JPH03294086A - Brazing material - Google Patents
Brazing materialInfo
- Publication number
- JPH03294086A JPH03294086A JP9568790A JP9568790A JPH03294086A JP H03294086 A JPH03294086 A JP H03294086A JP 9568790 A JP9568790 A JP 9568790A JP 9568790 A JP9568790 A JP 9568790A JP H03294086 A JPH03294086 A JP H03294086A
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- brazing
- alloy
- present
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 39
- 239000000463 material Substances 0.000 title claims abstract description 31
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 229910045601 alloy Inorganic materials 0.000 abstract description 7
- 239000000956 alloy Substances 0.000 abstract description 7
- 229910052719 titanium Inorganic materials 0.000 abstract description 6
- 229910004337 Ti-Ni Inorganic materials 0.000 abstract description 4
- 229910011209 Ti—Ni Inorganic materials 0.000 abstract description 4
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052726 zirconium Inorganic materials 0.000 abstract description 4
- 229910001069 Ti alloy Inorganic materials 0.000 abstract description 3
- 238000009736 wetting Methods 0.000 abstract 1
- 239000010936 titanium Substances 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- PMTRSEDNJGMXLN-UHFFFAOYSA-N titanium zirconium Chemical compound [Ti].[Zr] PMTRSEDNJGMXLN-UHFFFAOYSA-N 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910011208 Ti—N Inorganic materials 0.000 description 1
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は主としてチタン（Ｔｉ）あるいはチタン−ニッ
ケル合金（Ｔｉ−Ｎｊ合金）のようなチタン合金、アル
ミナ（Ａｌ□０３）のようなセラミクス等のろう何月と
して用いられるろう付材料に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is mainly applied to titanium (Ti) or titanium alloys such as titanium-nickel alloy (Ti-Nj alloy), ceramics such as alumina (Al□03), etc. It concerns the brazing material used as a brazing material.
従来、この種のろう付材料としてはチタン−ジルコニウ
ム（Ｔｉ −Ｚｒ）をベースとしたものが提供されてい
る。Conventionally, this type of brazing material has been provided based on titanium-zirconium (Ti-Zr).
しかしながら上記従来のＴｉ−Ｚｒベースのろう付材料
ではＴｉ、Ｔｉ合金、あるいはセラミクスに対する濡れ
性がいまだ充分ではなく、満足すべきろう付強度が得ら
れなかった。However, the conventional Ti-Zr-based brazing materials described above still do not have sufficient wettability to Ti, Ti alloys, or ceramics, and have not been able to provide satisfactory brazing strength.
本発明は上記従来の課題を解決するための手段として、
Ｎｉを２０〜４０重量％含み、残部がＴｉであるろう付
材料を提供するものである。The present invention, as a means for solving the above-mentioned conventional problems,
The present invention provides a brazing material containing 20 to 40% by weight of Ni, with the remainder being Ti.
更に本発明においては、Ｎｉを２０〜４０重量％含み、
Ｂ、Ａｌ、Ｓｉ、Ｚｒ、Ｂｉからなる群から選ばれた一
種または二種以上の元素を１〜１０重量％含み、残部が
Ｔｉであるろう付材料が提供される。Furthermore, in the present invention, it contains 20 to 40% by weight of Ni,
A brazing material is provided that contains 1 to 10% by weight of one or more elements selected from the group consisting of B, Al, Si, Zr, and Bi, with the balance being Ti.
上記本発明のろう付材料にはＮｉ、 Ｔｉ、あるいはＢ
、ＡＩ、Ｓｉ、Ｚｒ、Ｂｉの不純分から由来する他の元
素の微量が含まれてよい。The brazing material of the present invention includes Ni, Ti, or B.
, Al, Si, Zr, Bi trace amounts of other elements derived from impurities.
