JPH03278519A - Chemical detection mechanism of chemical applicator - Google Patents
Chemical detection mechanism of chemical applicatorInfo
- Publication number
- JPH03278519A JPH03278519A JP7988190A JP7988190A JPH03278519A JP H03278519 A JPH03278519 A JP H03278519A JP 7988190 A JP7988190 A JP 7988190A JP 7988190 A JP7988190 A JP 7988190A JP H03278519 A JPH03278519 A JP H03278519A
- Authority
- JP
- Japan
- Prior art keywords
- chemical
- light
- chemicals
- chemical liquid
- discharge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000126 substance Substances 0.000 title claims abstract description 85
- 238000001514 detection method Methods 0.000 title claims abstract description 16
- 230000003287 optical effect Effects 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 46
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 230000002950 deficient Effects 0.000 abstract description 5
- 230000007547 defect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は薬液塗布装置の改良に関し、特に薬液塗布装置
の半導体基板への薬液吐出における、薬液吐出量の検出
機構に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an improvement in a chemical coating device, and more particularly to a mechanism for detecting the amount of a chemical discharged when the chemical coating device discharges a chemical to a semiconductor substrate.
従来、この種の薬液塗布装置の薬液検出機構は、間接的
な検出、すなわち、薬液吐出手段である薬液ポンプの動
作確認、例えばベローズ式ポンプが薬液吐出時間内にあ
る一定のストロークを動いたかどうかの確認等の方法を
用いていた。Conventionally, the chemical liquid detection mechanism of this type of chemical liquid applicator has been used for indirect detection, that is, to check the operation of the chemical liquid pump that is the chemical liquid discharging means, for example, whether the bellows type pump has moved a certain certain stroke within the chemical liquid discharging time. Methods such as confirmation were used.
ちなみに、薬液の圧送手段がダイアフラム式ポンプ或い
は、ロータリポンプ等の場合は上述した手段をとるのは
非常に困難であり、窒素等の気体による薬液加圧圧送方
式に至っては定量的な吐出量の検出は全く不可能である
。By the way, it is extremely difficult to use the above-mentioned method when the means for pressure-feeding the chemical liquid is a diaphragm pump or a rotary pump, and when it comes to pressurizing the chemical liquid using a gas such as nitrogen, it is difficult to achieve a quantitative discharge amount. Detection is completely impossible.
上述した従来の薬液塗布装置の薬液検出機構では、半導
体基板上へ吐出する薬液を直接検出する訳ではないので
、薬液内へ気泡が大量に混入して薬液の吐出不足が起っ
たとしても、これを知る術がなく、半導体基板の塗布不
良を起すとともに、その察知が遅れてしまうという欠点
がある。The chemical liquid detection mechanism of the conventional chemical liquid coating device described above does not directly detect the chemical liquid discharged onto the semiconductor substrate, so even if a large amount of air bubbles are mixed into the chemical liquid and the chemical liquid is insufficiently discharged, There is no way to know this, and there are disadvantages in that it causes a coating failure on the semiconductor substrate and the detection is delayed.
なお、薬液内の気泡混入の主な原因としては次の4つが
挙げられる。The following four main causes of air bubbles being mixed into the chemical solution are listed below.
(1)薬液内に有機溶剤を含む場合、ポンプの吸弓動作
等による負圧下で溶剤分が気化して発泡する。(1) When the chemical solution contains an organic solvent, the solvent vaporizes and foams under negative pressure caused by the suction action of the pump.
(2)薬液配管系の亀裂及び継手の緩み。(2) Cracks in the chemical piping system and loose fittings.
(3)薬液の濾過手段を有する場合のフィルター交換等
における空気の混入。(3) Air contamination during filter replacement, etc. in cases where a chemical solution filtration means is provided.
(4)薬液検出機構の故障、空検知1!!精を有してい
ない場合は、薬液が空になった時に空気が混入する。(4) Malfunction of chemical liquid detection mechanism, empty detection 1! ! If it does not contain air, air will be mixed in when the chemical solution is emptied.
本発明の目的は、薬液の吐出不良、すなわち塗布不良を
察知することができ、その結果半導体装置における製品
不良率を大幅に減少させることができる薬液塗布装置の
薬液検出機構を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a chemical liquid detection mechanism for a chemical liquid applicator that can detect a chemical discharge failure, that is, a coating failure, and as a result can significantly reduce the product defect rate in semiconductor devices. .
