JPH03290912A - Capacitor element and its manufacture - Google Patents

Abstract

PURPOSE:To simplify a manufacturing process without need of processes of resist printing and etching by forming an electrode on both entire surface and rear faces of a substrate made of a dielectric body and dividing an electrode on one of the faces with a groove formed on that face. CONSTITUTION:A pair of electrodes 3, 3 are provided on one of faces of a substrate 2 made of a dielectric body. The electrodes 3, 3 are to be connected with connection terminals of an oscillator 20 when a capacitance added oscillator is to be formed for example by combining capacitor elements (C1,C2) with the connection terminals. The electrodes 3, 3 are formed by dividing an electrode formed on an entire surface of one of the faces of the substrate 2 with a groove 5. An electrode 4 is formed on an entire surface of the other face of the substrate 2, and is opposite to the electrodes 3, 3 with the substrate 2 interposed. By adjusting cut positions in lengthwise and widthwise directions of a unit 6, an overlap area of the electrodes 3, 3 and the electrode 4 is adjusted to obtain a capacitor element 1 having a desired capacitance value.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a capacitor element used in a piezoelectric resonant component and a method for manufacturing the same.

εPrior art] For example, in a Colpitts-type oscillation circuit as shown in FIG.
and ° resistor Rf are connected in parallel, and between the input terminal of the inverter 25 and the ground, and the inverter 25
In the oscillation circuit as described above, in which capacitors CI and C2 are connected between the output terminal and ground of Regarding JP-A-6:? -6791
No. 2 or Japanese Utility Model Application Publication No. 149628/1983. However, as a conventional capacitor element used in such a capacitance-added oscillator, the fifth
There is a known capacitor element having a configuration such that the front surface is shown in the figure and the back surface is shown in FIG. electrodes, that is, first and second electrodes 223, 23, are provided, and on the other surface, an elongated third electrode (ground electrode) 24 facing the capacitor electrodes 23, 23 is provided.

In manufacturing this conventional capacitor element 21, a tS material is deposited on the entire front and back surfaces of the two units.
After printing the resist in a predetermined pattern, etching is performed, and by cutting this unit, a single capacitor element is cut out.

[Problem to be solved by the invention] However, in the above capacitor element, the first and second electrodes 23, 23 formed on one surface of the substrate and the electrodes 23, 23 formed on the other surface of the substrate 22 All of the third electrodes are formed on the entire surface of the substrate, and are arranged in a predetermined pattern at predetermined positions on each surface. Therefore, when a misalignment of resist printing occurs, the overlapping area of opposing electrodes changes, which greatly affects the capacitance value, making it difficult to obtain a capacitor element with little variation.

However, the above-mentioned rubbing of resist printing is practically unavoidable to some extent. Therefore, in the manufacturing process of the capacitor element mentioned above, the unit is inspected and the capacitance is measured, and if the capacitance value is not within the allowable range for the capacitor element alone, the formed electrode is removed and the capacitor is reassembled. Various steps such as vapor deposition of electrode material, resist printing, etching, and cutting are repeated, and after confirming that a predetermined capacitance value has been obtained, cutting is performed to cut out the capacitor element. I want a capacitor element! ! ! In order to create a product, a complex manufacturing process must be performed, and Il! There is a problem in that the manufacturing cost increases.

The present invention solves the above-mentioned problems, and provides a highly reliable capacitor element with little variation in capacitance value, and a highly reliable capacitor element with low variation in capacitance value. ! The purpose of the present invention is to provide a manufacturing method that can be manufactured at low cost without complicating the manufacturing process.

[Means for solving the problems] In order to solve the above problems, this book ll! The capacitor element according to the invention includes: a substrate made of a dielectric; first and second electrodes formed on the entire surface of one side of the substrate and separated by a groove; - formed on the entire surface of the other side of the substrate. , comprising the first and second electrodes and a third electrode opposing the substrate with the substrate in between.

Further, the method for manufacturing a capacitor element according to the present invention includes a substrate made of a dielectric material, two electrodes formed on the entire surface of one side of the substrate and divided by a groove, and electrodes formed on the entire surface of the other substrate. A method for manufacturing a capacitor element comprising a dielectric strip-shaped substrate, the unit comprising: forming electrodes on the entire front and back surfaces of a rectangular substrate made of a dielectric material to cut out a plurality of capacitor elements; forming a groove reaching the substrate on one surface of the substrate, dividing the electrode formed on one surface of the substrate, and cutting the unit in which the groove is formed to cut out a single capacitor element. It is characterized by

[Function] In the capacitor element according to the present invention, the capacitor element is formed on the entire surface of one side of a substrate made of a dielectric material.

The first and second electrodes are formed by dividing the electrodes by clearing, and the third electrode is formed on the entire other surface of the substrate. Therefore, by combining resist printing and etching to form the first to third electrodes, there is no need to form electrode patterns with delicate shapes and positional relationships, and the manufacturing process is simplified. Variations in capacitance values due to rubbing etc. are eliminated.

Furthermore, by adjusting the width, length, width, etc. of the capacitor element, the overlapping area of the electrodes can be changed C': The capacitance value can be more easily finely adjusted. In the device manufacturing method, a unit is formed by providing electrodes on both the front and back surfaces of a rectangular substrate made of a dielectric material, and an electrode on one side of the unit with electrodes formed on both the front and back surfaces is placed at a predetermined position. By forming the dividing layer, resist printing and etching steps are no longer necessary, and the manufacturing process is simplified.

