JPH03285212A - Anisotropic conductive film and manufacture thereof - Google Patents

Abstract

PURPOSE:To prevent damage to the surface or substrate of LSI and also connection failure thereof by covering the surface of a prescribed region of a filmlike insulating member which has a hole passing through in the thickness direction with a resin layer. CONSTITUTION:Anisotropic conductive film 11 is equipped with an insulating member 12, a conductive member and a resin layer 14. The resin layer 14 continuously covers a part of the surface of the top of the insulating member 12 along the edge of the insulating portion 12 to cover the surface of the prescribed region of the insulating member 12. That is, the resin layer 14 which continuously covers a part of the top face of film member along the edge of film member by a dispensing process which applies paste-like resin or a printing process which forms a resin pattern by printing is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an anisotropic conductive film used for mounting LSIs and connecting circuit boards, and a method for manufacturing the same.

(Prior Art) Some conventional anisotropic conductive films are constructed by embedding a conductive member in a film-like insulating member made of an inorganic material. For example, it is known that the insulating member is made of ceramics and the conductive member made of Al is embedded in the insulating member at a fine pitch of about 60 μm in the film thickness direction. When mounting an LSI using an anisotropic conductive film, the anisotropic conductive film is placed between the LSI and the substrate, and the LSI is pressed against the substrate.
The electrodes of the SI and the substrate are connected to each other by a conductive member.

(Problems to be Solved by the Invention) However, in such a conventional anisotropic conductive film, since the insulating member is made of an inorganic material such as ceramics, connection failures may occur, and sr. There were problems such as scratches on the back surface substrate surface.

In other words, if the insulating member is made of an inorganic material such as ceramics, the insulating member will become brittle and break easily, resulting in LS
LSI
The anisotropic conductive film cracks during mounting, and the cracked insulating member moves when pressurized. As a result, conduction between the electrodes by the conductive member is no longer ensured, resulting in poor connection.

Further, the movement of the cracked insulating member described above damages the surface of the LSI and the surface of the substrate.

(Purpose of the Invention) Therefore, the present invention aims to prevent the movement of an insulating member using a resin layer, thereby preventing scratches on the surface of an LSI or the surface of a substrate, as well as preventing the occurrence of connection failures. The object of the present invention is to provide a directional conductive film and a method for manufacturing the same.

(Structure of the Invention) In order to achieve the above object, the anisotropic conductive film according to the present invention includes a film-like insulating member made of an insulating material and having holes penetrating in the thickness direction, and a film-like insulating member provided in the holes of the insulating member. The device is characterized in that it includes a conductive member having a protrusion projecting from the insulating member, and a resin layer covering the surface of a predetermined region of the insulating member.

Furthermore, in order to achieve the above object, the method for manufacturing an anisotropic conductive film according to the present invention includes a step of anodizing a conductive substrate to form a film-like insulating member having holes extending in the thickness direction. , a step of embedding a conductive material into the hole of the insulating member, a step of removing the surface layer on both sides of the insulating member to make the conductive material protrude from both sides of the insulating member, and forming a resin layer covering the surface of a predetermined area of the insulating member. The invention is characterized by including the steps of:

Hereinafter, the present invention will be specifically explained based on Examples.

1-14 are diagrams showing a first embodiment of an anisotropic conductive film according to the present invention.

First, the configuration will be explained.

In FIGS. 1 to 3, reference numeral 11 denotes an anisotropic conductive film, and the anisotropic conductive film 11 includes an insulating member 12, a conductive member 13, and a resin layer 14. The insulating member 12 is an insulating material, such as
That is, Alz formed by anodic oxidation of AI
The insulating member 12 is a film-like member made of Ox, and has a hole 12a penetrating in the thickness direction.

A conductive member 13 made of Au is provided in the hole 12a of the insulating member 12.
is provided, and the conductive member 13 has a protrusion 13a that protrudes from the insulating member 12. The resin layer 14 is the insulating member 12
It continuously covers a part of the upper surface of the insulating member 12 in FIG.

