JPH03285068A - Sputtering system - Google Patents

Abstract

PURPOSE:To remarkably improve productivity by making a lid vertically movable with respect to the supply port of a vacuum vessel and freely switching the closing surfaces opposed to the supply port to each other by rotation. CONSTITUTION:A supply port 2 for charging and discharging a member to be sputtered and a sputtering part 3 are provided to a vacuum vessel 1. The supply port 2 is closed by any of the plural closing surfaces 4a and 4b of a lid 4. A member to be sputtered is transferred between the supply port 2 and the sputtering part 3 by using the rotating arm 17 of a transfer means. The lid 4 is made vertically movable with respect to the supply port 2, and the closing surfaces 4a and 4b opposed to the supply port 2 are freely switched to each other by rotating the lid 4. As a result, the member is instantaneously charged into or discharged from the vacuum vessel.

Description

[Detailed Description of the Invention] ∆, Industrial Application Field The present invention is applicable to, for example, manufacturing optical discs, etc.
The present invention relates to a sputtering apparatus that continuously performs sputtering processing on an optical disk substrate.

B1 Summary of the Invention The present invention uses a lid body having a plurality of closed surfaces provided with holding means for holding a member to be sputtered in a sputtering apparatus used, for example, in manufacturing optical discs. The object to be sputtered can be taken in and out of the vacuum chamber instantaneously by rotating and sequentially switching the closing surface for the supply port through which the object to be sputtered is taken in and taken out.

C1 Prior Art Conventionally, optical discs have been proposed that are configured to record and reproduce predetermined information signals such as audio signals and image signals. An optical disk is constructed by depositing a metal material such as aluminum as a reflective film on a disk substrate made of a material such as polycarbonate or acrylic, on which pits, groups, etc. are formed.

By the way, examples of methods for depositing the metal material on the disk substrate include a vapor deposition method, an ion blasting method, a sputtering method, and the like.

The vapor deposition method and the ion blating method heat a metal material (y-source) in a vacuum chamber to evaporate the metal, and then place the disk substrate in the metal vapor to coat the metal material on the substrate. It is something to wear. When attempting to mass-produce optical disks using these methods, a large vacuum chamber capable of accommodating a plurality of disk substrates is used to manufacture a plurality of optical disks by evaporating the metal material at once. We have no choice but to switch to the so-called batch method. For this reason, not only the device configuration becomes complicated and large, but also unevenness occurs depending on the location within the vacuum chamber.

On the other hand, the sputtering method has the advantage that the processing can be completed in a short time, continuous processing is possible, and films can be formed on each disk substrate under the same conditions. Therefore, if this method is adopted, it is possible to obtain a uniform film without unevenness, and it is also possible to cope with mass production, multi-product production, etc.

The above sputtering process involves filling a vacuum chamber containing a disk substrate and a metal material (target) such as aluminum with a discharge gas such as argon at low pressure, and applying an electric field to the vacuum chamber. In this method, the discharge gas is ionized, and the ionized discharge gas is used to knock out atoms and molecules of the metal material. That is, in the vacuum chamber, the discharge gas is ionized and collides with the metal material to scatter the metal material, and the metal material is adhered to the disk substrate to form a thin film.

For example, as shown in FIG. 12, a sputtering device that performs this sputtering process rotates a disk-shaped conveying table on which a plurality of disk substrates are arranged in the circumferential direction, so that these disk substrates can be A device configured to perform sputtering processing continuously has been proposed.

This sputtering apparatus is configured so that the interior thereof is maintained at a predetermined degree of vacuum, and includes a vacuum chamber 103 in which a disk exit 101 for loading and unloading the disk substrate Da and a sputtering processing section 102 for performing sputtering processing are formed. have. A cover 104 for maintaining the degree of vacuum within the vacuum chamber 103 is supported and provided at the disk exit 101 so as to be operated in contact with the vacuum chamber 103.

On the other hand, the sputtering processing section 102 has a disk processing port 105 formed similarly to the disk exit 101, and is a cylindrical processing section attached to the vacuum chamber 103 so as to cover the upper part of the disk processing port 105. 106. This processing unit 106 includes
A metal material (target) +07 for performing spackling on the disk substrate Da is accommodated, and argon gas or the like is sealed in a low pressure state.