本発明のろう付材料はＴｉ−Ｎｉ非晶質合金を主体とす
るものであるからＴｉあるいはＴｉ−Ｎｉ合金等のＴｉ
合金には良好な濡れ性を示し、高いろう付強度が得られ
る。また本発明のろう付材料として用いられるＴｉ−Ｎ
ｉ合金は共晶点（９５５℃）がＮｉを約３０重量％含む
組成であり、Ｎｉ２Ｏ〜４０重量％の範囲では融点が各
々の融点（Ｔｉ：１７２５℃、Ｎｉ：１４５２℃）より
も可成り低くなり、ろう付作業性が良好である。更にＢ
、Ａｌ。Since the brazing material of the present invention is mainly composed of a Ti-Ni amorphous alloy, it may contain Ti or Ti such as a Ti-Ni alloy.
The alloy exhibits good wettability and provides high brazing strength. Moreover, Ti-N used as a brazing material of the present invention
The i alloy has a composition with a eutectic point (955°C) containing about 30% by weight of Ni, and in the range of Ni2O to 40% by weight, the melting point is considerably higher than the respective melting points (Ti: 1725°C, Ni: 1452°C). This results in good brazing workability. Further B
, Al.
Ｓｉ、Ｚｒ、Ｂｉからなる群から選ばれた一種または二
種以上の元素を１〜１０重量％上記Ｔｉ−Ｎｉ合金に添
加すると融点は更に低下する。しかし本発明のろう付材
料は、従来のＴｉ−Ｚｒベースのろう付材料の融点（８
５０℃以下）よりも高い融点を示すので、耐熱性の高い
ろう付が出来る。また本発明ノロウ付材料は、Ａｌ、Ｏ
，、Ｔｉｅ、、Ｓｉｎ、。When 1 to 10% by weight of one or more elements selected from the group consisting of Si, Zr, and Bi is added to the Ti-Ni alloy, the melting point is further lowered. However, the brazing material of the present invention has a melting point (8
It has a melting point higher than 50°C (below 50°C), so it can be brazed with high heat resistance. Furthermore, the soldering material of the present invention has Al, O
,,Tie,,Sin,.
ＺｒＯ，等の特に酸化型のセラミクスに対して良好な濡
れ性を有する。It has particularly good wettability to oxidized ceramics such as ZrO.
Ｔｉ−Ｎｉ合金（Ｔｉ： Ｎｉ ＝４５ ： ５５重量
比）からなる径８■の円筒状試料の一対をＮｉ約３０重
量％、Ｔｉ７０重量％からなる本発明のろう付材料Ａに
よって接合する。ろう付は温度は１０５０℃、接合圧力
は１ＭＰａであり、ろう付けは真空中で行われた。比較
として従来のろう付材料二種Ｂ （Ｔｉ： Ｚｒ： Ｃ
ｕ： Ｎｉ ＝３７．５ ： ３７．５ ：１５．０
： １０．０重量比）およびＣ（’ｒｉ： Ｚｒ：Ｃｕ
＝２５．Ｏ： ２５．０ ： ５０．０重量比）を用い
て同様の円筒状試料を接合した。この場合のろう付は温
度は９００℃、接合圧力は１ＭＰａとした。A pair of cylindrical samples with a diameter of 8 cm made of a Ti--Ni alloy (Ti:Ni = 45:55 weight ratio) are joined together using the brazing material A of the present invention, which contains about 30% by weight of Ni and 70% by weight of Ti. The brazing temperature was 1050° C., the bonding pressure was 1 MPa, and the brazing was performed in vacuum. For comparison, conventional brazing material type 2 B (Ti: Zr: C
u: Ni = 37.5: 37.5: 15.0
: 10.0 weight ratio) and C('ri: Zr:Cu
=25. Similar cylindrical samples were welded using 0:25.0:50.0 weight ratio). In this case, the brazing temperature was 900° C. and the bonding pressure was 1 MPa.
