JPH0328032Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an apparatus for separating and conveying a plurality of intertwined and overlapping lead frames from each other.

[Conventional technology]

Normally, lead frames are manufactured by punching using a press, but it is inevitable that a slight burr will be produced on the periphery. A large number of such lead frames, for example, several hundred sheets, are stacked and stored or transported, but at this time, burrs often get caught and become entangled.

[The problem that the idea aims to solve]

However, when performing die mounting work using this lead frame, even if you try to feed the lead frames one by one to the die bonder by suction or other means from the top of the bundle, some of the lead frames remain entangled, and two Due to the problem that sheets or several sheets are sometimes fed while being overlapped, conventionally, to prevent this, the tangles were removed manually, which required manpower, and the work was simple and labor conditions were low. However, it was painful and difficult to manage, and the work was time-consuming and hindered high-speed automation.

The present invention eliminates these drawbacks of the conventional method,
It is an object of the present invention to provide a lead frame conveying device that does not require manual labor and can automate work at high speed.

[Means to solve the problem]

The present invention has a feed mechanism 12 consisting of a holder 15 on which a plurality of lead frames 3 are placed one on top of the other.
and a guide rail 7 comprising the holder 15, which transports the lead frame 3 one by one and supplies it to the processing section.
, a pair of holding rails 24 and 29 interposed between the holder 15 and the guide rail 7 to separate the lead frame 3, and suction cups 20 and 21 for sucking the lead frame 3; Holder 15
It consists of an arm 22 that moves horizontally on each rail with a cylinder 23, and a frame 19 that supports the arm 22 and is movable up and down.
and a moving mechanism 14 configured to move simultaneously between the holding rail 24 and the guide rail 7, and a lead frame 3 on the holding rails 24 and 29.
A pair of pressers 36, 3 that can be moved toward and away from the
9 and a stylus 38 for detecting the overlap of the lead frame 3, one of the holding rails 24 and 29 is fixed, and the other holding rail 2 is fixed.
9 is provided so that it can be raised and lowered freely, and both holding rails 2
A central support member 30 is provided between 4 and 29, and when the stylus 38 detects the overlap of the lead frames,
the holding rails 24, 29, the holding tool 36,
39 and a lead frame separating mechanism 13 which clamps both ends of the lead frame 3 in its thickness direction and presses it against the central support member 30 to apply bending deformation. be.

〔Example〕

An embodiment of the present invention will be described with reference to FIGS. 1 to 4. A bonding head 1 of a die bonder equipped with a bonding arm 2 is placed on a table (not shown), and the bonding head 1 of the die bonder is placed on a table (not shown). By moving in the direction and moving the bonding arm 2 up and down, the IC chip 5 on the holding plate 4 is attracted by the suction mechanism 6 at the tip of the bonding arm 2, and is transferred along the guide rail 7 by the feed claw 8. The lead frame 3 is carried to a predetermined position on the lead frame 3, and die bonding is performed.

9 is a rail entrance part, 10 is a rail exit part, 11
is a storage magazine for the lead frame 3.

In order to supply the lead frame, a feed mechanism 12, a lead frame separation mechanism 13, and a lead frame moving mechanism 14 are provided.

In this feed mechanism 12, a holder 15 that holds a large number of stacked lead frames 3 is raised by a lifting mechanism 16 such as a cylinder for each thickness of the lead frames 3.

The lead frame moving mechanism 14 also includes a frame 19 that is moved up and down along a guide rail 17 by a lifting mechanism 18 such as a cylinder.
2 is supported by a cylinder 23 so as to be horizontally reciprocatable.

The functions of the feed mechanism 12 and the moving mechanism 14 will be explained with reference to FIG. A reciprocating movement is made between the top surface of the bundle of lead frames 3 of the feed mechanism 12 and the holding rail 24 of the separation mechanism 13 along a gate-shaped locus as shown by dotted lines 25 and 26, and at the same time, the suction cup 21 is also moved. It is designed to reciprocate between the holding rail 24 of the separation mechanism 13 and the guide rail 7 of the rail entrance portion 9 along a gate-shaped locus as indicated by dotted lines 27 and 28.

