JPH03291878A - Ic socket - Google Patents

Abstract

PURPOSE:To connect elements for impedance regulation to pins in parallel regardless of a base by providing plural pin seats connected electrically to one pin seat. CONSTITUTION:Pins 30 and 31 are projected from the lower side of a socket, and the upper parts of the pins form pin seats. By making the interval of the pins 30 and 31 equal to the interval of IC pins, the socket can be mounted on a base, and the IC can be inserted to the socket with no trouble. In this case, pin seats 20 and 21 are connected electrically to the pin seats 30 and 31 respectively, and elements can be connected to the pins of the IC by inserting an integrated resistor. By mounting this socket on the base, elements for impedance regulation can be connected to the pins in parallel regardless of the base.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to sockets, and in particular to sockets for integrated circuits.

[Conventional technology] Traditionally, integrated circuits (hereinafter referred to as ICs) have been mounted directly on boards.
There are cases where the IC is attached to the board with a socket, and cases where the IC is attached to the board directly and the IC is inserted into the socket.

When using a socket, there are cases where there is a risk of the IC being used being damaged, and cases where the IC itself is expensive or there is a possibility of replacing the IC, such as FROM (mW electrically writable read-only memory). In some cases. The reason why it is not used in other cases is to avoid increasing the cost of the mounting method board. Since the socket actually used has the same pin arrangement as the IC to be mounted, the socket can be mounted on a board on which an IC can be directly mounted. Since the socket has a pin receiver with the same pin arrangement as the IC to be mounted, the IC can be inserted into the socket without changing the shape of the pins.

[Problem to be solved by the invention]

In recent years, the manufacturing process of ICs has been improved, and ICs that consume less power and operate at higher speeds can now be manufactured.

With the application of these new manufacturing processes to conventionally produced general-purpose ICs, products with the same functions but better characteristics are being supplied. However, it is known that when the rising and falling signals of an IC output signal become faster than the delay caused by the wiring on the board, the waveform becomes distorted due to the influence of reflection at the end of the wiring. Figure 3 shows an example of a distorted waveform. This waveform distortion often causes equipment to malfunction. It is also known that this reflection can be suppressed by matching the impedance of the d-force of the IC with the impedance of the line.

However, when designing a new board, this can be solved by making it possible to mount resistors and capacitors for impedance adjustment in advance and changing the values to be mounted. but,
For boards that have already been designed, the newly supplied I
A problem arises in that it is not compatible with C.

[Means to solve the problem]

The IC socket of the present invention has pins on the board surface with the same pin arrangement as the pin arrangement of the IC to be mounted, and has a pin receiver on the IC mounting surface with the same arrangement as the pin arrangement of the IC to be mounted. It has a plurality of pin receivers electrically connected to at least one pin receiver.

Furthermore, the IC socket of the present invention has an IC socket to be mounted.
I have pins with the same pin layout as the pin layout on the board surface, and a pin receiver with the same pin layout as the pin layout of the IC to be mounted.
The IC socket provided on the C mounting surface has at least one pin receiver and a plurality of other pin receivers, and has means for mounting an electronic component between the one pin and the other pins.

〔Example〕

The present invention will be explained with reference to FIG. Figure 1 (2
) is a top view of a socket according to an embodiment of the present invention. A cross-sectional view along line a-5 is shown in FIG. 1(1). Pins 30°31 come out from the bottom of the socket. This pin has a pin receiver at the top. Therefore, if the spacing between the pins 3031 is made the same as the pin spacing of the IC, the socket can be mounted on the board and the IC can be inserted into the socket without any problems. Here pin holder 2
0.degree. 21 are electrically connected to pin receivers 30 and 31, respectively, and by inserting a collective resistor as shown in FIG. 1(3), an element can be connected to each IC pin. By mounting this socket on the board, an impedance adjustment element can be connected in parallel to each pin regardless of the board.

Next, the second invention will be explained in detail using FIG. FIG. 2 (2) is a top view of the socket of the present invention, and a-5
A cross-sectional view in between is shown in FIG. 2 (1).

The pins 50 and 51 also serve as pin receivers, and there are pin receivers 40 and 41 corresponding to each pin receiver. Second
As shown in FIG. 3, a chip resistor is connected between the pin receivers 40 and 50, and the other pins are similarly connected with chip resistors or conductors.

If the IC is inserted into the pin receivers 40 and 41, the elements can be inserted in series between the pins and the board.

Furthermore, by inserting an IC into the pin receivers 50 and 51, elements can be inserted in parallel to each terminal.

〔Effect of the invention〕

The present invention can deal with obstacles such as reflections without redesigning a previously designed board.

[Brief explanation of the drawing]

Figure 1 is a detailed illustration of the first invention, and Figure 1 (1)
is a sectional view of the socket, (2) is a top view, and (3) is a diagram for explaining an example of use. FIG. 2 is a diagram for explaining the second invention in detail, and FIG. 2 (1) is a sectional view of the socket, (2) is a top view, and (3) is a diagram for explaining an example of use. Figure 3 is an example of a waveform distorted by reflection. 10.60...Socket base material, 20.2140
゜4 1...Pin receiver, 30゜31゜50゜1...Pin and pin receiver.

Claims (2)

[Claims] (1) A socket for mounting an integrated circuit (hereinafter abbreviated as IC) package on a board, which has pins on the board surface with the same pin arrangement as the IC to be mounted. An IC socket having a plurality of pin receivers electrically connected to at least one pin receiver in an IC socket having pin receivers arranged in the same manner as the pin arrangement on an IC mounting surface. (2) A socket for mounting an IC package on a board, which has pins on the board surface with the same pin arrangement as the IC to be mounted; An IC socket having a pin receiver on the IC mounting surface is characterized by having at least one pin receiver and a plurality of other pin receivers, and having means for mounting an electronic component between the one pin and the other pins. IC socket.