A disk-shaped transport table 10B is disposed within the vacuum chamber 103 to sequentially transport a plurality of disk substrates Da from the disk exit 101 to the sputtering processing section 102.

This conveyance table 108 is supported by a rotation shaft 108a provided protruding into the vacuum chamber 103, and is configured to be rotated in a direction around the axis by a drive means (not shown). Further, this conveyance chiffle 108 has a circular positioning recess 108 on which the disk substrate Da is placed.
b is formed, and a receiving tray 109 that positions the disk substrate Da by fixing the center hole of the disk substrate DaO in the recess 108b is fitted and placed in the recess 108b. This saucer +
09 is a projection 1 which is formed into a disc shape with a slightly larger diameter than the external dimensions of the disc substrate Da, and through which the center hole for chaffing of the disc board Da is inserted approximately at the center thereof.
09a is provided protrudingly, and a push-up shaft 110, 111 for pushing up the saucer 109 is provided approximately at the center of the positioning recess 108b of the transfer table 10B.
An insertion hole 108c is formed through which it is inserted.

The push-up shafts 110 and 111 face the inside of the vacuum chamber 103 through holes bored in the bottom of the vacuum chamber 103 facing the disk exit 101 and the sputtering processing section 102, respectively, and are driven by a drive (not shown). The device is configured to move forward and backward in the vertical direction. That is, when the disk substrate Da conveyed by the conveyance table 108 comes to a position facing the disk exit 101 and the sputtering processing section 102, the respective push-up shafts 110, 111 protrude and push up the receiving trays 109, 109. The vacuum chamber 103 is supported by pressure on the opening periphery of the disk exit 101 and the disk processing port 105.
and the outside (atmosphere). Then, when the disk substrate Da is taken out on the disk exit 101 side and the sputtering process is completed in the sputtering processing section 102, each push-up shaft 110. ill is vacuum chamber 1
It is designed to be immersed in the bottom of 03.

In the sputtering apparatus configured in this way,
A plurality of disk substrates Da supplied from the disk outlet lot are sequentially conveyed to the sputtering processing section 102 by rotating the conveyance table 108, and are continuously subjected to sputtering treatment there. Then, the sputtered disk substrate Da is taken out and a new disk substrate Db is supplied to the transport table 10B.

D. Problems to be Solved by the Invention By the way, the sputtering-treated disk substrate Da
Transfer table 1 for taking out the disk substrate Db and transporting the new disk substrate Db
The supply to 0B is performed by a mechanism for counting the number of members to be sputtered, which moves the lid 104 toward and away from the vacuum chamber 103.

As shown in FIG. 12, this take-out mechanism consists of a rotary arm 11 which is bent at a substantially right angle so that both ends hang down.
2, a drive having a rotating shaft 113 that supports a substantially central portion of the rotating arm 112, rotates the rotating arm 112 in the horizontal direction, and moves the lid 104 up and down with respect to the disk exit 101; a pair of lids 10 attached to both ends of the rotating arm 112;
4.104 is operated toward and away from the disk exit 101, and at the same time, it is operated to rotate in the horizontal direction about the rotating shaft 113.

The taking-out mechanism takes out the sputtered disk substrate Da and supplies the new disk substrate Db to the transport table 10B in the following manner. First, the saucer 10 blocking the disc person exit 101
The sputtered disk substrate Da placed on the suction pad 10 provided on one lid 104
4a, and the rotating shaft 113 is raised to take out the disk substrate from the vacuum chamber 103.Next, the rotating shaft 113 is rotated in the direction around the axis, and the rotating arm 11
2 is rotated 180 degrees, and the new disk substrate Db, which is sucked to the suction pad 104a of the other lid 1O4, is positioned above the disk exit 101. Then, by lowering the rotating shaft 113, the disk substrate Db is placed in the saucer 10.
Place it on top of 9.