Next, a first example of the method for manufacturing the anisotropic conductive film according to the present invention will be described by explaining the method for manufacturing the anisotropic conductive film 11 according to FIGS. 4 to 14.

First, as shown in FIG. 4, one surface of the Al substrate 15 is masked with a photoresist 16 having a predetermined pattern.

For example, the photoresist 16 consists of a plurality of dot patterns each having a diameter of 20 μm arranged at a pitch of 50 μm. The upper layer of the six photoresist substrates 15 is immersed in, for example, an acidic solution and electrolyzed using the A1 substrate 15 as an anode to anodize the upper layer of the Al substrate 15. Through this anodization, the Al2O3 material 17 as shown in FIG.
And Al material 18 is formed. Next, as shown in FIG. 6, the photoresist 16 is removed. Then the seventh
As shown in the figure, the Aj2 material 18 is removed by melting or the like to form a through hole 17a in the Al2O3 material 17. That is, this step is a step of anodizing the conductive substrate to form a film-like insulating member having holes extending in the thickness direction.

Next, as shown in FIG. 8, the AU material 1 is inserted into the through hole 17a.
Embed 9. That is, this step is a step of embedding a conductive material into the hole of the insulating member.

Next, as shown in FIG. 9, the surface layer of the AlzO material 17 is dissolved and removed to form a membrane member 20.

That is, this step is a step of removing the surface layers on both sides of the insulating member and causing the conductive material to protrude from both sides of the insulating member.

Next, a resin layer is formed to continuously cover a part of the upper surface of the membrane member 20 in FIG. 9 along the edge of the membrane member 20 by a dispensing method in which a paste-like resin is applied or a printing method in which a resin pattern is formed by printing. Once formed, the anisotropic conductive film 11 shown in FIGS. 1 to 3 is formed. That is, this step is a step of forming a resin layer covering the surface of a predetermined region of the insulating member.

Note that instead of the steps shown in FIGS. 4 to 9, steps 10 to 1
The membrane member 20 may be formed using the steps shown in FIG.

That is, first, A! shown in FIG. ! The surface layer of the substrate 1 is soaked in a 10-20% sulfuric acid solution at 0-20°C for 5-60 minutes.
Anodize. However, the temperature fluctuation range shall be within 5°C and the current density shall be 1 to 3 A/dm. Through this anodization, a surface layer portion 2 made of Al2O2 and a main body portion 3 made of AI! are formed as shown in Fig. 11. The surface layer 2 is a so-called anodic oxide film and has a plurality of minute holes 2a.The thickness of the surface layer 2 is 1 to 100 μm, and the diameter of the holes 2a is 0.
．． The hole pitch is 0.6 μm or less.

Next, as shown in FIG. 12, an Au material 4 is formed in the hole 2a of the surface layer 2 by, for example, electrolytic deposition.

Next, as shown in FIG. 13, from the surface layer 2 to the main body 3
When the surface layer on both sides of the surface layer portion 20 is removed, the first
The membrane member shown in FIG. 4 is molded. When this process is used, the diameter, pitch, etc. of the holes in the insulating member are smaller than those using the above-mentioned process.

15 to 17 are diagrams showing a second embodiment of the anisotropic conductive film according to the present invention. In addition, in FIGS. 15 to 17, the same components as those of the anisotropic conductive film according to the present invention shown in FIGS. The same shall apply.

In Figure 15.16, the second layer is an anisotropic conductive film,
The resin layer 24 of the anisotropic conductive film 21 continuously covers the circumferential surface of the insulating member 12, that is, the resin layer 24 covers the surface of a predetermined region of the insulating member 12.

Next, a second example of the method for manufacturing the anisotropic conductive film according to the present invention will be explained by explaining the method for manufacturing the anisotropic conductive film 21.

