JPH03274903A - Manufacture of waveguide - Google Patents

Manufacture of waveguide

Info

Publication number
JPH03274903A
JPH03274903A JP7590490A JP7590490A JPH03274903A JP H03274903 A JPH03274903 A JP H03274903A JP 7590490 A JP7590490 A JP 7590490A JP 7590490 A JP7590490 A JP 7590490A JP H03274903 A JPH03274903 A JP H03274903A
Authority
JP
Japan
Prior art keywords
plating
core metal
waveguide
electrolytic
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7590490A
Other languages
Japanese (ja)
Inventor
Kenichi Yamaoka
山岡 憲一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7590490A priority Critical patent/JPH03274903A/en
Publication of JPH03274903A publication Critical patent/JPH03274903A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve mold releasing ability by reducing a coefficient of friction when removing the electrodeposit such as copper of Ni with required thickness for coating by plating non-electrolytic Ni to Al alloy in a required shape and blowing conductive coating to core metal including tetrafluoride ethylene in fine holes. CONSTITUTION:The permanent core metal is used while defattering and acid- cleaning the Al alloy, subjecting the non-electrolytic Ni plating and including the tetrafluoride ethylene into fine holes. The conductive coating 3 is applied onto a non-electrolytic Ni plating layer 2, which includes Teflon in the Al alloy and Cu or Ni electric plating 4 is applied. Then, the mold of the plating layer 4 is released. Therefore, a waveguide 5 is obtained. Since the tetrafluoride ethylene is included in the file holes, the wearing resistance of the core metal is improved. On the other hand, the film thickness of the non-electrolytic Ni plating is made uniform and the reproducibility of an original shape is made satisfactory. By including the tetrafluoride ethylene, not only the wearing resistance of Ni is improved but also the coefficient of friction is reduced and the mold can be easily released. Further, the manufacture cost of this waveguide is reduced.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明はアルミニウム合金を芯金とし、銅又はニッケ
ルを電着させた後、銅又はニッケル電析物のみを除去し
て導波管とするその製造方法に関する吃のである。
[Detailed Description of the Invention] [Field of Industrial Application] This invention uses an aluminum alloy as a core metal, electrodeposit copper or nickel, and then removes only the copper or nickel deposits to form a waveguide. This is about the manufacturing method.

〔従来の技術〕[Conventional technology]

従来の導波管の製造方法は、ステンレス鋼に不働態化名
埋又は導電性塗料を吹き付けたものや。
Conventional methods for manufacturing waveguides include spraying passivated or conductive paint onto stainless steel.

アルミニウム合金に無電解ニッケルめっきを施し導電性
塗料吹き付けたものを芯金とし、上記芯金に鋼又はニッ
ケルを施した後、上記鋼又はニッケル電析物を除去する
ことによって所要形状の導波管を得ていた。
The core metal is an aluminum alloy that has been electrolessly nickel plated and sprayed with conductive paint. After applying steel or nickel to the core metal, the steel or nickel deposits are removed to create a waveguide in the desired shape. I was getting .

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来のステンレス鋼に導電性塗料を吹き付ける方法や不
働態化名埋したものを芯金とする導波管の製造方法は、
芯金が重く導波管製造効率を著しく阻害していた。又所
要形状の芯金の加工に多大な時間を要し芯金のコスト高
となっていた。
Conventional methods of spraying conductive paint on stainless steel and methods of manufacturing waveguides using passivated materials as core metals are as follows:
The heavy core metal significantly hindered waveguide manufacturing efficiency. Furthermore, it takes a great deal of time to process the core metal into the required shape, which increases the cost of the core metal.

又、アルミニウム合金に無電解ニッケルめっきを施した
ものを芯金とする導波管の製造方法は。
Also, how to manufacture a waveguide whose core metal is an aluminum alloy plated with electroless nickel.

無電解ニッケルめっきに塗布した離型性導電性塗料と無
電解ニッケルめっきの密着力が優れているため、銅又は
ニッケルの金属電着物を取り除くことが困難であった。
Because the adhesive strength between the releasable conductive paint applied to the electroless nickel plating and the electroless nickel plating is excellent, it has been difficult to remove the metal electrodeposit of copper or nickel.

このため無電解ニッケルめっきを施したアルミニウム製
の芯金の消耗が激しい欠点があった。又耐食性が悪いと
いう欠点もあった。
For this reason, there was a drawback that the aluminum core metal plated with electroless nickel was rapidly worn out. It also had the disadvantage of poor corrosion resistance.