However, in the above-mentioned mechanism, it is necessary to rotate the rotating arm 112 by 180 degrees in the horizontal direction in order to exchange the disk substrate Da after processing with the disk substrate Db before processing, so this rotation operation takes a considerable amount of time. It takes time. For example, with this mechanism, the disk substrate Da after sputtering treatment can be
The time required from taking out the disk substrate Db to setting the new disk substrate Db on the tray 109 is about 1.5 seconds. In addition, since a large rotational torque is required to rotate the lid body 104, the drive unit Wl14 must be made large, which makes the device expensive and creates problems in terms of installation space. arise.

SUMMARY OF THE INVENTION The present invention was developed in view of the above-mentioned conventional circumstances, and an object of the present invention is to provide a sputtering apparatus that can instantly take a member to be sputtered into and out of a vacuum chamber. The purpose is to provide a small and inexpensive sputtering device.

E9 Means for Solving Problems In order to achieve the above-mentioned object, a sputtering apparatus according to the present invention includes a supply port through which a member to be sputtered is taken in and taken out, and a sputtering processing section that performs sputtering on the member to be sputtered. and a lid having a plurality of closing surfaces provided with holding means for holding the member to be sputtered, and closing the supply port with any one of these closing surfaces. and a transfer means for transferring the member to be sputtered between the supply port and the sputtering processing section, and the lid body is vertically movable with respect to the supply port, and It is characterized in that the closing surface facing the supply port can be switched freely by rotating the lid.

F1 action In the sputtering apparatus of the present invention, when sputtering is completed, the sputtered member to be sputtered is held by the holding means provided on the closing surface of the lid that closes the supply port. On the other hand, a new member to be sputtered is supplied to the other closed surface of the lid (closed surface exposed to the outside of the vacuum chamber) while the member to be sputtered is being sputtered, It is held by a holding means provided on the closed surface.

In this state, when the lid is raised above the supply port and the lid is rotated to reverse the closing surface, the supply port of the vacuum chamber is closed, and the supply port is directed toward the inside of the vacuum chamber. The closed surface, which had been closed, is exposed to the outside, and the member to be sputtered after sputtering, which is held on the closed surface, is taken out from the vacuum chamber. Then, when the lid is lowered into the supply port, the closing surface holding the new member to be sputtered closes the supply port, and the new member to be sputtered is supplied into the vacuum chamber. Ru.

G. Examples Hereinafter, specific examples to which the present invention is applied will be described with reference to the drawings. In this embodiment, the sputtering apparatus according to the present invention is used to manufacture an optical disk by sputtering a thin film made of a metal material such as aluminum onto a disk substrate made of a synthetic resin such as polycarbonate or acrylic. This is an example applied to a device.

The optical disc manufacturing chamber of this embodiment houses a vacuum chamber in a rectangular cylinder (not shown) and an exhaust system equipped with a vacuum pump and the like provided under the vacuum chamber. It has become.

As shown in FIGS. 1 and 2, the vacuum chamber l is configured such that the inside thereof is maintained at a predetermined degree of vacuum by a vacuum pump, and is connected to the vacuum pump approximately at the center thereof. It has a duct la.

This vacuum chamber 1 has a disk outlet 2 on the upper surface through which a disk substrate, which is a member to be sputtered, is taken in and taken out.
and a sputtering processing section 3 that performs sputtering processing on the disk substrate are arranged in parallel.

- The disk outlet 2 described in ``1'' is formed as a supply for taking disk substrates after sputtering processing and disk substrates before sputtering treatment into and out of the vacuum chamber]. Corresponding to the shape, it is formed into a substantially circular shape with a slightly larger diameter than the outer dimensions of the disk substrate. A lid 4 is provided on the 1-blade side of the disc exit 2 to allow the disc exit 2 to be opened and closed.

1. The lid body 4 is formed in a size capable of closing the disc exit 2, and has closing surfaces 4a and 4b on both sides thereof for closing the disc exit 2. These closing surfaces 4a and 4b are circular surfaces sufficient to close the disk exit 2, and the outer peripheral edge of the closing surface 4a or 4b comes into contact with the opening periphery of the disc exit 2. By doing so, the disc exit 2 is closed. Furthermore, near the outer periphery of each closing surface 4a, 4b of the lid 4, there is an O-ring or the like for abutting against the opening periphery of the disk exit 2 to maintain an airtight state within the vacuum Nl. A sealing member 5.6 is provided.

