JPH0328746U - - Google Patents
Info
- Publication number
- JPH0328746U JPH0328746U JP8931589U JP8931589U JPH0328746U JP H0328746 U JPH0328746 U JP H0328746U JP 8931589 U JP8931589 U JP 8931589U JP 8931589 U JP8931589 U JP 8931589U JP H0328746 U JPH0328746 U JP H0328746U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor pellet
- resin
- lead frame
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000008188 pellet Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8931589U JPH0328746U (US06168776-20010102-C00028.png) | 1989-07-28 | 1989-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8931589U JPH0328746U (US06168776-20010102-C00028.png) | 1989-07-28 | 1989-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328746U true JPH0328746U (US06168776-20010102-C00028.png) | 1991-03-22 |
Family
ID=31638898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8931589U Pending JPH0328746U (US06168776-20010102-C00028.png) | 1989-07-28 | 1989-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328746U (US06168776-20010102-C00028.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002291789A (ja) * | 2001-03-29 | 2002-10-08 | Impress:Kk | 人体部位当て具、保温具、保冷具及び炭化物を収容した袋 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60161647A (ja) * | 1984-02-02 | 1985-08-23 | Toshiba Corp | 半導体装置用リ−ドフレ−ム |
-
1989
- 1989-07-28 JP JP8931589U patent/JPH0328746U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60161647A (ja) * | 1984-02-02 | 1985-08-23 | Toshiba Corp | 半導体装置用リ−ドフレ−ム |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002291789A (ja) * | 2001-03-29 | 2002-10-08 | Impress:Kk | 人体部位当て具、保温具、保冷具及び炭化物を収容した袋 |
