、Cr1tl膜(
非磁性接合用薄膜6) 、CoNbZr薄膜(磁性薄膜
5)を成膜・形成する(同図(Q))、なお、以上の成
膜には全てConv。
Next, the ferrite substrate 3 which has been grooved as described above
A C o N bZr thin film, which will become the magnetic thin film 5, is formed on top of the film (FIG. 1(b)), a Cr thin film, which will become the non-magnetic bonding thin film 6, and an S, which will become the electrically insulating thin film 7.
After sequentially forming the iO and thin films, the Cr1tl film (
A non-magnetic bonding thin film 6) and a CoNbZr thin film (magnetic thin film 5) are deposited (FIG. 3(Q)). All of the above film formations are performed using Conv.

RFスパッタ法を用いる。RF sputtering method is used.

続いて同図(d)に示すように、低融点の鉛系のガラス
8を表面の凹部が完全に埋まるように充填・被着した後
、下層側の磁性層5が所定量露呈するまで表面をラッピ
ング等の手段で研磨・除去し、前記突部3aの頂部の前
記多層薄膜部4がトラック幅をもつように平坦化する。
Subsequently, as shown in FIG. 4(d), after filling and depositing low melting point lead-based glass 8 so that the recesses on the surface are completely filled, the surface is heated until a predetermined amount of the lower magnetic layer 5 is exposed. is polished and removed by means such as lapping, and the multilayer thin film portion 4 on the top of the protrusion 3a is flattened so as to have a track width.

然る後、同図(e)に示すように、一方のフェライト基
板3′のラップ面上に前記ギャップ規制薄膜9となるS
iO2薄膜を、マグネトロンスパッタ法で成膜・形成す
る。
Thereafter, as shown in FIG. 3(e), S, which will become the gap regulating thin film 9, is deposited on the lapped surface of one of the ferrite substrates 3'.
An iO2 thin film is formed by magnetron sputtering.

この後、斯様な薄膜形成部をもつ対となるフェライト基
板3’ 、3’同志を位置合わせして、ガラス8によっ
てボンディングして一体化しく同図(f))、最後に、
この組立ブロックをダイシングソーによってヘッドチッ
プとして切り出し、媒体摺動面に研磨を施した後、コイ
ル11を巻回すれば磁気ヘッドが作製されることになる
After this, the pair of ferrite substrates 3' and 3' having such thin film forming portions are aligned, and bonded using glass 8 to integrate them (FIG. 2(f)). Finally,
This assembly block is cut out as a head chip using a dicing saw, the medium sliding surface is polished, and then the coil 11 is wound to produce a magnetic head.

第4図は前記した実施例による磁気ヘッドと。FIG. 4 shows a magnetic head according to the embodiment described above.

従来の(磁性薄膜と電気絶縁薄膜との間に非磁性接合用
薄膜がない磁気ヘッド)との再生出力を比較し、グラフ
化して示す説明図である。同図から明らかなように1本
発明の実施例による磁気ヘッドは眉間剥離がなく、剥離
空間への磁性粉の浸入・蓄積がないので(ヘッドの帯磁
がないので)、従来に較べて再生出力で3〜4dBの改
善が認められた。
FIG. 3 is an explanatory diagram showing a comparison of the reproduction output with a conventional magnetic head (a magnetic head in which there is no non-magnetic bonding thin film between a magnetic thin film and an electrically insulating thin film) and shown in a graph. As is clear from the figure, the magnetic head according to the embodiment of the present invention has no peeling between the eyebrows and no intrusion or accumulation of magnetic powder in the peeled space (because the head is not magnetized), so the reproduction output is higher than that of the conventional one. An improvement of 3 to 4 dB was observed.

以下1本発明の他の実施例を第5図〜第7図によって説
明する。
Another embodiment of the present invention will be described below with reference to FIGS. 5 to 7.

第5図(a)〜(c)は本発明の他の実施例に係る磁気
ヘッドの斜視図である。
FIGS. 5(a) to 5(c) are perspective views of a magnetic head according to another embodiment of the present invention.

