JPH0328755U - - Google Patents
Info
- Publication number
- JPH0328755U JPH0328755U JP1989088725U JP8872589U JPH0328755U JP H0328755 U JPH0328755 U JP H0328755U JP 1989088725 U JP1989088725 U JP 1989088725U JP 8872589 U JP8872589 U JP 8872589U JP H0328755 U JPH0328755 U JP H0328755U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- lead frame
- mounting piece
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/5363—
-
- H10W72/5475—
-
- H10W90/756—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989088725U JPH0648875Y2 (ja) | 1989-07-27 | 1989-07-27 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989088725U JPH0648875Y2 (ja) | 1989-07-27 | 1989-07-27 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0328755U true JPH0328755U (esLanguage) | 1991-03-22 |
| JPH0648875Y2 JPH0648875Y2 (ja) | 1994-12-12 |
Family
ID=31638321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989088725U Expired - Fee Related JPH0648875Y2 (ja) | 1989-07-27 | 1989-07-27 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648875Y2 (esLanguage) |
-
1989
- 1989-07-27 JP JP1989088725U patent/JPH0648875Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648875Y2 (ja) | 1994-12-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |