JPH0328729U - - Google Patents
Info
- Publication number
- JPH0328729U JPH0328729U JP1989089719U JP8971989U JPH0328729U JP H0328729 U JPH0328729 U JP H0328729U JP 1989089719 U JP1989089719 U JP 1989089719U JP 8971989 U JP8971989 U JP 8971989U JP H0328729 U JPH0328729 U JP H0328729U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- semiconductor device
- protective film
- conductive layer
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/90—
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/075—
-
- H10W72/07504—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/536—
-
- H10W72/59—
-
- H10W72/931—
-
- H10W72/983—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989089719U JPH0328729U (enExample) | 1989-07-28 | 1989-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989089719U JPH0328729U (enExample) | 1989-07-28 | 1989-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328729U true JPH0328729U (enExample) | 1991-03-22 |
Family
ID=31639288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989089719U Pending JPH0328729U (enExample) | 1989-07-28 | 1989-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328729U (enExample) |
-
1989
- 1989-07-28 JP JP1989089719U patent/JPH0328729U/ja active Pending