本発明の薬液塗布装置の薬液検出機構は、半導体基板へ
薬液を塗布する薬液塗布装置の薬液塗布処理部の薬液吐
出ノズルの直下に設置した光学式検知器を有している。The chemical liquid detection mechanism of the chemical liquid coating apparatus of the present invention has an optical detector installed directly below the chemical liquid discharge nozzle of the chemical liquid coating processing section of the chemical liquid coating apparatus that applies a chemical liquid to a semiconductor substrate.
次に、本発明について図面を参照して説明する。第1図
は本発明の一実施例を示す側面図である。薬液の吐出は
、従来と同機、図示しないポンプ等の薬液圧送手段によ
り行われる。Next, the present invention will be explained with reference to the drawings. FIG. 1 is a side view showing an embodiment of the present invention. Discharge of the chemical solution is performed by the same device as in the past, using a chemical solution pressure feeding means such as a pump (not shown).
薬液1は薬液ノズル2より塗布処理部3内の半導体基板
4上へ吐出される。The chemical solution 1 is discharged from the chemical solution nozzle 2 onto the semiconductor substrate 4 in the coating processing section 3 .
薬液ノズル直下には、薬液ノズルから吐出された薬液を
はさんで薬液検出用の光学式検知器発光部5と光学式検
知器受光部6が設置されている。Immediately below the chemical liquid nozzle, an optical detector light emitting part 5 and an optical detector light receiving part 6 for detecting the chemical liquid are installed, sandwiching the chemical liquid discharged from the chemical liquid nozzle.
次に、第1図の平面図である第2図により、薬液の検出
方法について説明する。光学式検知器は発光部、受光部
とも2式を備え、発光部より例えばレーザー光7を幅り
の間隔で照射できる。幅りは薬液ノズルより正常に吐出
される薬液を円柱と見なしな場合の直径である。なお、
1は薬液ノズルの直径である。Next, a method for detecting a chemical solution will be described with reference to FIG. 2, which is a plan view of FIG. 1. The optical detector has two sets of light emitting parts and light receiving parts, and can emit, for example, laser light 7 at wide intervals from the light emitting parts. The width is the diameter when the chemical liquid normally discharged from the chemical liquid nozzle is not regarded as a cylinder. In addition,
1 is the diameter of the chemical liquid nozzle.
以上の条件の下で先ず、光学式検知器を発光させ、次に
、薬液ノズルより薬液の吐出を行うと、吐出動作が正常
に行われた場合、検知器の光は遮光される。この時検知
器により、薬液の吐出動作が正常に開始されたことを確
認できる訳であるが、さらに所期の薬液吐出時間Tの間
、検知器の遮光が行われたことを電気信号を用いて確認
するようにすれば薬液の吐出量をユースポイントでモニ
タリングすることができる。Under the above conditions, first, the optical detector is made to emit light, and then the chemical liquid is ejected from the chemical liquid nozzle. If the ejection operation is performed normally, the light from the detector is blocked. At this time, the detector can confirm that the dispensing operation of the chemical solution has started normally, but an electrical signal is also used to confirm that the detector has been shielded from light for the intended dispensing time T. If you check the discharge amount of the chemical solution at the point of use, you can monitor it.
上述の状況でもし、薬液の吐出量が少ない、すなわちL
が所期の値より小であった場合は薬液吐出時間T内に検
知器の遮光が行われなかったという事実をもって不良と
見なせば良い。In the above situation, if the discharge amount of the chemical solution is small, that is, L
If is smaller than the expected value, the fact that the detector was not shielded from light within the chemical liquid ejection time T can be considered as a defect.
第3図は本発明の第2の実施例を示す平面図である。光
学式検知器5は第1の実施例の場合と異なり、遮光され
た部分の幅、すなわち図中における薬液ノズル直下の薬
液の直径りを検知し、出力するタイプのものを採用して
いる。薬液吐出量は第1の実施例の場合と同様に、所期
の薬液吐出時間Tの間に検知器より幅りに相当する電気
信号が出たことをもって確認する。FIG. 3 is a plan view showing a second embodiment of the invention. Unlike the first embodiment, the optical detector 5 is of a type that detects and outputs the width of the light-shielded portion, that is, the diameter of the chemical directly below the chemical nozzle in the figure. As in the case of the first embodiment, the amount of chemical liquid discharged is confirmed when an electric signal corresponding to the width is output from the detector during the expected chemical liquid discharge time T.
