JPH03291878A - Ic socket - Google Patents
Ic socketInfo
- Publication number
- JPH03291878A JPH03291878A JP9450990A JP9450990A JPH03291878A JP H03291878 A JPH03291878 A JP H03291878A JP 9450990 A JP9450990 A JP 9450990A JP 9450990 A JP9450990 A JP 9450990A JP H03291878 A JPH03291878 A JP H03291878A
- Authority
- JP
- Japan
- Prior art keywords
- pin
- socket
- pins
- board
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
Abstract
Description
【発明の詳細な説明】
C産業上の利用分野〕
本発明はソケットに関し特に集積回路用のソケットに関
する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to sockets, and in particular to sockets for integrated circuits.
口従来の技術〕
従来より集積回路(以下IC)の基板への実装は直接I
Cを基板ヘハンタ付けする場合とンケソトヲ基板ヘハン
タ付けしそのソケ、ットヘICを挿入する場合がある。[Conventional technology] Traditionally, integrated circuits (hereinafter referred to as ICs) have been mounted directly on boards.
There are cases where the IC is attached to the board with a socket, and cases where the IC is attached to the board directly and the IC is inserted into the socket.
ソケットを使う場合は使用するICが壊れるおそれが考
えられる場合とIC自身が高価な場合あるいはICとし
てFROM(mW電気的書込可能なリードオンリーメモ
リ)等のように時として差替の可能性がある場合である
。これ以外の場合に使用しないのは実装法基板のコスト
を上げない為である。実際に使用するソケットは実装す
るICと同じピン配置を有するので、ICを直接実装で
きる基板にソケットを実装することができる。そのソケ
ットは実装するICと同じピン配置のピン受けがあるの
でICは何らピン形状を変えることなくソケットに挿入
できる。When using a socket, there are cases where there is a risk of the IC being used being damaged, and cases where the IC itself is expensive or there is a possibility of replacing the IC, such as FROM (mW electrically writable read-only memory). In some cases. The reason why it is not used in other cases is to avoid increasing the cost of the mounting method board. Since the socket actually used has the same pin arrangement as the IC to be mounted, the socket can be mounted on a board on which an IC can be directly mounted. Since the socket has a pin receiver with the same pin arrangement as the IC to be mounted, the IC can be inserted into the socket without changing the shape of the pins.
近年ICの製造プロセスが改善されより低消費電力で高
速動作を行うICが作られるようになった。In recent years, the manufacturing process of ICs has been improved, and ICs that consume less power and operate at higher speeds can now be manufactured.
従来から作られていた汎用のICもこれらの新しい製造
プロセスが適用されることで同一機能でありあがらより
特性のよいものが供給されるようになってきている。と
ころが基板上の配線による遅延に対してICの出力信号
の立上り立下り信号が高速になると配線の終端での反射
の影響で波形がみだれてしまうという現象が知られてい
る。第3図がみだれた波形の例である。この波形のみだ
れで装置が誤動作することも多い。この反射をおさえる
にはICのd力のインピーダンスと線路のインピーダン
スの整合をとることで解決できることも知られている。With the application of these new manufacturing processes to conventionally produced general-purpose ICs, products with the same functions but better characteristics are being supplied. However, it is known that when the rising and falling signals of an IC output signal become faster than the delay caused by the wiring on the board, the waveform becomes distorted due to the influence of reflection at the end of the wiring. Figure 3 shows an example of a distorted waveform. This waveform distortion often causes equipment to malfunction. It is also known that this reflection can be suppressed by matching the impedance of the d-force of the IC with the impedance of the line.
ただ、基板の新規設計を行う場合はあらかじめインピー
ダンス調整用の抵抗やコンデンサを実装できるようにし
ておき実装する値を変えることで解決できる。しかし、
すでに設計ずみの基板に対しては、新しく供給されるI
Cに対応できないという問題が生じる。However, when designing a new board, this can be solved by making it possible to mount resistors and capacitors for impedance adjustment in advance and changing the values to be mounted. but,
For boards that have already been designed, the newly supplied I
A problem arises in that it is not compatible with C.
本発明のICソケットは実装しようとするICのピン装
置と同じピン配置のピンを基板面に有し、実装しようと
するICのピン配置と同じ配置のピン受けをIC実装面
に有するICソケットに於いて少なくとも1つのピン受
けに対し電気的に接続された複数のピン受けを有する。The IC socket of the present invention has pins on the board surface with the same pin arrangement as the pin arrangement of the IC to be mounted, and has a pin receiver on the IC mounting surface with the same arrangement as the pin arrangement of the IC to be mounted. It has a plurality of pin receivers electrically connected to at least one pin receiver.
さらに、本発明のICソケットは実装しようとするIC
のピン配置と同じピン配置のピンを基板面に有し、実装
しようとするICのピン配置と同じ配置のピン受けをI
C実装面に有するICソケットに於いて少なくとも1つ
のピン受けに対し複数の他のピン受けを有し該1つのピ
ンと他のピンの間に電子部品を実装する手段を有する。Furthermore, the IC socket of the present invention has an IC socket to be mounted.
I have pins with the same pin layout as the pin layout on the board surface, and a pin receiver with the same pin layout as the pin layout of the IC to be mounted.
The IC socket provided on the C mounting surface has at least one pin receiver and a plurality of other pin receivers, and has means for mounting an electronic component between the one pin and the other pins.