That is, from the state shown in FIG. 3a, the suction cups 20 and 21 are lowered by the moving mechanism 14, and brought into contact with the lead frames 3 on the feed mechanism 12 and the lead frames 3 on the separation mechanism 13, respectively, and are suctioned in a vacuum. , and then raise the suction cups 20 and 21 [Fig. 3b]. Next, the arm 22 is retracted and moved, the suction cups 20 and 21 are lowered, the two lead frames 3 are placed on the holding rail 24 and the guide rail 7 respectively [Fig. 3c], and the vacuum After stopping the suction, the suction cups 20 and 21 are raised [Fig. 3 d].

After that, the arm 22 is extended, and the guide rail 7
The upper lead frame 3 is sent away by the feed claw 8, and the stacked lead frames 3 are raised by one thickness in the feed mechanism 12 to return to the state shown in Fig. 3a.The above steps are repeated. Lead frames 3 are sequentially supplied.

The lead frame separation mechanism 13 consists of a pair of holding rails as shown in FIG. 4, one holding rail 24 is fixed, but the holding rail 29 on the opposite side and the intermediate support member 30 are block 31 so as to be movable up and down, and receives an upward force from springs 32 and 33, but the stopper 34,
35, the highest position is maintained at the position shown in FIG. 4a.

The presser 36 has a presser portion 37 and a stylus 38 for detecting overlap between lead frames.
It is designed to move up and down and to move back and forth in a direction perpendicular to the holding rail 24. On the other hand presser 3
Reference numeral 9 has a presser portion 40, which is movable up and down and reciprocated in a direction perpendicular to the holding rail 29.

41 in FIG. 2 is a second stylus for detecting overlap.

The operation of the lead frame separation mechanism 13 will be explained with reference to FIGS. 4a to 4e.
6 and 39 receive the lead frame 3 in the most open and raised state and hold it on the holding rails 24 and 29 [FIG. 4a].

Next, the presser 36 is moved inward and lowered to bring the stylus 38 into contact with the surface of the lead frame 3. The thickness of the lead frame 3 on the holding rail 24 can be detected by the height of the presser 36 at the time of this contact, and it is possible to detect whether the lead frame 3 is correctly separated into one piece or if several pieces overlap. You can tell what the condition is. When it is confirmed that the lead frame 3 is one piece, the lead frame 3 is transferred to the guide rail 7 through the steps shown in FIGS. 3a to 3d.

If two intertwined lead frames 3 are placed on the holding rails 24 and 29 in an overlapping manner as shown in FIG. It is detected that two sheets are overlapped at the position. In this case, the presser 36,
39 moves inward and descends to clamp both edges of the lead frame 3 in the thickness direction by the holding rails 24 and 29, respectively (FIG. 4d). At this time, the holding portion 37 holds and fixes one end edge of the lead frame 3. The stylus 38 is held by a spring,
It is designed to retract if pushed. After that, if only the presser 39 is further lowered, as shown in Fig. 4e.
The two lead frames 3, 3 are also subjected to the reaction force of the central support member 30 and undergo bending deformation. At this time, on the contact surfaces of the two lead frames 3, the other edge bends downward using the sandwiched edge as a fulcrum, and a relative shift occurs across the entire surface, and the entanglement due to burrs etc. comes off and the two are separated. be done.

After that, raise and open the pressers 36 and 39 and
Return the suction cup 2 to the state shown in Figure a, and then
0 and 21 are lowered, applying a vacuum only to the suction cup 21, and raising it while applying no vacuum to the suction cup 20, only the lead frame 3 separated by the separation mechanism 13 is transferred onto the guide rail 7. Change.
At this time, the lead frame 3 on the feed mechanism 12
Since the lead frame 3 cannot be transferred, the separated lead frame 3 remains on the separation mechanism 13.

When the lead frame 3 is received into the rail entrance portion 9 of the guide rail 7, the second stylus 41
The presence or absence of a second overlap is further detected.
If there is an overlap, the suction plate 21 sucks it and returns it to the separation mechanism 13 to perform the separation operation again.