第5図(a)において、符号1で総括的に示す磁気ヘッ
ドは、対をなすコア半休2A、2Bを低融点のガラス8
で接合したものでヘッドチップが構成されている。上記
各コア半休2A、2Bは、フェライトよりなるコア基体
3と、該コア基体3の突き合わせ・対向面側に形成され
た多層薄膜部4からなっており、多層薄膜部4は、第1
図に示す前記した構成となっている。なお、9は膜厚0
゜2μmのSiO2薄膜よりなるギャップ規制薄膜、1
0は巻線窓、11はコイルである。
In FIG. 5(a), the magnetic head generally designated by the reference numeral 1 has a pair of core halves 2A and 2B made of low melting point glass 8.
The head chip is made up of the parts joined together. Each of the core half-holes 2A and 2B is composed of a core base 3 made of ferrite and a multilayer thin film portion 4 formed on the abutting and opposing surfaces of the core base 3.
It has the above-described configuration shown in the figure. In addition, 9 is the film thickness 0
Gap regulating thin film made of ゜2 μm SiO2 thin film, 1
0 is a winding window, and 11 is a coil.

上記したように本実施例においては、前記磁性薄膜5と
電気絶縁薄膜7との間に層間接合材料としてCrよりな
る非磁性接合用薄膜6が介在した構成となっている。
As described above, in this embodiment, a non-magnetic bonding thin film 6 made of Cr is interposed between the magnetic thin film 5 and the electrically insulating thin film 7 as an interlayer bonding material.

第6図は、第5図(a)に示した磁気ヘッドの製造方法
を示す工程説明図である。
FIG. 6 is a process explanatory diagram showing a method of manufacturing the magnetic head shown in FIG. 5(a).

先ず同図(a)に示すように、前記コア基体3の母材と
なるフェライト基板3’ 、3’上に、ダイシングソー
などにより前記した突部3aを形づくるためにW字形の
溝20を形成し、この際、−方のフェライト基板3′に
は前記した巻線窓10を形成するための溝21を併せて
切削加工する。
First, as shown in FIG. 3A, a W-shaped groove 20 is formed on the ferrite substrates 3', 3', which are the base materials of the core substrate 3, using a dicing saw or the like to form the protrusion 3a described above. At this time, a groove 21 for forming the above-mentioned winding window 10 is also cut into the negative ferrite substrate 3'.

次に、上記したように溝加工を施したフェライト基板3
′上に、前記磁性薄膜5となるC o N bZr薄膜
を成膜しく同図(b))、続いて、前記非磁性接合用薄
膜6となるCr薄膜、前記電気絶縁薄1117となるS
 i O,薄膜を順次成膜した後。
Next, the ferrite substrate 3 which has been grooved as described above
A C o N bZr thin film, which will become the magnetic thin film 5, is formed on top of the film (FIG. 2(b)), followed by a Cr thin film, which will become the non-magnetic bonding thin film 6, and an S film, which will become the electrical insulating thin film 1117.
i O, after sequentially depositing thin films.

再び、Cr薄膜(非磁性接合用%IWA6) 、CoN
bZr1l膜(磁性薄膜5)を成膜・形成する(同図(
c))、なお、以上の成膜には全てCo n v 。
Again, Cr thin film (%IWA6 for non-magnetic junction), CoN
Deposit and form bZr1l film (magnetic thin film 5) (see figure (
c)), Incidentally, all of the above film formation was performed using Conv.

RFスパッタ法を用いる。RF sputtering method is used.

続いて同図(d)に示すように、低融点の鉛系のガラス
8を表面の凹部が完全に埋まるように充填・被着した後
、下層側の磁性層5が所定量露呈するまで表面をラッピ
ング等の手段で研磨・除去し、前記突部3aの頂部の前
記多層薄膜部4がトラック幅をもつように平坦化する。
Subsequently, as shown in FIG. 4(d), after filling and depositing low melting point lead-based glass 8 so that the recesses on the surface are completely filled, the surface is heated until a predetermined amount of the lower magnetic layer 5 is exposed. is polished and removed by means such as lapping, and the multilayer thin film portion 4 on the top of the protrusion 3a is flattened so as to have a track width.