本発明について第1図を参照して説明する。第1図(2
)が本発明の実施例のソケットの上面図。a−5間での
断面図が第1図(1)である。ピン30゜31がソケッ
トの下部から出ている。このピンは上方がピン受けにな
っている。よってピン3031の間隔をICのピン間隔
と同じにしておればソケットの基板への実装とICのソ
ケットへの挿入は問題なく行なえる。ここでピン受け2
0゜21はそれぞれピン受け30.31と電気的に接続
されており第1図(3)のように集合抵抗を挿入するこ
とで各ICのピンに対して素子を接続することができる
。このソケットを基板に実装することでインピーダンス
調整の素子を基板に関係なく各ピンに並列に接続するこ
とができる。The present invention will be explained with reference to FIG. Figure 1 (2
) is a top view of a socket according to an embodiment of the present invention. A cross-sectional view along line a-5 is shown in FIG. 1(1). Pins 30°31 come out from the bottom of the socket. This pin has a pin receiver at the top. Therefore, if the spacing between the pins 3031 is made the same as the pin spacing of the IC, the socket can be mounted on the board and the IC can be inserted into the socket without any problems. Here pin holder 2
0.degree. 21 are electrically connected to pin receivers 30 and 31, respectively, and by inserting a collective resistor as shown in FIG. 1(3), an element can be connected to each IC pin. By mounting this socket on the board, an impedance adjustment element can be connected in parallel to each pin regardless of the board.
次に第2図を使用して第2の発明の詳細な説明する。第
2図(2)が本発明のソケットの上面図であり、a−5
間の断面図が第2図(1)である。Next, the second invention will be explained in detail using FIG. FIG. 2 (2) is a top view of the socket of the present invention, and a-5
A cross-sectional view in between is shown in FIG. 2 (1).
ピン50.51は同時にピン受けとなっておりそれぞれ
のピン受けに対応してピン受け40.41がある。第2
図(3)のようにピン受け40.50間にチップ抵抗を
接続するものとしまた、他のピン間も同様にチップ抵抗
あるいは導体で接続する。The pins 50 and 51 also serve as pin receivers, and there are pin receivers 40 and 41 corresponding to each pin receiver. Second
As shown in FIG. 3, a chip resistor is connected between the pin receivers 40 and 50, and the other pins are similarly connected with chip resistors or conductors.
ここでICをピン受け40.41の方に挿入するとピン
から基板間に直列に素子を入れることができる。If the IC is inserted into the pin receivers 40 and 41, the elements can be inserted in series between the pins and the board.
また、ピン受け50.51の方にICを挿入すると各端
子に並列に素子を挿入することができる。Furthermore, by inserting an IC into the pin receivers 50 and 51, elements can be inserted in parallel to each terminal.
本発明はすてに設計した基板に対して再設計することな
しに反射などの障害に対応することができる。The present invention can deal with obstacles such as reflections without redesigning a previously designed board.
第1図は第一の発明の詳細な説明する図で第1図(1)
はソケットの断面図、(2)は上面図、(3)は使用例
を説明する為の図。第2図は第二の発明の詳細な説明す
る図で第2図(1)はソケットの断面図、(2)は上面
図、(3)は使用例を説明する為の図。第3図は反射に
よりみだれた波形の例。
10.60・・・・・・ソケット基材、20.2140
゜
4
1・・・・・・ピン受け、
30゜
31゜
50゜
1・・・・・・ピン兼ピン受け。Figure 1 is a detailed illustration of the first invention, and Figure 1 (1)
is a sectional view of the socket, (2) is a top view, and (3) is a diagram for explaining an example of use. FIG. 2 is a diagram for explaining the second invention in detail, and FIG. 2 (1) is a sectional view of the socket, (2) is a top view, and (3) is a diagram for explaining an example of use. Figure 3 is an example of a waveform distorted by reflection. 10.60...Socket base material, 20.2140
゜4 1...Pin receiver, 30゜31゜50゜1...Pin and pin receiver.
Claims (2)
に実装する為のソケットで、実装しようとするICのピ
ン配置と同じピン配置のピンを基板面に有し、実装しよ
うとするICのピン配置と同じ配置のピン受けをIC実
装面に有するICソケットに於いて少なくとも1つのピ
ン受けに対し電気的に接続された複数のピン受けを有す
ることを特徴とするICソケット。(1) A socket for mounting an integrated circuit (hereinafter abbreviated as IC) package on a board, which has pins on the board surface with the same pin arrangement as the IC to be mounted. An IC socket having a plurality of pin receivers electrically connected to at least one pin receiver in an IC socket having pin receivers arranged in the same manner as the pin arrangement on an IC mounting surface.
で、、実装しようとするICのピン配置と同じピン配置
のピンを基板面に有し、実装しようとするICのピン配
置と同じ配置のピン受けをIC実装面に有するICソケ
ットに於いて少なくとも1つのピン受けに対し複数の他
のピン受けを有し該1つのピンと他のピン間に電子部品
を実装する手段を有することを特徴とするICソケット
。(2) A socket for mounting an IC package on a board, which has pins on the board surface with the same pin arrangement as the IC to be mounted; An IC socket having a pin receiver on the IC mounting surface is characterized by having at least one pin receiver and a plurality of other pin receivers, and having means for mounting an electronic component between the one pin and the other pins. IC socket.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9450990A JPH03291878A (en) | 1990-04-10 | 1990-04-10 | Ic socket |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9450990A JPH03291878A (en) | 1990-04-10 | 1990-04-10 | Ic socket |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03291878A true JPH03291878A (en) | 1991-12-24 |
Family
ID=14112291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9450990A Pending JPH03291878A (en) | 1990-04-10 | 1990-04-10 | Ic socket |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03291878A (en) |
-
1990
- 1990-04-10 JP JP9450990A patent/JPH03291878A/en active Pending
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