JP2000236146A - Printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable the mounting direction of an electronic component to be easily recognized to prevent mistakes and the like in the mounting direction. SOLUTION: A reference dot marking 13 is provided at a position H1 on a board corresponding to the position P1 of a reference lead provided to an electronic component 2 with lead wires 21, 21,.... A reference mark 23 is engraved in the periphery of the electronic component 2 at a position corresponding to the reference dot marking 13. The reference dot marking 13 is formed on the board by subjecting the board to silk printing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a printed circuit board, and more particularly to a technique for clarifying a mounting direction of a component mounted on the board.
The present invention relates to a configuration of a printed circuit board for improving the efficiency of an assembling process and a checking operation.

[0002]

2. Description of the Related Art Conventionally, when a component is manually mounted on a substrate, a shape line of the component to be mounted on the substrate is drawn as a mark, and the component is aligned with the shape line and mounted. I am trying to do it. The shape line is printed on the substrate by silk screen printing or the like, so as to represent the approximate outer shape of the component.

[0003]

However, in the above prior art, although the mounting position can be confirmed by the shape line,
In most cases, the external shape of the component to be mounted is almost rectangular,
Also, the lead wires of the mounted components are symmetrically arranged, and the mounting direction can be reversed upside down (left / right reversed). Mistakes can occur. There has been a demand for a reliable method for preventing such mounting errors and facilitating confirmation of the mounting direction of components.

[0004]

The above is the problem to be solved by the present invention. Next, means for solving the problem will be described. That is, dot markings for confirming the mounting direction of the component are provided at locations on the substrate corresponding to the reference leads of the electronic component having a plurality of leads.

[0005] In addition, a reference mark is engraved on the outer periphery of the electronic component at a location corresponding to the dot marking.

The dot marking is formed by performing silk printing on a substrate.

[0007]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a partial plan view of a printed circuit board of the present invention showing a state where reference dot markings are written on reference lead portions of a mounted component, FIG. 2 is an assembled perspective view of the mounted component and the printed circuit board of the present invention, FIG. 4 is a perspective view showing a state where the mounted component is mounted on the printed circuit board of the present invention, FIG. 4 is a plan view of the mounted component provided with a notch, and FIG. 5 is a plan view of the mounted component provided with a reference mark.

The printed circuit board 1 has an IC chip, an LS
Various electronic components such as an I chip are mounted. And
Electronic components, such as IC chips and LSI chips, need to be reliably and accurately assembled without mistaking the mounting position and mounting direction. After the assembling process, accurate and efficient checking work is required. It is necessary to be able to perform These are not only important for the purpose of quality improvement, but also make it possible to reduce manufacturing costs by preventing errors in the assembly process.

FIG. 1 is a view showing a part of a printed circuit board 1 according to the present invention. The shape line 10 shown in the figure shows the mounting position of the electronic component to be mounted and the approximate outer shape of the component to be mounted, and is configured so that an operator can easily confirm it in the assembly process. In many cases, the shape line 10 is printed on the printed circuit board 1 by silk screen printing or the like in a color different from the color of the surface of the substrate to make it easy for an operator to confirm. The method is not limited to this.

On the left side of the shape line 10, a recess 12 is formed as shown in the figure. In FIG. 1, arrow L is the mounting left direction L, arrow R is the mounting right direction R, arrow U
Is the mounting upper direction U, and the arrow D is the mounting lower direction D. Recess 1
Numeral 2 serves to give directionality to the shape line 10, and serves as a mark of the mounting direction in the assembly process. That is, some of the electronic components to be mounted have cutouts 22 which are directional reference means indicating the direction of the electronic component itself. What is necessary is just to mount so that the position of the concave part 12 of the line 10 and the position of the notch 22 of the electronic component are matched. As a result, the electronic component can be mounted accurately and quickly.

In the mounting upper direction U and the mounting lower direction D of the shape wire 10, lead wire holes 11, 11... For inserting lead wires of electronic components to be mounted are formed.
In this embodiment, the electronic component 2 is shown in FIGS.
As shown in the figure, DIP (Dual In-line
) type IC, and the lead wires 21 of the electronic component 2 are inserted into the lead wire holes 11.
The electronic component 2 is mounted on the printed circuit board 1 by electrically and mechanically connecting them by soldering or the like, and the printed circuit board 1 is assembled and manufactured.