First, the membrane member 20 is formed by the same steps as those shown in FIGS. 4 to 9 or 10 to 14 described above.

Next, as shown in FIG. 17, the four circumferential surfaces of the film member 20 are successively brought into contact with the molten resin 22 and pulled up, thereby forming the anisotropic conductive film 21. That is, this step is a step of forming a resin layer covering the surface of a predetermined region of the insulating member.

FIG. 18 is a diagram showing a third embodiment of an anisotropic conductive film according to the present invention.

In FIG. 18, 31 is an anisotropic conductive film, and the resin layer 34 of the anisotropic conductive film 31 continuously covers either the upper or lower surface of the insulating member 12, that is, the resin layer 34 covers the surface of a predetermined area of the insulating member 12.

Next, a third example of the method for manufacturing an anisotropic conductive film according to the present invention will be described by explaining a method for manufacturing the anisotropic conductive film 31.

First, the membrane member 20 is formed by the same steps as those shown in FIGS. 4 to 9 or 10 to 14 described above.

Next, by forming a resin layer covering either the entire upper or lower surface of the membrane member 20 by a spray method, a spin cord method, or an LB peritoneal method, an anisotropic conductive film 31 is formed. That is, this step is a step of forming a resin layer covering the surface of a predetermined region of the insulating member.

FIG. 19 is a diagram showing a fourth embodiment of an anisotropic conductive film according to the present invention.

In FIG. 19, 41 is an anisotropic conductive film, and the resin layer 44 of the anisotropic conductive film 41 continuously covers the upper and lower surfaces and all four circumferential surfaces of the insulating member 12. Layer 44 covers a predetermined area of the surface of insulating member 12 .

Next, a fourth example of the method for manufacturing the anisotropic conductive film according to the present invention will be explained by explaining the method for manufacturing the anisotropic conductive film 41.

First, the membrane member 20 is formed by the same steps as those shown in FIGS. 4 to 9 or 10 to 14 described above.

Next, by forming a resin layer covering the entire upper and lower surfaces and all four circumferential surfaces of the membrane member 20 by a derubbing method, the anisotropic conductive film 41 is formed. That is, this step is a step of forming a resin layer covering the surface of a predetermined region of the insulating member.

FIG. 20 is a diagram showing a fifth embodiment of an anisotropic conductive film according to the present invention.

In FIG. 20, 51 is an anisotropic conductive film, and the resin layer 54 of the anisotropic conductive film 51 partially covers either the upper or lower surface of the insulating member 12 in a spotted manner, i.e. , the resin layer 54 covers the surface of a predetermined region of the insulating member 12.

Next, a fifth example of the method for manufacturing an anisotropic conductive film according to the present invention will be explained by explaining a method for manufacturing the anisotropic conductive film 51.

First, the membrane member 20 is formed by the same steps as those shown in FIGS. 4 to 9 or 10 to 14 described above.

Next, a resin layer is formed by a spraying method to partially cover either the upper or lower surface of the membrane member 20 in a dotted manner, thereby forming the anisotropic conductive film 51.

That is, this step is a step of forming a resin layer covering the surface of a predetermined region of the insulating member.

FIG. 21 is a diagram showing a sixth embodiment of an anisotropic conductive film according to the present invention.

In FIG. 21, 61 is an anisotropic conductive film, and the resin layer 64 of the anisotropic conductive film 61 partially covers either the upper or lower surface of the insulating member 12 in a lattice pattern, i.e. , the resin layer 64 covers the surface of a predetermined area of the insulating member 12.

Next, a sixth example of the method for manufacturing an anisotropic conductive film according to the present invention will be described by explaining a method for manufacturing the anisotropic conductive film 61.

First, the membrane member 20 is formed by the same steps as those shown in FIGS. 4 to 9 or 10 to 14 described above.

