JPH0328990B2 - - Google Patents
Info
- Publication number
- JPH0328990B2 JPH0328990B2 JP60283455A JP28345585A JPH0328990B2 JP H0328990 B2 JPH0328990 B2 JP H0328990B2 JP 60283455 A JP60283455 A JP 60283455A JP 28345585 A JP28345585 A JP 28345585A JP H0328990 B2 JPH0328990 B2 JP H0328990B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- support
- processing
- film body
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 11
- 239000010408 film Substances 0.000 description 31
- 238000005520 cutting process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 238000003672 processing method Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は薄膜体のレーザ加工方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method of laser processing a thin film body.
従来の技術
従来の薄膜体のレーザ加工方法は、例えば特開
昭60−83793号公報に示されているフイルムの切
断方法のように、第４図のような構成になつてい
た。2. Description of the Related Art A conventional method for laser processing a thin film body, such as the method for cutting a film disclosed in Japanese Patent Application Laid-Open No. 60-83793, has a configuration as shown in FIG. 4.
すなわちレーザ発振器１より出たレーザビーム
２を走行するフイルム上に集光し加工を行なうも
のであつた。３は反射鏡、４は集光レンズ、５は
薄膜体、６はガイドロール、７は供給ロール、８
は巻き取りロールである。 That is, a laser beam 2 emitted from a laser oscillator 1 is focused onto a traveling film to perform processing. 3 is a reflecting mirror, 4 is a condensing lens, 5 is a thin film body, 6 is a guide roll, 7 is a supply roll, 8
is the take-up roll.
発明が解決しようとする問題点
しかし、上記のような構成では薄膜体５の厚さ
が1μｍ程度になると薄いため、薄膜体を走行さ
せるのがずかしくなり、特に加工部において薄膜
体に大きな張力をかけられないため薄膜体表面の
たわみをなくすことが困難となる。レーザ加工で
は被加工物の表面が平らでないとビームのスポツ
ト径が変化するため加工精度が悪くなる。Problems to be Solved by the Invention However, in the above configuration, the thin film body 5 is thin when the thickness is about 1 μm, so it becomes difficult to run the thin film body, and a large tension is applied to the thin film body, especially in the processing part. Therefore, it is difficult to eliminate deflection on the surface of the thin film body. In laser processing, if the surface of the workpiece is not flat, the beam spot diameter will change, resulting in poor processing accuracy.
本発明は上記問題点に鑑み、薄膜体の厚さが非
常に薄い場合でも薄膜体の走行を容易にし、また
加工精度も向上させる薄膜体のレーザ加工方法を
提供するものである。 In view of the above-mentioned problems, the present invention provides a method for laser processing a thin film body, which facilitates the running of the thin film body even when the thickness of the thin film body is very thin, and improves the machining accuracy.
問題点を解決するための手段
上記問題点を解決するために本発明の薄膜体の
レーザ加工方法は、薄膜体をそれよりも厚い支持
体の少なくともどちらか一方の表面に分離可能な
方法で密着させ一体化した状態で加工部に供給
し、レーザ・ビームを照射して加工した後、薄膜
体を支持体から連続的に分離し回収するものであ
る。Means for Solving the Problems In order to solve the above problems, the method of laser processing a thin film body of the present invention adheres the thin film body to at least one surface of a thicker support in a separable manner. After being supplied to the processing section in an integrated state and processed by irradiation with a laser beam, the thin film body is continuously separated from the support and recovered.
作 用
本発明は上記したように薄膜体を静電気等の分
離可能な方法で支持体に密着させ、一体化した状
態で加工部に供給し走行させるので、薄膜体単体
の場合に比べ大きな張力をかけることができ、薄
膜体表面のたわみが減少し、レーザ・ビームを照
射しても精度の良い加工ができる。また薄膜体と
支持体は静電気等の手段で密着させられているだ
けなので、薄膜体を支持体から連続的に分離し回
収することができる。Function: As described above, the present invention brings the thin film body into close contact with the support body using a separable method such as static electricity, and supplies the thin film body to the processing section in an integrated state and runs it. This reduces the deflection of the thin film surface, allowing for highly accurate processing even when irradiated with a laser beam. Further, since the thin film body and the support body are only brought into close contact with each other by means such as static electricity, the thin film body can be continuously separated from the support body and recovered.