Furthermore, approximately at the center of the closed surfaces 4a and 4b of the lid 4,
Circular stepped surfaces 7 and 8 are formed in a size that allows them to face the inside of the disk exit 2, and holding means consisting of suction pads 7a and 8a for vacuum suctioning the disk substrate are provided thereon.

Note that these step surfaces 7.8 are similar to the suction pads 7a, 8.
This is provided in order to make the distance between a and a receiving tray 18 (described later) small, and to ensure that the disk substrate on this receiving tray 18 is vacuum-suctioned by the suction pads 7a and 8a.

The lid body 4 constructed in this way is attached to a rotating shaft 10 of a drive unit 9 consisting of a motor or the like, and is adapted to be turned upside down in the direction shown by arrow A in FIG. That is, in the lid 4, the rotation shaft 10 is inserted through an insertion hole (not shown) that is provided in the approximate center of the thickness of the lid 4 in the diametrical direction, By fixing it with a bolt, it rotates together with the rotation axis lO. Therefore, the lid body 4 has each closing surface 4a provided on both sides thereof by the operation of the driving section 9;
4b is rotated every 180 degrees and turned over.

Further, the lid body 4 is supported so as to be vertically movable with respect to the disk exit 2.

That is, the lid 4 connects the vicinity of the drive section 9 of the rotary shaft 10 to the tip of the support shaft 11 of a drive section (not shown) such as an air cylinder that protrudes upward from the lower part of the vacuum chamber l. By being attached via a connecting member 12 that is attached over the cover, it is possible to move up and down in the direction of arrow B in the figure. The driving section is provided below the vacuum chamber 1, and its support shaft 11 faces a through hole extending through the vacuum chamber 1 in the thickness direction, which is provided near the disk exit 2. Therefore, it is possible to reduce the size of the device.

Note that, in order to facilitate the sliding of the support shaft 11, a hair ring 13 or the like is press-fitted into the through hole through which the support shaft 11 is inserted.

The lid body 4 supported as described above is moved to the side of the vacuum chamber l and press-supports the opening periphery of the disc exit 2, thereby closing the disc exit 2 with one closing surface 4a. At the same time, the disk substrate after the sputtering process placed on the tray 18 is sucked by the suction pad 7a. Then, the processed disk substrate is separated from the vacuum chamber 1 and taken out of the vacuum chamber 1, and the disk exit 2 is opened. At this time, while the lid body 4 is being raised, the lid body 4 is reversed, and the disk substrate before the sputtering process, which is attracted to the other closed surface 4b side, is provided facing the disk exit 2.

On the other hand, the sputtering processing section 3 has a disk processing port 14 formed in the same manner as the disk exit 2, and is attached to the vacuum chamber l so as to cover the upper side of the disk processing port 14, and is installed inside the vacuum chamber l. Processing section 15 that keeps the airtight state
It has become.

The processing section 15 is formed into a cylindrical shape with a closed upper end, and a metal material (target) 16 used for the sputtering process and a discharge gas such as argon necessary for the sputtering process are sealed in a low-pressure state. At the same time, a predetermined electric field is applied.

A disk substrate is placed inside the vacuum chamber 1 at the disk exit 2.
A rotary arm 17 is provided, which constitutes a transfer means for carrying out a transfer operation between the sputtering processing section 3 and the sputtering processing section 3. The rotary arm 17 has a disk shape only at its free end, on which the disk substrate is placed, and is tapered at its base end.

The rotating arm 17 is bolted to the distal end of a rotating wheel 18 whose base end protrudes into the vacuum chamber 1, and is driven by a drive device (not shown) as indicated by the arrows in FIG. For example, this rotating arm 17 is rotatable in the direction around the axis shown in FIG.
The disk is rotated at an angle of about 0 degrees, and the above-mentioned disk exit 2
The transfer operation is performed between a position below the sputtering processing section 3 and a position below the sputtering processing section 3. Note that the bottom 6 of the vacuum chamber 1 allows the rotation shaft 18 to face the interior of the vacuum chamber 1.
An O-ring for maintaining an airtight state within the vacuum chamber 1 is provided in a through hole (not shown) formed in the surface portion.