然る後、同図(e)に示すように、一方のフェライト基
板3′のラップ面上に前記ギャップ規制薄膜9となるS
iO□薄膜を、マグネトロンスパッタ法で成膜・形成す
る。
Thereafter, as shown in FIG. 3(e), S, which will become the gap regulating thin film 9, is deposited on the lapped surface of one of the ferrite substrates 3'.
An iO□ thin film is formed by magnetron sputtering.

この後、斯様な薄膜形成部をもつ対となるフェライト基
板3’ 、3’同志を位置合わせして、ガラス8によっ
てボンディングして一体化しく同図(f))、最後に、
この組立ブロックをダイシングソーによってヘッドチッ
プとして切り出し、媒体摺動面に研磨を施した後、コイ
ル11を巻回すれば磁気ヘッドが作製されることになる
After this, the pair of ferrite substrates 3' and 3' having such thin film forming portions are aligned, and bonded using glass 8 to integrate them (FIG. 2(f)). Finally,
This assembly block is cut out as a head chip using a dicing saw, the medium sliding surface is polished, and then the coil 11 is wound to produce a magnetic head.

本実施例による磁気ヘッドは、前述した実施例と同様、
再生出力で3〜4dBの改善が認められた。
The magnetic head according to this embodiment has the same features as the embodiment described above.
An improvement of 3 to 4 dB in playback output was observed.

次に、第5図(b)、(c)において特別1で総括的に
示す磁気ヘッドは対をなすコア半体2A。
Next, in FIGS. 5(b) and 5(c), the magnetic head generally designated by 1 is a pair of core halves 2A.

2Bを低融点のガラス8で接合したものでヘッドチップ
が構成されている。上記各コア半体2A。
The head chip is constructed by bonding 2B with glass 8 having a low melting point. Each of the above core halves 2A.

2Bは、フェライトよりなるコア基体3と、該コア基体
3の突き合わせ・対向面側に形成された多層薄膜部4か
らなっており、多層薄膜部4は、第1図に示す前記した
構成になっている。なお、9は膜厚0.2μmのS i
 O,薄膜よりなるギヤツブ規制薄膜、10は巻線窓、
11はコイルである。
2B consists of a core base 3 made of ferrite and a multilayer thin film part 4 formed on the abutting and opposing surfaces of the core base 3, and the multilayer thin film part 4 has the above-described structure shown in FIG. ing. In addition, 9 is Si with a film thickness of 0.2 μm
O, gear control thin film made of thin film; 10, winding window;
11 is a coil.

上記したように本実施例においては、前記磁性薄膜5と
電気絶縁薄膜7との間に層間接合材料としてC,rより
なる非磁性接合用薄膜6が介在した構成となっている。
As described above, this embodiment has a structure in which a non-magnetic bonding thin film 6 made of C and r is interposed between the magnetic thin film 5 and the electrically insulating thin film 7 as an interlayer bonding material.

第7図は、第5図(b)、(Q)に示した磁気ヘッドの
製造方法を示す工程説明図である。
FIG. 7 is a process explanatory diagram showing a method of manufacturing the magnetic head shown in FIGS. 5(b) and 5(Q).

先ず同図(a)に示すように、前記コア基体3の母材と
なるフェライト基板3’ 、3’上に、ダイシングソー
などにより前記した突部38を形づくるためにW字形の
溝20を切削加工する。
First, as shown in FIG. 3A, a W-shaped groove 20 is cut on the ferrite substrates 3', 3', which are the base materials of the core substrate 3, using a dicing saw or the like to form the protrusion 38 described above. Process.

次に、上記したように溝加工を施したフェライト基板3
′上に、前記磁性薄膜5となるC o N bZr薄膜
を成膜しく同図(b))、続いて、前記非磁性接合用薄
膜6となるCrN膜、前記電気絶縁薄膜7となるSin
、薄膜を順次成膜した後。
Next, the ferrite substrate 3 which has been grooved as described above
A C o N bZr thin film, which will become the magnetic thin film 5, is formed on top of the film (FIG. 2(b)), followed by a CrN film, which will become the non-magnetic bonding thin film 6, and a Sin film, which will become the electrically insulating thin film 7.
, after sequentially depositing thin films.