この発明はこのような従来の課題を改善するためなさζ
たもので、銅又はニッケルの金属電着物を取力除く際、
摩擦抵抗を小さくシ、離型性を改善しようとするもので
ある。
This invention was made to improve these conventional problems.
When removing copper or nickel metal electrodeposit with force,
The aim is to reduce frictional resistance and improve mold releasability.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係る導波管の製造方法は、第1図で示すよう
に所要形状のアルミニウム合金に無電解ニッケルめっき
を施し、その微小孔に四弗化エチレンを含浸した上記芯
金に所要厚さの導電性塗料を吹き付け、上記導電性塗料
の上に所要の厚さの銅又はニッケル電析物を除去して導
波管を得ることを見い出した。
As shown in FIG. 1, the method for manufacturing a waveguide according to the present invention involves applying electroless nickel plating to an aluminum alloy having a desired shape, and applying tetrafluoroethylene to the core metal having micropores impregnated with the desired thickness. It has been discovered that a waveguide can be obtained by spraying a conductive paint and removing a desired thickness of copper or nickel deposits on the conductive paint.

〔作用〕[Effect]

アルミニウムに施した無電解ニッケル膜の微小孔に含浸
した四弗化エチレンによシ、芯金の母材であるアルミニ
ウムの防食性を賦与することが可能であシ、又無電解ニ
ッケル膜の微小孔に含浸した四弗化エチレンによシ、摩
擦係数を小さくシ。
Tetrafluoride ethylene impregnated into the micropores of an electroless nickel film applied to aluminum can provide anti-corrosion properties to aluminum, which is the base material of the core metal, and also improve the microporosity of the electroless nickel film. Tetrafluoroethylene impregnated into the holes reduces the coefficient of friction.

芯金と銅又はニッケルめっきの電析物の間の離型性が向
上した。
The mold releasability between the core metal and copper or nickel plating electrodeposit was improved.

〔実施例〕〔Example〕

以下、導波管製造方法の実施例について詳述する。 Examples of the waveguide manufacturing method will be described in detail below.

導波管を製造するための永久芯金は、第1図で示すよう
にアルミニウム合金を脱脂・酸洗いし。
The permanent core metal for manufacturing the waveguide is made of aluminum alloy that is degreased and pickled as shown in Figure 1.

無電解ニッケルめっきを施した後、その微小孔に四弗化
エチレンを含浸したものを用いる。
After electroless nickel plating, the micropores are impregnated with tetrafluoroethylene.

導波管t”製造する時は、第2図で示すように。When manufacturing the waveguide t'', as shown in FIG.

アルミニウムと合金(1)テフロンを含浸した無電解ニ
ッケルめっき層(2)に、導電性塗料(3)全塗布し。
Conductive paint (3) is completely applied to the electroless nickel plating layer (2) impregnated with aluminum and alloy (1) and Teflon.

銅又はニッケルの電気めっき(4)を形成し、銅又はニ
ッケルの電気めっき層(4)を離型することによって、
導波管(5)の製造をおこなう。
By forming a copper or nickel electroplating (4) and releasing the copper or nickel electroplating layer (4),
The waveguide (5) is manufactured.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明は、アルミニウム合金を無電解ニ
ッケルめっきした後に四弗化エチレンを含浸させた永久
芯金を使用してお91次に述べるような効果が期待でき
る。
As described above, the present invention can be expected to produce the following effects by using a permanent core metal in which an aluminum alloy is electrolessly nickel-plated and then impregnated with tetrafluoroethylene.

芯金であるアルミニウム合金に、無電解ニッケルめっき
を施し、その微小孔に四弗化エチレンを含浸しているた
め、永久芯金の耐食性向上が期待できる。
The aluminum alloy core is electroless nickel plated, and its micropores are impregnated with tetrafluoroethylene, which can be expected to improve the corrosion resistance of the permanent core.

更に無電解ニッケルめっきは、めっきの膜厚均一性に優
れ原型の再現性に優れている。
Furthermore, electroless nickel plating has excellent uniformity of plating film thickness and excellent reproducibility of the original.