Further, a circular positioning recess 17a for placing a disk substrate is formed on the top surface of the free end side of the rotary arm 17, and the recess 17a
A push-up shaft insertion hole 17b into which a push-up shaft 19, 20 (to be described later) is inserted is bored in the center. This recess 1
A receiving tray 18 on which a disk substrate is placed is fitted and placed on 7a. The saucer 18 is formed as a disk with a slightly larger diameter than the outer dimensions of the disk substrate,
A protrusion 18a protrudes from the center of the protrusion 18a for positioning the disk substrate by inserting it into the center hole for ticking of the disk substrate.

Therefore, the disk substrate is fitted into the positioning recess 17a while being fixed to the receiving tray 18, and is positioned and placed on the rotating arm 17. Furthermore, a peripheral edge of the saucer 18 is provided so that the inside of the vacuum chamber 1 is kept airtight when the peripheral edge of the saucer 18 is pressed against the opening edge of the disc exit 2 from below. , a sealing member 18b such as an O-ring is attached.

The bottom surface of the vacuum chamber I is moved up and down in the direction shown by arrow C in FIG. A push-up shaft 19,20 which can be moved freely is provided. These push-up shafts 12 and 13 are connected to the vacuum chamber l through through holes (not shown) formed in the bottom of the vacuum chamber l, which are opposite to the disk outlet 2 and the disk processing port 14, respectively. It is present within.

Note that these openings are provided with a sealing member (not shown) such as an O-ring for maintaining an airtight state within the vacuum chamber l.

) is provided. In addition, these push-up shafts 19.2
Disc-shaped push-up members 19a and 20a are provided at the tip of the rotating arm 17 to push up the saucer 18 in a stable state through a push-up shaft insertion hole 17b formed in the rotation arm 17.
is installed.

These push-up shafts 19 and 20 are such that the distal end side of the rotating arm 17 is located at the disk outlet 2 and the disk processing opening 1, respectively.
It is designed to be operated to protrude when it is in a position facing 4. That is, at the disk exit 2 and the disk processing port 14, the saucer 18 placed on the rotating arm 17 is inserted into the push-up shaft 19.20 through the push-up shaft insertion hole 17b provided in the pivot arm 17. It is lifted up and supported in pressure contact with the opening periphery of the disk exit 2 and the disk processing port 14 . At this time, since a sealing member 18b such as an O-ring is provided on the peripheral edge of the saucer 18, the sealing between the vacuum chamber 1 and the outside is ensured.

In the optical disk manufacturing apparatus configured in this way,
A lid body 4 provided with a suction pad 7a8a for holding the disk substrate allows the disk substrate to be taken in and out of the vacuum chamber 1.
The lid body 4 is made vertically movable with respect to the disk exit 2, and each closing surface 4a, 4 provided on both sides of the lid body 4
Since b is performed by a mechanism that turns the front and back sides,
The disk substrate after sputtering treatment and the disk substrate before sputtering treatment can be exchanged instantly. Further, in particular, the apparatus of this embodiment is configured such that the transfer operation of the disk substrate between the disk outlet 2 and the sputtering processing section 3 is performed by one rotating arm 17 with a small swing angle. Therefore, the vacuum chamber 1 can be downsized, and the volume inside the vacuum chamber 1 can be made extremely small. Therefore, the vacuum pump that performs evacuation can be downsized, and the evacuation time can also be shortened.

An optical disc is manufactured using the above-mentioned optical disc manufacturing apparatus in the following manner.

First, as shown in FIG. 3, the push-up shaft 2o provided corresponding to the disk person exit 2 is projected in the direction toward the disk person exit 2 as indicated by the arrow in the figure, and is placed on the rotating arm 17. u. Move the placed tray 18 upward to press and support the peripheral edge of the tray 18 against the opening peripheral edge of the disk exit 2.

Then, the disk exit 2 is closed by the saucer 18. Further, at this time, since a sealing member 18b is provided at the peripheral edge of the saucer 18, the vacuum chamber 18
The inside and outside are sealed to prevent atmospheric air from entering the vacuum chamber 1.