再び、Cr薄膜(非磁性接合用薄膜6)、CoNbZr
薄膜(磁性薄膜5)を成膜・形成する(同図(Q))、
なお、以上の成膜には全てCo n v 。
Again, Cr thin film (nonmagnetic bonding thin film 6), CoNbZr
Depositing and forming a thin film (magnetic thin film 5) ((Q) in the same figure),
Note that all of the above film formation was performed using Conv.

RFスパッタ法を用いる。RF sputtering method is used.

続いて同図(d)に示すように、低融点の鉛系のガラス
8を表面の凹部が完全に埋まるように充填・被着した後
、下層側の磁性層5が所定量露呈するまで表面をラッピ
ング等の手段で研磨・除去し、前記突部3aの頂部の前
記多層薄膜部4がトラック幅をもつように平坦化する。
Subsequently, as shown in FIG. 4(d), after filling and depositing low melting point lead-based glass 8 so that the recesses on the surface are completely filled, the surface is heated until a predetermined amount of the lower magnetic layer 5 is exposed. is polished and removed by means such as lapping, and the multilayer thin film portion 4 on the top of the protrusion 3a is flattened so as to have a track width.

然る後、同図(e)に示すように、一方のフェライト基
板3′のラップ面上に前記ギャップ規制薄膜9となる5
i02#膜を、マグネトロンスパッタ法で成膜・形成す
る。
Thereafter, as shown in FIG. 3(e), the gap regulating thin film 5, which will become the gap regulating thin film 9, is deposited on the lapped surface of one of the ferrite substrates 3'.
An i02# film is formed by magnetron sputtering.

上記した一対のフェライト基板3′のうち、少なくとも
一方のフェライト基板3′には巻IIA窓10Bもしく
は10Cを形成するための溝21(図示せず)を切削加
工する。
A groove 21 (not shown) for forming the volume IIA window 10B or 10C is cut into at least one of the pair of ferrite substrates 3'.

この後、斯様な薄膜形成部をもつ対となるフェライト基
板3’ 、3’同志を位置合わせして、ガラス8によっ
てボンディングして一体化しく同図(f))、最後に、
この組立ブロックをダイシングソーによってヘッドチッ
プとして切り出し、媒体摺動面に研磨を施した後、コイ
ル11を巻回すれば磁気ヘッドが作製されることになる
After this, the pair of ferrite substrates 3' and 3' having such thin film forming portions are aligned, and bonded using glass 8 to integrate them (FIG. 2(f)). Finally,
This assembly block is cut out as a head chip using a dicing saw, the medium sliding surface is polished, and then the coil 11 is wound to produce a magnetic head.

本実施例による磁気ヘッドは、前述した実施例と同様、
再生出力で3〜4dBの改善が認められた。
The magnetic head according to this embodiment has the same features as the embodiment described above.
An improvement of 3 to 4 dB in playback output was observed.

なお、上述した実施例では、前記コア基体3にフェライ
ト(磁性体)を用いているが、コア基体には非磁性高硬
度材を用いてもよい、また、前記磁性薄膜5は、金属磁
性材もしくは酸化物磁性材であればよく、前記非磁性接
合用薄膜6も酸化物絶縁材であればよい。また、前記非
磁性接合用薄膜6もCr以外に、Ti、Zr、Hf、V
、Nb。
In the above-mentioned embodiment, ferrite (magnetic material) is used for the core base 3, but a non-magnetic high hardness material may be used for the core base, and the magnetic thin film 5 is made of a metal magnetic material. Alternatively, it may be an oxide magnetic material, and the non-magnetic bonding thin film 6 may also be an oxide insulating material. In addition to Cr, the nonmagnetic bonding thin film 6 also contains Ti, Zr, Hf, and V.
, Nb.

Ta、Mo、W等を用いても1強力な付着力を得ること
ができる。
A strong adhesive force can also be obtained by using Ta, Mo, W, etc.