If the lead frame 3 remains on the separation mechanism 13, no new lead frame 3 is supplied from the feed mechanism 12.

The stylus 38 for detecting the number of sheets may be a separate mechanism from the presser 36.

When clamping stacked lead frames in the thickness direction, firmly clamp them along the unpunched part of the lead at one edge of the lead frame, and do not clamp the other parts, or do not clamp them misaligned. If they are held loosely enough to allow for this, the displacement of the contact surfaces will occur over the entire surface when bending deformation is applied, and separation will be ensured.

[Effect of idea]

The present invention has a configuration that processes through a separation process to detect and separate overlapping lead frames.
A pair of presser and stylus are pressed against the lead frame on the holding rail, and the presser and the holding rail sandwich a part of the lead frame in the thickness direction and support the other part in a movable manner. By having a structure in which the overlapping lead frames are brought into contact with the central support material and bent and deformed to create a relative shift on the contact surface and separate the lead frames, the overlapping lead frames can be transported and supplied smoothly. It can be done reliably, and since the lead frame is sandwiched in the thickness direction and separated by detecting the thickness, the lead frame separation work can be performed stably, and the entanglement of overlapping lead frames can be avoided. can be removed extremely easily without the need for manual labor, and the die bonding process can be automated at high speed, contributing to labor savings. In addition, the separation process can be omitted when the lead frames do not overlap. It has great practical effects, such as being able to carry out continuous automatic conveyance of lead frames extremely efficiently.

[Brief explanation of the drawing]

The drawings relate to embodiments of the present invention.
Figure 2 is a plan view and its front view, Figure 3 a~
d is an explanatory diagram of the lead frame supply process, Fig. 4a
-e are explanatory diagrams of the lead frame separation process. DESCRIPTION OF SYMBOLS 1... Bonding head, 2... Bonding arm, 3... Lead frame, 4... Holding plate, 5... IC chip, 6... Adsorption mechanism, 7...
Guide rail, 8... feed claw, 9... rail entrance section, 10... rail exit section, 11... storage magazine, 12... feed mechanism, 13... separation mechanism, 14... moving mechanism, 15...... Holder, 16...
... Lifting mechanism, 17... Guide frame, 18, 4
2... Lifting mechanism, 19... Frame, 20, 21
... Suction cup, 22 ... Arm, 23 ... Cylinder, 24 ... Holding rail, 29 ... Holding rail,
30... Support material, 31... Block, 32, 33
... Spring, 34, 35 ... Stopper, 36, 39
... Presser, 37, 40 ... Presser, 38, 41
... Stylus, 43 ... Swinging roller.

Claims (1)

[Claims for Utility Model Registration] A feed mechanism 12 consisting of a holder 15 on which a plurality of lead frames 3 are placed one on top of the other, and a feed mechanism 12 that transports the lead frames 3 one by one from the holder 15 and supplies them to a processing section. a pair of holding rails 24 and 29 that are interposed between the holder 15 and the guide rail 7 to separate the lead frame 3; and suction cups 20 and 21 that adsorb the lead frame 3.
and comprises an arm 22 that moves horizontally with a cylinder 23 on the holder 15 and each rail, and a frame 19 that supports the arm 22 and is movable up and down, and both the suction cups 20, 21. A moving mechanism 1 configured to simultaneously move between a holder 15 and a holding rail 24 and between a holding rail 24 and a guide rail 7.
4, and a pair of pressers 3 provided on the holding rails 24 and 29 so as to be able to approach and separate from the lead frame 3.
6, 39 and a stylus 38 for detecting the overlap of the lead frame 3, one of the holding rails 24, 29 is fixed, the other holding rail 29 is provided so as to be freely raised and lowered, and both A central support member 30 is provided between the holding rails 24 and 29, and when the stylus 38 detects that the lead frames overlap, the holding rails 24 and 29 and the pressers 36 and 39 support the lead frame 3. A lead frame conveyance device comprising a lead frame separation mechanism 13 that pinches both ends in the thickness direction and presses them against a central support member 30 to apply bending deformation.