実施例
以下本発明の一実施例の薄膜体のレーザ加工方
法について、図面を参照しながら説明する。Embodiment A method of laser processing a thin film body according to an embodiment of the present invention will be described below with reference to the drawings.
第１図は本発明の第１の実施例における薄膜体
のレーザ加工方法のうちフイルムの切断の構成図
を示すものである。第１図において、７は供給ロ
ール、８は巻き取りロール、９はフイルム、１０
は支持体である。 FIG. 1 shows a block diagram of cutting a film in a method of laser processing a thin film body in a first embodiment of the present invention. In FIG. 1, 7 is a supply roll, 8 is a take-up roll, 9 is a film, and 10
is the support.
フイルム９は支持体１０は静電気で密着された
状態で供給ロール７に巻き取られている。フイル
ム９と支持体１０が密着した薄膜体５は加工部に
おいてレーザ・ビームにより走行方向に不連続に
ならないように加工される。 The film 9 and the support 10 are wound around the supply roll 7 in a state in which the film 9 is in close contact with the support 10 due to static electricity. The thin film body 5 in which the film 9 and the support 10 are in close contact with each other is processed by a laser beam in the processing section so as not to be discontinuous in the running direction.
第２図は第１図の加工部の拡大図を示すもので
ある。ここではフイルム９ならびに支持体１０と
も樹脂フイルムである。レーザ・ビーム２の種類
は樹脂フイルムを切断するには炭酸ガスレーザが
適当である。この場合、レーザ・ビーム２はフイ
ルム９と支持体１０の両方を切断する。フイルム
９と支持体１０は容易に分離することができ、そ
れぞれ巻き取りロール８に回収される。ここで支
持体１０は巻き取りロール８に回収されるとした
が、そのまま廃棄してもよい。また、ここでは支
持体１０の両面にフイルム９が密着された場合を
示したが、支持体１０の片面だけにフイルム９を
密着させても良いことは言うまでもない。 FIG. 2 shows an enlarged view of the processed portion of FIG. 1. Here, both the film 9 and the support 10 are resin films. As for the type of laser beam 2, a carbon dioxide laser is suitable for cutting the resin film. In this case, the laser beam 2 cuts both the film 9 and the support 10. The film 9 and the support 10 can be easily separated and each is collected on a winding roll 8. Although it is assumed here that the support body 10 is collected by the take-up roll 8, it may be disposed of as is. Moreover, although the case where the film 9 is closely attached to both sides of the support body 10 is shown here, it goes without saying that the film 9 may be closely attached to only one side of the support body 10.
以上のように本実施例によれば、支持体１０に
フイルム９を静電気で密着させた状態でレーザ・
ビーム２を照射し、加工後フイルム９を分離する
ことにより、フイルム９の厚さが非常に薄い場合
でもフイルム９の走行を容易にし、また加工精度
も向上させることができる。 As described above, according to this embodiment, the laser beam is applied while the film 9 is stuck to the support 10 with static electricity.
By irradiating the beam 2 and separating the film 9 after processing, the film 9 can be easily moved even when the film 9 is very thin, and processing accuracy can also be improved.
以下本発明の第２の実施例について図面を参照
しながら説明する。 A second embodiment of the present invention will be described below with reference to the drawings.
第２の実施例は薄膜体として蒸着フイルムを用
いた加工例である。構成図の説明は第１図と同様
なので省略する。 The second embodiment is a processing example using a vapor-deposited film as the thin film body. The explanation of the configuration diagram is omitted because it is the same as that in FIG.