As shown in FIG. 4, in this embodiment, the electronic component 2 has a structure in which seven lead wires 21 are arranged on the upper side 2U and the lower side 2D of the electronic component 2, respectively. And However, lead wires 21
May be of different types and are not limited in the practice of the invention. A notch 22 is provided on the left side 2L of the electronic component 2.

In the embodiment shown in FIG. 5, similarly to the embodiment shown in FIG. 4, seven lead wires are arranged on the upper and lower sides 2U and 2D, respectively. And the left side 2 which is a part of the outer peripheral portion of the electronic component 2.
A reference mark 23 is engraved on the corner of the lower side 2D. 4 and 5, an identification mark 24 indicating the name of the electronic component 2, the name of the manufacturer, and the like is printed on the upper side 2U.

In the embodiment shown in FIGS. 4 and 5, the lead wire 21 disposed on the leftmost end of the lower part 2D of the electronic component 2 is used as a reference lead. With this reference lead position as position P1, the lead wires 21, 21...
Arranged in the right direction, a seventh lead wire 21 is disposed at the rightmost position P7 of the lower side 2D, and an eighth lead wire 21 is disposed at the rightmost position P8 of the upper side U of the electronic component 2. The last fourteenth (leftmost end of the upper side U) lead wires 21 arranged further to the left are arranged at a position P14 facing the position P1. That is, the electronic component 2 shown in FIG.
When the notch 22 is disposed so as to be located on the left side, the reference lead is located at the left end position P1 of the lead row on the lower side 2D. FIG.
In the electronic component 2 shown in (1), the lead wire 21 arranged at the left 2L and the lower 2D corner where the reference mark 23 is engraved, that is, the lead wire 2 arranged at the position P1
1 is set as a reference lead. That is, the reference mark 23 is engraved on the electronic component 2 at a position corresponding to the reference lead.

On the other hand, as shown in FIG. 1, the lead holes 11, 11,... Formed in the printed circuit board 1 of the present invention also have a lower left side L (mounting lower direction D) as shown in FIG. ) Is set as a reference position for lead wire insertion. Similarly, lead wire holes 11, 11... Are arranged in order from the position H1 to the right in such a manner as to rotate around the shape line 10 in a counterclockwise direction. From the position H7 in the downward direction D) to the opposing position H8
, The mounting upper direction U is sequentially arranged to the left, and finally arranged up to the position H17. Then, on the substrate 1, a reference dot marking 1 for identifying the position H1 is provided at a position H1 serving as a reference position for inserting a lead wire.
3 is printed.

An assembling method for mounting the electronic component 2 configured as described above on the printed circuit board 1 will be described. As shown in FIGS. 2 and 3, the electronic component 2 is mounted on a substrate while confirming the mounting position and the external shape of the electronic component 2 with the shape line 10. At this time, the reference lead of the electronic component 2 is used. Are aligned so that the position P1 and the position H1 which is the reference position for mounting on the printed circuit board 1 side coincide with each other, and all the lead wires 21, 21.
... and implement it.

At this time, the lead wire 21 is formed by the following method.
The mounting direction of the electronic component 2 is adjusted so that the position P1 serving as the reference position for the lead wire coincides with the position H1 serving as the reference position for the lead wire hole 11. That is, as shown in FIG.
When the notch 22 serving as the direction reference means exists in the electronic component 2, the side on which the notch 22 is formed is moved to the mounting left direction L where the concave portion 12 serving as the direction reference means of the shape line 10 is formed. Or the reference dot marking 13
When the printed circuit board 1 is positioned so as to be located at the lower left, the electronic component 2 may be positioned such that the side on which the notch 22 is formed is located in the mounting left direction L, and thereby the reference lead position P1 And the position H1 which is the reference position of the lead hole 11 coincides. When the reference mark 23 is present on the electronic component 2 as shown in FIG. 5, the position of the reference mark 23 on the electronic component 2 and the position of the reference dot marking 13 written on the printed circuit board 1 are aligned. When the electronic component 2 is mounted by using the
And the position H1 which is the reference position of the lead hole 11 coincides. Further, as shown in FIGS. 4 and 5, it is also possible to confirm the mounting direction based on the direction of the identification mark 24 written on the electronic component 2 and mount the electronic component 2. For example, when the printed circuit board 1 is arranged so that the reference dot marking 13 is located at the lower left, if the electronic components 2 are arranged and mounted in a direction in which the identification mark 24 can be read, the positions P1 and H1 are obtained.
And can be matched.

