JPH03292758A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enable an operator which measures the electrical properties of a semiconductor device to select a right socket without fail recognizing the sealing type of the semiconductor device and to prevent lead terminals from being deformed due to the erroneous combination of the socket and the device by a method wherein the designation or the code of the sealing type is written on a part of the surface of a semiconductor device main body. CONSTITUTION:'QFP' denotes such a sealing type that lead terminals are led out in four directions and bent, a figure of '5' which follows after a code 'QFP' is a number is univocally determined basing on the dimensions or the width A, the length B, and the thickness C of the main body or a semiconductor device and given to the main body. '10PIN' denotes the number of lead terminals, and 'S1' represents a bend form represented by letters D and E shown in a figure. The designation of a sealing type as mentioned above is printed on a printing area F of the surface of a main body 1 with printing ink, laser rays, or the like. By this setup, as an operator which measures the electrical properties of a semiconductor device is made to select a correct socket without fail recognized the designation of the sealing type of the semiconductor device, the semiconductor device can be prevented from being inserted into a incorrect socket.

Description

[Detailed description of the invention] [Industrial application fields] The present invention relates to a display method for a semiconductor device.

[Prior Art] In conventional semiconductor devices, although it is common to print the name and management number of the semiconductor device in the printing area F of the main body 1 shown in FIG. There was no.

[Problems to be Solved by the Invention] Recently, when mounting a semiconductor device on a printed circuit board, there has been an increase in the number of surface mount devices in which the lead terminals 2 are bent and soldered as shown in FIG. As a result, a number of sealing forms have begun to exist in which the bent shapes of the lead terminals, that is, the D and E dimensions, differ even if the main body lateral dimension A1, the main body vertical dimension B, and the main body thickness C are the same.

The reason for this is that each customer has their own ideas about lead bending shapes to make soldering easier, and the differences are particularly large in different countries.

Along with this, sockets, which are jigs used to measure the electrical characteristics of semiconductor devices before shipping, have come in a variety of shapes.

However, in the above-mentioned conventional technology, the main function of the semiconductor device was printed in an easy-to-understand manner (even if the name to be displayed was printed, there was no indication indicating the sealing type, so the socket that should originally be combined with a certain semiconductor device However, there is a problem in that the lead terminal 2 may be deformed if another socket is combined.The present invention is intended to solve this problem. An object of the present invention is to provide a semiconductor device having a display for identifying the same.

[Means for Solving the Problems] The semiconductor device of the present invention is characterized in that the name or abbreviation of the sealing form is specified on a part of the surface of the semiconductor device main body.

[Example] FIG. 1 is a schematic diagram clearly indicating the names of sealing forms in an example of the present invention. Here, we will give an example of the name of one type of sealing and explain it in detail. Quad Flat Pac
It is an abbreviation of kage.

The number "5" shown thereafter is a number given to the main body, which is uniquely determined by the main body horizontal dimension, the main body vertical dimension B, and the main body thickness C.

"10P N" indicates the number of lead terminals,
"Sl" indicates the bent shape represented by the E dimension.

The name of such a sealing form is specified in a printing area F on one surface of the main body 1 shown in FIG. 2 using printing ink or laser. This allows an operator who measures the electrical characteristics of a semiconductor device to identify the name of the sealing form and select the appropriate socket, thereby preventing the semiconductor device from being placed in an inappropriate socket. It is.

If the dimensions of the main body are the same and the number of bending shapes of the lead terminal 2 increases, use rQFPs-10P N-32J.
"Q, FP5-10P N-3sJ...
(The name of the sealing form may be specified in the printing area.)

Here, we have shown one method of nomenclature for the sealing form, but if the sealing form is clearly specified according to the nomenclature specified by the Japan Electronics Industry Association, it will be easy to identify it widely in Japan. [Effects of the Invention] As stated above, According to the present invention, by specifying the name or abbreviation of the sealing form on a part of the surface of the semiconductor device body,
Since the operator who measures the electrical characteristics can identify the sealing form and select the appropriate socket without making a mistake, it has the effect of preventing deformation of the lead terminals caused by incorrect combinations.

The number of input/output terminals of semiconductor devices is increasing year by year, and the number of lead terminals is also increasing accordingly. By changing the number of lead terminals, there are various numbers of lead terminals, and for each number of terminals, there are many bending shapes, so it is impossible for an operator to identify the sealing form just by looking at it. The effect is extremely large.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing the names of the sealing forms of the semiconductor device of the present invention, and FIG. 2 is a plan view showing a conventional semiconductor device.
FIG. 6 is a side view showing a conventional semiconductor device. 1...Body 2...Lead terminal A...Body horizontal dimension B...Body length Dimensions C: Body thickness D: Terminal flat length E: Terminal length F: Printing area that's all

Claims (1)

[Claims] 1. A semiconductor device comprising an IC chip mounted and sealed, characterized in that a name or abbreviation of a sealing form is specified on a part of the surface of the semiconductor device main body.