[発明の効果] 以上のように本発明によれば、磁気コアの少なくとも一
部が磁性薄膜と電気絶縁薄膜との積層構造をとる磁気ヘ
ッドにおいて、眉間剥離をなくして剥離空間に磁性粉が
溜ることによるヘッドの帯磁を防止でき、以って特性信
頼性に優れた磁気ヘッドを提供でき、その価値は大きい
[Effects of the Invention] As described above, according to the present invention, in a magnetic head in which at least a portion of the magnetic core has a laminated structure of a magnetic thin film and an electrically insulating thin film, separation between the eyebrows is eliminated and magnetic powder accumulates in the separation space. It is possible to prevent the head from becoming magnetized due to this, and therefore, a magnetic head with excellent characteristic reliability can be provided, which is of great value.

【図面の簡単な説明】[Brief explanation of drawings]

図面は何れも本発明の一実施例に係り、第1図は磁気ヘ
ッドの摺動面倒の要部拡大平面図、第2図は磁気ヘッド
の斜視図、第3図は磁気ヘッドの製造工程を示す説明図
、第4図は本発明の磁気ヘッドと従来の磁気ヘッドの再
生出力特性を対比して示す説明図、第5図は本発明の他
の実施例による磁気ヘッドの斜視図、第6図及び第7図
は磁気ヘッドの製造工程を示す説明図である。 1・・・磁気ヘッド、  2A、2B・・・コア半体、
3・・・コア基体、 3a・・・突部、4・・・多層薄
膜部。 5・・・磁性薄膜、 6・・・非磁性接合用薄膜、7・
・・電気絶縁薄膜、 8・・・ガラス、9・・・ギャッ
プ規制薄膜、 10・・・巻線窓、11・・・コイル。
The drawings all relate to one embodiment of the present invention; FIG. 1 is an enlarged plan view of the main parts of the sliding surface of the magnetic head, FIG. 2 is a perspective view of the magnetic head, and FIG. 3 is a diagram showing the manufacturing process of the magnetic head. FIG. 4 is an explanatory diagram comparing the reproduction output characteristics of the magnetic head of the present invention and a conventional magnetic head. FIG. 5 is a perspective view of a magnetic head according to another embodiment of the present invention. 7 and 7 are explanatory diagrams showing the manufacturing process of the magnetic head. 1... Magnetic head, 2A, 2B... Core half,
3...Core base, 3a...Protrusion, 4...Multilayer thin film part. 5...Magnetic thin film, 6...Nonmagnetic bonding thin film, 7.
...electrical insulating thin film, 8...glass, 9...gap regulation thin film, 10...winding window, 11...coil.

Claims (1)

【特許請求の範囲】 1、磁気コアの少なくとも一部が薄膜によって形成され
、且つ該薄膜が磁性薄膜と電気絶縁薄膜との積層構造を
とる磁気ヘッドにおいて、前記磁性薄膜と電気絶縁薄膜
との界面の少なくとも一部に非磁性接合用薄膜を設けた
ことを特徴とする磁気ヘッド。 2、請求項1記載において、前記非磁性接合用薄膜とし
てCr薄膜を用いたことを特徴とする磁気ヘッド。
[Claims] 1. In a magnetic head in which at least a portion of the magnetic core is formed of a thin film, and the thin film has a laminated structure of a magnetic thin film and an electrically insulating thin film, an interface between the magnetic thin film and the electrically insulating thin film is provided. A magnetic head characterized in that a non-magnetic bonding thin film is provided on at least a portion of the magnetic head. 2. A magnetic head according to claim 1, wherein a Cr thin film is used as the nonmagnetic bonding thin film.
JP9642690A 1990-04-13 1990-04-13 Magnetic head Pending JPH03295011A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9642690A JPH03295011A (en) 1990-04-13 1990-04-13 Magnetic head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9642690A JPH03295011A (en) 1990-04-13 1990-04-13 Magnetic head

Publications (1)

Publication Number Publication Date
JPH03295011A true JPH03295011A (en) 1991-12-26

Family

ID=14164667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9642690A Pending JPH03295011A (en) 1990-04-13 1990-04-13 Magnetic head

Country Status (1)

Country Link
JP (1) JPH03295011A (en)

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