又、無電解ニッケルめっきの微小孔に四弗化エチレンを
含浸させておシ、無電解ニッケルの耐摩耗性に加え、摩
擦係数が小さくなる利点を有しておシ、銅又はニッケル
の電気めっき厚と離型させるときの離型を容易にし、導
波管製造コストダウンに効果が期待できる。
In addition, by impregnating the micropores of electroless nickel plating with tetrafluoroethylene, it has the advantage of reducing the coefficient of friction in addition to the wear resistance of electroless nickel. It is expected to be effective in reducing waveguide manufacturing costs by making it easier to release the mold when separating the thickness.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は導波管製造のためのアルミニウム合金製永久芯
金製作工程図、第2図は導波管製造のための永久芯金と
導波管を示す図で、(1)はアルミニウム合金製永久芯
金、(2)は芯金膜を形成している四弗化エチレンを含
浸した無電解ニッケルめっき層、(3)は芯金に塗布し
た導電性塗膜、(4)は銅又はニッケルの電気めっきに
よって得られた電析層。 (5)は離型後の導波管。
Figure 1 is a manufacturing process diagram of aluminum alloy permanent core metal for waveguide manufacturing, Figure 2 is a diagram showing the permanent core metal and waveguide for waveguide manufacturing, and (1) is an aluminum alloy permanent core metal manufacturing process diagram. (2) is an electroless nickel plating layer impregnated with tetrafluoroethylene forming the core metal film, (3) is a conductive coating applied to the core metal, (4) is copper or Electrodeposited layer obtained by electroplating of nickel. (5) shows the waveguide after demolding.

Claims (1)

【特許請求の範囲】[Claims] 所要形状のアルミニウム合金に無電解ニツケルめつきを
施し,更に無電解ニツケルの微小孔に四弗化エチレンを
含浸した芯金に,所要厚さの導電性塗料を吹き付け,上
記導電性塗料の上に所要の厚さの銅又はニツケルめつき
を施した後,上記芯金から所要の厚さの銅又はニツケル
電析物を除去して導波管を得るようにした導波管の製造
方法。
Electroless nickel plating is applied to an aluminum alloy of the desired shape, and a conductive paint of the required thickness is sprayed onto a core metal whose micropores in the electroless nickel are impregnated with tetrafluoroethylene, and then conductive paint is applied to the conductive paint. A method for manufacturing a waveguide, in which a waveguide is obtained by plating copper or nickel to a desired thickness and then removing copper or nickel deposits to a desired thickness from the core metal.
JP7590490A 1990-03-26 1990-03-26 Manufacture of waveguide Pending JPH03274903A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7590490A JPH03274903A (en) 1990-03-26 1990-03-26 Manufacture of waveguide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7590490A JPH03274903A (en) 1990-03-26 1990-03-26 Manufacture of waveguide

Publications (1)

Publication Number Publication Date
JPH03274903A true JPH03274903A (en) 1991-12-05

Family

ID=13589791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7590490A Pending JPH03274903A (en) 1990-03-26 1990-03-26 Manufacture of waveguide

Country Status (1)

Country Link
JP (1) JPH03274903A (en)

Similar Documents

Publication Publication Date Title
US5547558A (en) Process for electroplating nonconductive surface
JP2018172788A (en) Production method of porous copper foil and porous copper foil using the production method
US5124192A (en) Plastic mold structure and method of making
US3649474A (en) Electroforming process
JPH03274903A (en) Manufacture of waveguide
US4511438A (en) Bi-metallic electroforming technique
KR100630315B1 (en) Metal flake forming a figure and the method for manufacturing the same
US4059710A (en) Process for plating shaped articles made of synthetic resins
JPS5811518B2 (en) Metal-diamond composite plating method
WO2003023087A1 (en) Plated resin molding and process for producing the same
JPH074656B2 (en) How to impregnate wear resistant materials into aluminum alloys
JPS5911678B2 (en) Manufacturing method of porous copper thin film
US4169017A (en) Method of making an electroforming mandrel
US4184940A (en) Electroforming mandrel
KR920007023B1 (en) Plating method on a non-metallic surface
JPH02225688A (en) Production of electroformed die
JPS6147916B2 (en)
US5000833A (en) Apparatus for the electrochemical surface treatment of substrates
JPS62109962A (en) Alumina powder for thermal spraying
US2439489A (en) Preparation of silver foil
JPS62158899A (en) Resin for composite plating
JP2000239889A (en) Plating method
JPH06240486A (en) Production of electroformed die
JPS6050156A (en) Plating type thermal spraying method
JPS60125339A (en) Manufacture of copper-carbon fiber composite material