第３図は蒸着フイルムの加工における加工部の
拡大図を示すものである。ここでは支持体１０と
ベース・フイルム１１は樹脂フイルムで、１２は
蒸着金属である。レーザ・ビーム２にはYAGレ
ーザを用いる。支持体１０とベース・フイルム１
１はYAGレーザを透過するので、蒸着金属１２
の除去だけが行なわれる。したがつて、第４図に
示されているように、蒸着金属１２が走行方向に
不連続となつてもベース・フイルム１１は連続な
ので、加工後、蒸着フイルムを支持体１０から分
離し回収することができる。しかも２枚の蒸着フ
イルムが同時に加工されるので、加工能率も向上
する。 FIG. 3 shows an enlarged view of a processing section during processing of a vapor deposited film. Here, the support 10 and the base film 11 are resin films, and 12 is a vapor-deposited metal. A YAG laser is used for laser beam 2. Support 10 and base film 1
1 transmits the YAG laser, so the vapor-deposited metal 12
Only the removal of is performed. Therefore, as shown in FIG. 4, even if the deposited metal 12 is discontinuous in the running direction, the base film 11 is continuous, so after processing, the deposited film is separated from the support 10 and collected. be able to. Moreover, since two vapor-deposited films are processed at the same time, processing efficiency is also improved.
発明の効果
以上のように本発明は、薄膜体を、それよりも
厚い支持体の少なくともどちらか一方の表面に分
離可能な方法で密着させ一体化した状態で加工部
に供給し、レーザ・ビームを照射して加工した
後、薄膜体を支持体から連続的に分離し回収する
ことによつて、薄膜体の厚さが2μｍ以下の非常
に薄い場合でも薄膜体の走行を容易にし、また加
工精度も向上させることができる。Effects of the Invention As described above, the present invention supplies a thin film body to a processing section in a state in which it is integrally attached to at least one surface of a thicker support body by a separable method, and After being irradiated and processed, the thin film body is continuously separated from the support and recovered, making it easy to run the thin film body even when the thin film body is very thin (less than 2 μm), and processing. Accuracy can also be improved.
第１図は本発明の第１の実施例における薄膜体
のレーザ加工方法のうちフイルムの切断の構成
図、第２図は第１図の加工部の拡大図、第３図は
本発明の第２の実施例における薄膜体のレーザ加
工方法のうち蒸着フイルムの加工における加工部
の拡大図、第４図は従来の薄膜体のレーザ加工方
法のうちフイルムの切断方法の構成図である。
１……レーザ発振器、４……集光レンズ、７…
…供給ロール、８……巻き取りロール、９……フ
イルム、１０……支持体、１１……ベース・フイ
ルム、１２……蒸着金属。
FIG. 1 is a block diagram of a film cutting process in the laser processing method for a thin film body according to the first embodiment of the present invention, FIG. 2 is an enlarged view of the processing section of FIG. 1, and FIG. FIG. 4 is an enlarged view of a processing section in processing a vapor deposited film in the laser processing method for a thin film body in the second embodiment, and FIG. 4 is a block diagram of a film cutting method in the conventional laser processing method for a thin film body. 1... Laser oscillator, 4... Condensing lens, 7...
... Supply roll, 8 ... Take-up roll, 9 ... Film, 10 ... Support, 11 ... Base film, 12 ... Vapor-deposited metal.
Claims (1)
なくともどちらか一方の表面に分離可能な方法で
密着させ一体化した状態で加工部に供給し、レー
ザ・ビームを照射して加工した後、薄膜体を支持
体から連続的に分離し回収することを特徴とする
薄膜体のレーザ加工方法。1. The thin film body is brought into close contact with at least one surface of a thicker film-like support by a separable method, and then supplied to the processing section in an integrated state, and processed by irradiation with a laser beam. , a method for laser processing a thin film body, characterized by continuously separating and recovering the thin film body from a support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60283455A JPS62142093A (en) | 1985-12-17 | 1985-12-17 | Laser beam processing method for thin film body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60283455A JPS62142093A (en) | 1985-12-17 | 1985-12-17 | Laser beam processing method for thin film body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62142093A JPS62142093A (en) | 1987-06-25 |
| JPH0328990B2 true JPH0328990B2 (en) | 1991-04-22 |
Family
ID=17665767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60283455A Granted JPS62142093A (en) | 1985-12-17 | 1985-12-17 | Laser beam processing method for thin film body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62142093A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2831280B2 (en) * | 1994-09-16 | 1998-12-02 | 株式会社富士電機総合研究所 | Laser processing equipment |
| JP2896090B2 (en) * | 1994-10-19 | 1999-05-31 | 株式会社富士電機総合研究所 | Laser processing equipment |
-
1985
- 1985-12-17 JP JP60283455A patent/JPS62142093A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62142093A (en) | 1987-06-25 |
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