As described above, the printed circuit board 1 of the present invention includes:
Since the reference dot marking 13 for identifying the position H1 indicating the reference position is printed, in the assembling process, the position P1 of the reference lead position is changed to the notch 22, the reference mark 23, the identification mark 24 and the like. Therefore, it is possible to match the reference dot marking 13 of the printed circuit board 1 with the reference dot marking 13, so that it is easy to visually recognize and it is possible to prevent operation errors such as mounting errors.

As shown in FIG. 3, the reference dot marking 13 is formed outside the lead hole 11 (the lead wire 21 of the mounted electronic component 2), and the electronic component 2 is mounted on the printed circuit board 1. Since the reference dot markings 13 can be confirmed even after the operation, the positional relationship between the notch 22, the reference mark 23, the identification mark 24, etc. of the electronic component 2 and the reference dot markings 13 on the printed circuit board 1 is provided. Is checked by the operator, and the mounting direction of the electronic component 2 can be easily checked, and a mounting error can be easily found. In addition, since the reference dot marking 13 is configured to be disposed at only one location around the shape line 10, the reference dot marking 13 is a simple notation, and it is possible to prevent misunderstandings or the like in a confirmation operation without misleading descriptions or misrecognition by looking at the print. It is.

Since the reference dot markings 13 are formed by silk-screen printing on the printed circuit board 1 in the same manner as the shape lines 10, the reference dot markings 13 are used when the shape lines are printed on the substrate. Since they can be formed at the same time and no extra manufacturing costs and manufacturing steps are required, it is possible to provide a printed circuit board 1 which is inexpensive and has an excellent identification effect.

In the present embodiment, the electronic component 2 is a DIP type IC, but the electronic component 2 is an SOP (Small Ou).
The printed circuit board 1 of the present invention can be applied to a line package (IC) type IC or the like, and the same effects can be obtained.

[0022]

The printed circuit board of the present invention has the following effects because it is constructed as described above. That is, dot marking for confirming the mounting direction of the component is provided at a position on the substrate corresponding to the reference lead of the electronic component having a plurality of leads. The insertion position and the mounting direction of the electronic component can be easily recognized, the component mounting operation can be performed quickly and reliably, and it is possible to prevent an error such as a wrong mounting direction. In addition, even after component mounting, the mounting direction can be checked by looking at the dot markings and the mounted components, so that the checking operation is reliable and quality is improved.

In addition, since the reference mark is engraved on the outer periphery of the electronic component at a position corresponding to the dot marking, the dot mark on the substrate and the reference mark on the electronic component can be matched to obtain the electronic component. Can be reliably and quickly implemented. In addition, the checking operation after mounting the electronic components is easy and can be performed reliably.

Further, since the dot marking is formed by performing silk printing on the substrate, it is possible to construct a useful printed circuit board at low cost without requiring extra production costs and production steps.

[Brief description of the drawings]

FIG. 1 is a partial plan view of a printed circuit board according to the present invention, showing a state where reference dot markings are written on reference lead portions of a mounted component.

FIG. 2 is an assembled perspective view of a mounting component and a printed circuit board of the present invention.

FIG. 3 is a perspective view showing a state in which a mounted component is mounted on the printed circuit board of the present invention.

FIG. 4 is a plan view of a mounted component provided with a notch.

FIG. 5 is a plan view of a mounted component provided with reference lead marks.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Electronic component 10 Shape line 11 Lead wire hole 12 (Shape line) recess 13 Dot mark 21 Lead 22 Notch 23 Reference mark

Claims (3)

[Claims] 1. A printed circuit board, wherein dot markings for confirming the mounting direction of a component are provided at locations on the board corresponding to reference leads of an electronic component having a plurality of leads. 2. The printed circuit board according to claim 1, wherein a reference mark is engraved at a position corresponding to the dot marking on an outer peripheral portion of the electronic component. 3. The printed circuit board according to claim 1, wherein the dot marking is formed by performing silk printing on the board.