Then, the support shaft 11 for vertically moving the lid 4 is projected in the direction shown by the arrow E in the figure to separate the lid 4 from the vacuum chamber l, and the upper surface of the saucer 18 is moved to the disk exit 2.
It faces upward through the window.

Next, each suction pad provided on both sides of the lid 4?
a, 8a shows the disk substrate before sputtering treatment,
D, respectively, are adsorbed.

A vacuum chamber 1 with the support shaft 11 indicated by an arrow F in FIG.
The lid 4 is lowered toward the disc exit 2, and the disc exit 2 is closed with one closing surface 4a provided on the lid 4.

As a result, the inside and outside of the vacuum chamber I are sealed.

In the drawing, the seal is exaggerated only by the sealing member 5 provided on the lid 4, but in reality, the closing surface 4a and the opening periphery of the disk exit 2 are exaggerated. and are in close contact.

In this state, one closed surface 4 of the lid 4
The disk board is attracted to the a side.

is placed on the saucer 18.

At this time, the disk substrate is positioned by a protrusion 18a provided approximately at the center of the saucer 18.

Next, as shown in FIG. 5, the vacuum pump is operated with the disk outlet 2 closed with the lid 4 to restore the degree of vacuum lost by the opening/closing operation of the disk outlet 2. At the same time, as shown by arrow G in the figure, the push-up shaft 20 is inserted into the side where the vacuum pump or the like is provided to move the saucer 18 downward, and the saucer 18 is moved into the recess 17a of the rotating arm 17. Place it on.

At this time, in the vacuum chamber 1 of this example, the rotating arm 17
Since there is only one pipe, there is no obstacle during evacuation, and a predetermined degree of vacuum can be achieved instantaneously.For example, the time required for evacuation is less than one second.

Once the saucer 18 is placed on the tip side of the rotating arm 17, move the rotating arm 17 as indicated by the arrow in FIG. The disk substrate D1 placed on the receiving tray 18 is positioned below the disk processing port 14 as shown in FIG.

Once the saucer 18 is positioned, as shown in FIG.
is projected toward the disk processing port 14 side as indicated by arrow H in the figure, and the peripheral edge of the tray 18 is supported in pressure contact with the opening peripheral portion of the disk processing port 14.

As a result, the disk processing port 14 is closed by the saucer 18. In this state, sputtering processing for the disk substrate is started.

When the sputtering process is completed, as shown in FIG. 8, the push-up shaft 19 is recessed into the side where a vacuum pump or the like is provided, as shown by the arrow 1 in the figure, and the disk substrate D1 is placed. The saucer 18 thus prepared is placed on the rotating arm 17.

Once the disk substrate D1 is placed on the rotating arm 17, the rotating arm 17 is rotated in the direction of the disk exit 2 indicated by the arrow L1 in FIG. 2, as shown in FIG.
A saucer 18 on which a disk substrate on which a thin film made of aluminum is formed is placed below the disk outlet 2.

Once the saucer 18 is positioned at a predetermined position, as shown in FIG. 10, the push-up shaft 20 is made to protrude toward the disk exit 2 as shown by the arrow j in the figure, and the saucer 18 is moved. The tray 18 is moved upward to close the disk outlet 2.

Then, the disk substrate subjected to the sputtering process is sucked by the suction pad 7a provided on the lid body 4 that was blocking the disk exit 2.

Next, the support shaft 11 that supports the lid 4 in a vertically movable manner is made to protrude as shown by the arrow in FIG. 11 to move the lid 4 into the vacuum chamber! While moving the support shaft 11 further apart, the cover body 4 is turned over as shown by the arrow in the figure, and the closed surface 4 facing the disc exit 2 is turned over as shown by the arrow in the figure.
Switch b. That is, the disk substrate D1 before the sputtering process is made to face the disk exit 2, and the disk substrate D1 after the sputtering process is turned over to the opposite side.

Next, as described above, the support shaft 11 is inserted into the vacuum chamber l side as shown in FIG. 4, and the disk exit 2 is closed with the lid 4. Then, the new disk substrate D2
Light sputtering is performed in sequence through the steps described above.

