JPH0328747U - - Google Patents
Info
- Publication number
- JPH0328747U JPH0328747U JP4235089U JP4235089U JPH0328747U JP H0328747 U JPH0328747 U JP H0328747U JP 4235089 U JP4235089 U JP 4235089U JP 4235089 U JP4235089 U JP 4235089U JP H0328747 U JPH0328747 U JP H0328747U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- external terminal
- view
- circuit board
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4235089U JPH0328747U (US07909887-20110322-C00021.png) | 1989-04-11 | 1989-04-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4235089U JPH0328747U (US07909887-20110322-C00021.png) | 1989-04-11 | 1989-04-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0328747U true JPH0328747U (US07909887-20110322-C00021.png) | 1991-03-22 |
Family
ID=31553820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4235089U Pending JPH0328747U (US07909887-20110322-C00021.png) | 1989-04-11 | 1989-04-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0328747U (US07909887-20110322-C00021.png) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06270452A (ja) * | 1993-03-19 | 1994-09-27 | Sharp Corp | シリアルプリンタ |
JP2001127419A (ja) * | 1999-10-26 | 2001-05-11 | Nec Saitama Ltd | 端子及びランドの位置決め方法 |
JP2012069727A (ja) * | 2010-09-24 | 2012-04-05 | Denso Corp | 半導体モジュール |
JP2018148050A (ja) * | 2017-03-06 | 2018-09-20 | 新電元工業株式会社 | 接合基板の製造方法、および接合基板 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6217176B2 (US07909887-20110322-C00021.png) * | 1978-05-19 | 1987-04-16 | Kenutsudo Kk |
-
1989
- 1989-04-11 JP JP4235089U patent/JPH0328747U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6217176B2 (US07909887-20110322-C00021.png) * | 1978-05-19 | 1987-04-16 | Kenutsudo Kk |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06270452A (ja) * | 1993-03-19 | 1994-09-27 | Sharp Corp | シリアルプリンタ |
JP2001127419A (ja) * | 1999-10-26 | 2001-05-11 | Nec Saitama Ltd | 端子及びランドの位置決め方法 |
JP2012069727A (ja) * | 2010-09-24 | 2012-04-05 | Denso Corp | 半導体モジュール |
JP2018148050A (ja) * | 2017-03-06 | 2018-09-20 | 新電元工業株式会社 | 接合基板の製造方法、および接合基板 |