更に比較として同様の円筒状試料をろう付材料なくして
接合し１０００℃、５ＭＰａの接合圧力で拡散接合を行
った。Furthermore, for comparison, similar cylindrical samples were bonded without the use of brazing material, and diffusion bonding was performed at 1000° C. and a bonding pressure of 5 MPa.
このようにして接合された円筒状試料接合強さ（引張り
強度）と保持時間との関係を第１図に示す。FIG. 1 shows the relationship between the bonding strength (tensile strength) and holding time of the cylindrical samples bonded in this way.
第１図によれば本発明のろう付材料Ａは従来のろう付材
料Ｂ、Ｃおよび拡散接合の場合に比して格段に高い接合
強度を与える。そして本発明のろう付材料の場合は３０
分の保持時間で最高の接合強度が得られるが、従来のろ
う付材料Ｂ、Ｃおよび拡散接合の場合、最高の接合強度
を得るに１時間以上の保持時間が必要であると思われる
。According to FIG. 1, the brazing material A of the present invention provides a much higher bonding strength than the conventional brazing materials B and C and diffusion bonding. In the case of the brazing material of the present invention, 30
The highest bond strength is obtained with a holding time of 1 minute, whereas in the case of conventional brazing materials B, C and diffusion bonding, a holding time of 1 hour or more appears to be necessary to obtain the highest bond strength.
したがって本発明のろう付材料を用いればＴｉ、Ｔ１合
金、あるいはセラミクス等をろう付けする場合に従来の
ろう付材料と同様な接合圧力で強力な接合強度が得られ
、また最高接合強度が得られる保持時間も短縮される。Therefore, by using the brazing material of the present invention, when brazing Ti, T1 alloy, ceramics, etc., strong bonding strength can be obtained with the same bonding pressure as conventional brazing materials, and the highest bonding strength can be obtained. Retention time is also reduced.
第１図は横軸に保持時間（分）、縦軸に引張り強度（Ｍ
Ｐａ）をとったグラフである。
図中、０−０：本発明のろう付材料Ａ
Δ−Δ：比較ろう付材料Ｂ
ローロ：比較ろう付材料Ｃ
・−・：拡散接合
Ａ′１
図In Figure 1, the horizontal axis shows the retention time (minutes), and the vertical axis shows the tensile strength (M
This is a graph of Pa). In the figure, 0-0: Brazing material A of the present invention Δ-Δ: Comparative brazing material B Rollo: Comparative brazing material C ---: Diffusion bonding A'1
Claims (1)
とを特徴とするろう付材料 ２、Ｎｉを２０〜４０重量％含み、Ｂ、Ａｌ、Ｓｉ、Ｚ
ｒ、Ｂｉからなる群から選ばれた一種または二種以上の
元素を１〜１０重量％含み、残部がＴｉであることを特
徴とするろう付材料[Scope of Claims] 1. A brazing material characterized by containing 20 to 40% by weight of Ni, with the remainder being Ti. 2. A brazing material containing 20 to 40% by weight of Ni, B, Al, Si, Z
A brazing material containing 1 to 10% by weight of one or more elements selected from the group consisting of r, Bi, and the balance being Ti.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9568790A JPH03294086A (en) | 1990-04-11 | 1990-04-11 | Brazing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9568790A JPH03294086A (en) | 1990-04-11 | 1990-04-11 | Brazing material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03294086A true JPH03294086A (en) | 1991-12-25 |
Family
ID=14144402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9568790A Pending JPH03294086A (en) | 1990-04-11 | 1990-04-11 | Brazing material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03294086A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1140583A (en) * | 1997-07-23 | 1999-02-12 | Daido Steel Co Ltd | Alloy for soldering and solder bonding method |
-
1990
- 1990-04-11 JP JP9568790A patent/JPH03294086A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1140583A (en) * | 1997-07-23 | 1999-02-12 | Daido Steel Co Ltd | Alloy for soldering and solder bonding method |
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