At this time, while the new disk substrate Fi o t is being sputtered, the sputtered disk substrate D1 adsorbed on the closed surface 4a on the opposite side to the disk exit 2 is taken out, and the next new disk is sputtered. The substrate is attracted to the suction pad 7a provided on the closed surface 4a. This operation can be performed during the sputtering process, so there is plenty of time. therefore,
This is very advantageous in automating the sputtering process.

As described above, if optical disks are manufactured using the optical disk manufacturing apparatus of this embodiment, the disk substrates after sputtering treatment and the disk substrates before sputtering treatment can be instantly taken in and out of the vacuum chamber 1, and a large amount of work can be achieved. It is expected that productivity will improve. For example, it takes about 6 seconds to manufacture an optical disc using this apparatus, but it takes only 0.5 seconds to take the disc substrate into and out of the vacuum chamber l. Therefore, it is possible to expect a significant reduction in time, and the remaining 5.5 seconds can be used to perform other processing with sufficient margin.

As described above, in the optical disk manufacturing apparatus to which the present invention is applied, the lid body 4 that holds the member to be sputtered is a dihedral body having two closed surfaces 4a and 4b. It is also possible to form a face, a tetrahedron, a pentahedron, or a higher polyhedron.

H1 Effects of the Invention As is clear from the above explanation, in the sputtering apparatus according to the present invention, a holding means for holding the sputtering target member on a lid body that closes the supply port through which the sputtering target member is taken in and taken out is provided. Since a plurality of closed surfaces are provided, each member to be sputtered can be held by the holding means of each closed surface.

Further, in the sputtering apparatus according to the present invention, the lid is movable up and down with respect to the supply port, and the closing surface facing the supply port is switched by rotating the lid. Therefore, when the member to be sputtered after the sputtering process is taken out from the vacuum chamber by the holding means provided on one closed surface side of the lid, the member to be sputtered before the sputtering process held on the other closed surface side is taken out from the vacuum chamber. A sputtering processing member can be provided opposite the supply port.

Therefore, according to the apparatus of the present invention, the sputtering target member after the sputtering process and the sputtering target member before the sputtering process can be instantly taken in and out of the vacuum chamber, resulting in a significant improvement in productivity. can be achieved.

In addition, since the lid body can be moved up and down with respect to the supply port and a mechanism for switching the closing surface provided on the lid body is provided below the vacuum chamber, the device can be made smaller, and
We can supply inexpensive equipment.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view, not showing the vacuum chamber, of the optical disk manufacturing apparatus of this embodiment, and FIG. 2 is a cross-sectional view of the vacuum chamber. 3 to 11 are longitudinal cross-sectional views of a vacuum chamber sequentially showing the steps of performing sputtering processing by the optical disk manufacturing apparatus of this embodiment, and FIG. 3 shows a state in which the disk outlet is closed with a saucer, FIG. 4 shows the state in which the disk substrate is loaded, FIG. 5 shows the state in which the disk substrate has been completely loaded, FIG. 6 shows the state in which the transfer of the disk substrate to the sputtering processing section is completed, and FIG. 8 shows the state during the sputtering process of the disk substrate, FIG. 8 shows the state when the sputtering process is completed, FIG. 9 shows the state after the disk substrate has been transported to the disk exit,
Figure O shows the state in which the disk substrate is taken out, and Figure 11 shows the state in which the closing surface of the lid body is switched. FIG. 12 is a longitudinal sectional view showing an example of a conventional sputtering apparatus. 19゜20・・・Push-up axis

Claims (1)

[Claims] a vacuum tank having a supply port through which a member to be sputtered is taken in and taken out, and a sputtering processing section that performs sputtering on the member to be sputtered;
a lid body having a plurality of closing surfaces provided with holding means for holding the member to be sputtered, and closing the supply port with any one of these closing surfaces; a transfer means for transferring between the supply port and the sputtering processing section, the lid body being able to move up and down with respect to the supply port;
A sputtering device in which a closing surface facing the supply port can be freely switched by rotating the lid.