この場合の検知器は被検知体、すなわち薬液が第3図に
示した検知器の光線の領域にあれば薬液の直径りが検出
できる形式のものである。The detector in this case is of a type that can detect the diameter of the medicinal solution if the object to be detected, that is, the medicinal solution, is in the region of the light beam of the detector shown in FIG.
第1の実施例では薬液ノズルの僅かな位置ずれ等による
薬液の位置ずれがあると、検知光の遮光・受光の位置関
係がずれて結果的に誤検知が起こってしまうのに対し、
本実施例では薬液が検知器の光線の領域にある限り、上
述したことは起らないという利点がある7
〔発明の効果〕
以上説明したように本発明は、光学式薬液検出器にて半
導体基板上への薬液吐出量をモニタリングすることによ
り、薬液の吐出不良すなわち塗布不良を直ちに察知する
ことが出来るので、半導体製造における製品不良率を著
しく減少させるという効果かある。In the first embodiment, if there is a positional deviation of the chemical liquid due to a slight positional deviation of the chemical liquid nozzle, the positional relationship between the blocking and receiving of the detection light shifts, resulting in false detection.
This embodiment has the advantage that the above-mentioned problem does not occur as long as the chemical solution is in the region of the light beam of the detector. By monitoring the amount of chemical liquid discharged onto the substrate, defective discharge of the chemical liquid, that is, defective coating of the chemical liquid can be immediately detected, which has the effect of significantly reducing the product defect rate in semiconductor manufacturing.
第1図は本発明の一実施例を示す側面図、第2図は第1
図の平面図、第3図は本発明の第2の実施例を示す平面
図である。
1・・・薬液、2・・・薬液ノズル、3・・・塗布処理
部、4・・・半導体基板、5・・・光学式検知器発光部
、6・・・光学式検知器受光部。FIG. 1 is a side view showing one embodiment of the present invention, and FIG. 2 is a side view showing one embodiment of the present invention.
FIG. 3 is a plan view showing a second embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Chemical liquid, 2... Chemical liquid nozzle, 3... Coating processing part, 4... Semiconductor substrate, 5... Optical detector light emitting part, 6... Optical detector light receiving part.
Claims (1)
部の薬液検出ノズルの直下に薬液の吐出量を検出する光
学式検知器を有することを特徴とする薬液塗布装置の薬
液検出機構。A chemical liquid detection mechanism for a chemical liquid coating apparatus, comprising an optical detector for detecting a discharge amount of the chemical liquid directly below a chemical liquid detection nozzle of a coating processing section of the chemical liquid coating apparatus that applies a chemical liquid to a semiconductor substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7988190A JPH03278519A (en) | 1990-03-28 | 1990-03-28 | Chemical detection mechanism of chemical applicator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7988190A JPH03278519A (en) | 1990-03-28 | 1990-03-28 | Chemical detection mechanism of chemical applicator |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03278519A true JPH03278519A (en) | 1991-12-10 |
Family
ID=13702588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7988190A Pending JPH03278519A (en) | 1990-03-28 | 1990-03-28 | Chemical detection mechanism of chemical applicator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03278519A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100968011B1 (en) * | 2007-06-14 | 2010-07-07 | 다이니폰 스크린 세이조우 가부시키가이샤 | Substrate coating apparatus and method of chemical detection |
CN112505035A (en) * | 2019-09-13 | 2021-03-16 | 株式会社斯库林集团 | Method for detecting gas-liquid interface inside nozzle and substrate processing apparatus |
-
1990
- 1990-03-28 JP JP7988190A patent/JPH03278519A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100968011B1 (en) * | 2007-06-14 | 2010-07-07 | 다이니폰 스크린 세이조우 가부시키가이샤 | Substrate coating apparatus and method of chemical detection |
CN112505035A (en) * | 2019-09-13 | 2021-03-16 | 株式会社斯库林集团 | Method for detecting gas-liquid interface inside nozzle and substrate processing apparatus |
TWI737335B (en) * | 2019-09-13 | 2021-08-21 | 日商斯庫林集團股份有限公司 | Detecting method of gas-liquid interface in nozzle and substrate processing apparatus |
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