JPH0329169B2 - - Google Patents

Info

Publication number
JPH0329169B2
JPH0329169B2 JP17133184A JP17133184A JPH0329169B2 JP H0329169 B2 JPH0329169 B2 JP H0329169B2 JP 17133184 A JP17133184 A JP 17133184A JP 17133184 A JP17133184 A JP 17133184A JP H0329169 B2 JPH0329169 B2 JP H0329169B2
Authority
JP
Japan
Prior art keywords
molding
wafer
melt
groove
inlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17133184A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6149415A (ja
Inventor
Takashi Sawatani
Takashi Yokoyama
Ichiro Hide
Takeyuki Matsuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hokusan Co Ltd
Original Assignee
Hokusan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hokusan Co Ltd filed Critical Hokusan Co Ltd
Priority to JP17133184A priority Critical patent/JPS6149415A/ja
Publication of JPS6149415A publication Critical patent/JPS6149415A/ja
Publication of JPH0329169B2 publication Critical patent/JPH0329169B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H01L21/02625—Liquid deposition using melted materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H01L21/02628—Liquid deposition using solutions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Photovoltaic Devices (AREA)
  • Recrystallisation Techniques (AREA)
  • Silicon Compounds (AREA)
JP17133184A 1984-08-17 1984-08-17 製造皿 Granted JPS6149415A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17133184A JPS6149415A (ja) 1984-08-17 1984-08-17 製造皿

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17133184A JPS6149415A (ja) 1984-08-17 1984-08-17 製造皿

Publications (2)

Publication Number Publication Date
JPS6149415A JPS6149415A (ja) 1986-03-11
JPH0329169B2 true JPH0329169B2 (enrdf_load_html_response) 1991-04-23

Family

ID=15921248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17133184A Granted JPS6149415A (ja) 1984-08-17 1984-08-17 製造皿

Country Status (1)

Country Link
JP (1) JPS6149415A (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPS6149415A (ja) 1986-03-11

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