Furthermore, since you can change the length and width of the capacitor element or the width of the edge when cutting the unit,
It is now possible to fine-tune the capacitance value after formation, eliminating the need to repeat steps such as electrode deposition and etching in conventional manufacturing methods, making it easier to manufacture capacitor elements with desired capacitance values. It becomes possible to do something.

[Example code] Hereinafter, an example of the present invention will be explained based on the drawings.

FIG. 1 is a perspective view showing a capacitor element according to an embodiment of the present invention. As shown in the figure, in the capacitor element 1 of this embodiment, a pair of ti, that is, first and second 'j:, poles 3, 3 are provided on one surface of a substrate 2 made of a dielectric material. There is.

The first and second electrodes 3.3 are, for example, as shown in FIG.
This serves as an electrode connected to the connection terminal of the oscillator 20. The first and second electrodes 3 3 are formed by dividing an electrode formed on the entire surface of one side of the substrate 2 with a groove 5 . A third electrode (seventh electrode) is provided on the other surface of the substrate 2 over the entire surface.
When used in the oscillation circuit shown in the figure, a ground electrode 4) is formed, which faces the first and second electrodes 3.3 with the substrate 2 in between.

In the capacitor element l configured as above,
By combining resist printing and etching to form the first to third electrodes, it is not necessary to form electrode patterns having delicate shapes and positional relationships, and the manufacturing process can be simplified.

Furthermore, since no resist printing is performed, variations in capacitance values due to printing errors and the like are eliminated. Furthermore, the capacitance value can be easily finely adjusted by adjusting the width, length, width of the capacitor element 1, etc., and adjusting the overlapping area of the @ poles.

Next, a method for manufacturing a capacitor element according to the present invention will be explained using FIGS. 2 to 4.

First, @ f! 3
, 4 to create unit 6.

Next, a so-called scribe cut is performed on one side of the unit 6 using a dicing machine to make a cut halfway through the thickness of the unit, in the width direction of the unit 6. 115 (FIG. 2), the electric current Ti3 formed on one surface of the substrate 2 is divided at predetermined positions. Then, as shown in FIG. 3, the unit 6 is cut longitudinally along arrow A. Furthermore, as shown in FIG. 4, unit 6 is moved along arrow B? By cutting in the width direction at a position between 115 and 5, a single capacitor element 1 shown in FIG. 1 is obtained.

In the above manufacturing method, by adjusting the cut position in the longitudinal direction and the width direction of the unit 6, the first and second
A capacitor element 1 having a desired capacitance value can be obtained by adjusting the overlapping area of the electrodes 3, 3 and the third electrode If14. Furthermore, by changing the width of the fountain 5, fine adjustment of the capacitance can be made without changing the overall dimensions of the capacitor element 1.

As described above, the method for manufacturing a capacitor element of the present invention does not require the conventional process of forming a predetermined electrode pattern by resist printing and etching, and requires repetition of various processes such as electrode deposition, resist printing, and etching. This simplifies the manufacturing process.

In addition, the shape of unit 6, the direction and cross-sectional shape of 7115,
The order of cutting of the unit 6, the shape of the single capacitor element 1 to be manufactured, etc. are not limited to the above embodiments, and can be arbitrarily changed as necessary.

[Effects of the Invention] In the capacitor element according to the present invention, electrodes are formed on the entire front and back surfaces of a substrate made of a dielectric material, and the electrodes on one side are divided by forming grooves on the surfaces. There is no need for resist printing or etching processes in the manufacturing process, and the manufacturing process can be simplified. Further, by adjusting the width, length, groove width, etc. of the capacitor element and adjusting the overlapping area of the electrodes, the capacitance value can be easily finely adjusted.

Moreover, W! of the capacitor element according to the present invention! The method is to make grooves on one side of the unit with electrodes formed on both sides, divide the electrodes at predetermined positions, and then cut to cut out the capacitor elements. The manufacturing process can be simplified. Furthermore, by adjusting the width, length, width, etc. of the capacitor element, a capacitor element having a desired capacitance value can be easily manufactured.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a capacitor element according to an embodiment of the present invention, and FIGS. 2, 3, and 4 are perspective views of a capacitor element according to an embodiment of the present invention. ! FIG. 5 and FIG. 6 are perspective views showing the front and back sides of a conventional capacitor element, respectively, and FIG. 7 is a diagram showing an oscillation circuit. 1... Capacitor element 2... Substrate 3... First and second electrodes 4... Third electrode 5... Wei 6...unit

Claims (2)

[Claims] (1) A substrate made of a dielectric; first and second electrodes formed on the entire surface of one side of the substrate and separated by a groove; and first and second electrodes formed on the entire surface of the other substrate and separated by a groove. Second
A capacitor element comprising an electrode and a third electrode opposing the substrate with the substrate in between. (2) A capacitor element comprising a substrate made of a dielectric, two electrodes formed on the entire surface of one side of the substrate and separated by a groove, and an electrode formed on the entire surface of the other substrate. In the manufacturing method, a unit is created by cutting out a plurality of capacitor elements by forming electrodes on both the front and back surfaces of a rectangular substrate made of a dielectric material, and a plurality of capacitor elements are cut out on one side of the unit, and even on the substrate. A method for manufacturing a capacitor element, comprising: forming a reaching groove to divide an electrode formed on one surface of the substrate; and cutting the unit in which the groove is formed to cut out a single capacitor element. .