Next, the membrane member 20 is formed by a screen printing method or a transfer method.
The anisotropic conductive film 61 is formed by forming a resin layer that partially covers one of the upper and lower surfaces in a lattice pattern. That is, this step is a step of forming a resin layer covering the surface of a predetermined region of the insulating member.

In addition, in the first to sixth embodiments, the resin layer 14.2434
．． When the adhesives 54 and 64 are used, for example, as an adhesive when mounting an LSI on a board, it is preferable to use, for example, a thermoplastic resin material as the material for the resin layer 14 and the like.

In addition, when an adhesive is not used, for example, polyimide may be used as the material for the resin layer 14 and the like. Furthermore, when using polyimide, after forming the resin layer 14 etc., the resin layer 1
4 and the like by etching to remove the conductive member 13.
A step of making the resin layer 14 and the like protrude from the resin layer 14 and the like is required.

As described above, in the first to sixth embodiments, the surface of the predetermined area of the insulating member 13 etc. is covered with the resin layer 14 etc.
Even if the insulating members 12, etc. are cracked due to board warping or the like during LSI mounting, the cracked insulating members 12, etc. can be connected to each other by the resin layer 14, etc. when pressing the LSI onto the board, and the cracks will not occur. It is possible to prevent the insulating member 12 and the like from moving. Therefore, it is possible to prevent the surface of the LSI and the surface of the substrate from being scratched, and also to prevent the occurrence of connection failures.

Furthermore, if the insulating member 12 or the like is cracked after the LSI is mounted, the stress generated due to the difference in the coefficient of thermal expansion of the LSI, the substrate, the insulating member 12, etc. can be absorbed or alleviated, so this embodiment will not cause problems. The reliability of the connection can be improved without causing any problems.

(Effects) According to the present invention, since the surface of the predetermined area of the insulating member is covered with the resin layer, even if the insulating member is cracked, the resin layer can prevent the insulating member from moving, and the LSI
In addition to preventing scratches on the surface of the board and the surface of the board,
It is possible to prevent connection failures from occurring.

[Brief explanation of drawings]

1-14 are diagrams showing a first embodiment of the anisotropic conductive film according to the present invention, in which FIG. 1 is a plan view thereof, FIG. 2 is a cross-sectional view thereof, and FIG. 3 is an enlarged view of the main part thereof. 4 to 14 are sectional views for explaining the manufacturing method thereof, and 15 to 17 are views showing a second embodiment of the anisotropic conductive film according to the present invention. Its plan view, Fig. 16 is its cross-sectional view,
FIG. 7 is a diagram for explaining the manufacturing method, FIG. 18 is a cross-sectional view showing a third embodiment of the anisotropic conductive film according to the present invention, and FIG. 19 is a diagram showing the anisotropic conductive film according to the present invention. 20 is a sectional view showing the fifth embodiment of the anisotropic conductive film according to the present invention, and FIG. 21 is a sectional view showing the sixth embodiment of the anisotropic conductive film according to the present invention. FIG. 11.21.31.41.51.61 - Anisotropic conductive film, 12 Insulating member, 13 Conductive member, 14.24.34.44 .54.64...-Resin layer, 1.15...AJ substrate (conductive substrate), 4.
19...Au material (conductive material).

Claims (2)

[Claims] (1) A film-like insulating member made of an insulating material and having a hole penetrating in the thickness direction, a conductive member provided in the hole of the insulating member and having a protrusion projecting from the insulating member, and a predetermined portion of the insulating member. An anisotropic conductive film comprising: a resin layer covering the surface of the region. (2) A process of anodizing the conductive substrate to form a film-like insulating member having holes extending in the thickness direction, a process of embedding a conductive material in the holes of the insulating member, and a process of forming a surface layer on both sides of the insulating member. A method for producing an anisotropic conductive film, comprising the steps of: removing the conductive material to protrude from both sides of the insulating member; and forming a resin layer covering the surface of a predetermined region of the insulating member. .