JPH03274276A - Device for synthesizing thin film - Google Patents

Device for synthesizing thin film

Info

Publication number
JPH03274276A
JPH03274276A JP7521290A JP7521290A JPH03274276A JP H03274276 A JPH03274276 A JP H03274276A JP 7521290 A JP7521290 A JP 7521290A JP 7521290 A JP7521290 A JP 7521290A JP H03274276 A JPH03274276 A JP H03274276A
Authority
JP
Japan
Prior art keywords
vacuum container
thin film
gas
plasma
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7521290A
Other languages
Japanese (ja)
Inventor
Tsutomu Mitani
力 三谷
Hideo Kurokawa
英雄 黒川
Yuichi Nakagami
裕一 中上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7521290A priority Critical patent/JPH03274276A/en
Publication of JPH03274276A publication Critical patent/JPH03274276A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To stably synthesize a thin film uniform in quality and thickness by converting a raw gas to plasma between a grounded electrode and substrate close to the gas outflow port to a second vacuum vessel in a first vacuum vessel and controlling both the vessels to a specified pressure. CONSTITUTION:The raw gas 9 contg. a thin film constituting element such as C6H6 is introduced into the first vacuum vessel 5. A grounded electrode 7 is set in the vessel 5, and the raw gas 9 is converted to plasma 6 between the electrode 7 and a substrate 1 on a substrate holder 2 connected to a high-frequency power source 3. Consequently, the raw gas 9 is excited and decomposed, and a thin film of a diamondlike substance, etc., is synthesized on the substrate 1. In this thin film synthesis device, the raw gas 9 is passed through the first vacuum vessel 5 and introduced into the second vacuum vessel 10 from a gas outflow part 4, and the substrate 1 is arranged close to the gas outflow part 4. Besides, the substrate 1 is set at such a position that the pressures of the vessels 5 and 10 are controlled respectively to >=0.01Torr and to <=5X10<-3>Torr. The plasma 6 is made uniform and stable in this way, and the quality and thickness of the thin film are uniformized.

Description

【発明の詳細な説明】 産業上の利用分野 本発明はプラズマ中のイオンを用いて薄膜を合成する薄
膜合成装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a thin film synthesis apparatus for synthesizing thin films using ions in plasma.

従来の技術 従来、ダイヤモンド状/If膜の合成装置としては、様
々な方式のものが開示されている。以下に従来のダイヤ
モンド状薄膜の合成装置として、第3図に示すRFプラ
ズマCVD装置を例に挙げて説明する(例えば第33回
応用物理学関係連合講演会講演予稿集3p−ZD−14
等参照)。第3図(a)はこの装置の概略構成図で、同
図(b)は装置の電極付近での電位を示す。基体25と
して5iO2(ガラス)を下部電極26に設置する。原
料ガスにベンゼンガス24を使用し、13.56MHz
の高周波型R27で下部電極26に高周波電力を印加す
るとプラズマ30が発生し、硬さ3000程度のダイヤ
モンド状薄膜が基体25上に合成される。
2. Description of the Related Art Conventionally, various types of apparatuses for synthesizing diamond-like/If films have been disclosed. The RF plasma CVD apparatus shown in Fig. 3 will be explained below as an example of a conventional diamond-like thin film synthesis apparatus (for example, the 33rd Applied Physics Association Lecture Proceedings 3p-ZD-14).
etc.). FIG. 3(a) is a schematic configuration diagram of this device, and FIG. 3(b) shows the potential near the electrodes of the device. 5iO2 (glass) is placed as the base 25 on the lower electrode 26. Using benzene gas 24 as the raw material gas, 13.56MHz
When high frequency power is applied to the lower electrode 26 using the high frequency type R27, plasma 30 is generated, and a diamond-like thin film having a hardness of about 3000 is synthesized on the base 25.

この従来例で明かなように、高周波電力等の交流電力を
用いれば、ガラス等の絶縁性基体上にも良質のダイヤモ
ンド状薄膜が合成可能である。
As is clear from this conventional example, high-quality diamond-like thin films can be synthesized even on insulating substrates such as glass by using alternating current power such as high-frequency power.

この従来例以外にも、例えは特許No、 147943
2に開示されている装置、DCプラズマCVD装置等、
各種のダイヤモンド状薄膜の合成装置が公知であるが、
いずれの場合もプラズマ中のイオンが基体の表面を十分
な運動エネルギーで衝撃することで、良質のダイヤモン
ド状薄膜が合成されると一般的に労えられている。第3
図(b)は、前記従来の合成装置で良質のダイヤモンド
状薄膜が合成される原理を説明するものである。同(b
)において、■、は基体25に発生するいわゆるセルフ
バイアス電圧で、■2は上部電極23に発生するセルフ
バイアス電圧を示す。このセルフバイアス電圧はプラズ
マに対して基体、及び電極が相対的に低電位となるよう
に発生する。イオンはこの■1によって基体25方向に
加速され、その表面を衝撃する。ここでVlと■2とは
、下部電極260面積をA1、前記従来例でプラズマ3
0に接している上部電極23と真空容器28との面積を
A2て記すとVl/V2= (A2/AI) n で表される (例えば、 ツーライフン Iヌ ブヤツ
フ0マン (BrianN、 Chapman)著、岡
本幸雄訳 プラズマプロセシングの基礎 P、145等
参照)。ここでnはプラズマ状態、装置形状等によるも
ので一般的には、1〜4である。第3図に示すように、
A2は真空容器28も含むのでA + < A 2とな
り、V2<Vlとなる。
In addition to this conventional example, an example is Patent No. 147943
2, the DC plasma CVD device, etc.
Various apparatuses for synthesizing diamond-like thin films are known;
In either case, it is generally believed that high-quality diamond-like thin films can be synthesized by bombarding the surface of the substrate with sufficient kinetic energy by ions in the plasma. Third
Figure (b) explains the principle by which a high-quality diamond-like thin film is synthesized using the conventional synthesis apparatus. Same (b
), 2 indicates a so-called self-bias voltage generated in the base 25, and 2 indicates a self-bias voltage generated in the upper electrode 23. This self-bias voltage is generated so that the substrate and the electrode have a relatively low potential with respect to the plasma. The ions are accelerated in the direction of the substrate 25 by this (1) and impact the surface thereof. Here, Vl and ■2 are the area of the lower electrode 260 A1 and the plasma 3 in the conventional example.
If the area of the upper electrode 23 and the vacuum vessel 28 that are in contact with 0 is written as A2, it is expressed as Vl/V2= (A2/AI) n (for example, from Brian N. Chapman, Translated by Yukio Okamoto, Basics of Plasma Processing, see p. 145, etc.). Here, n depends on the plasma state, the shape of the device, etc., and is generally 1 to 4. As shown in Figure 3,
Since A2 also includes the vacuum vessel 28, A + < A 2 and V2 < Vl.

また、v2、■1の絶対値はプラズマ密度によるもので
あるため、■1の値は印加する高周波電力の大きさでも
調瞥が可能であり、前記従来例にも明記されているよう
に十分大きくすることが可能である。その結果、イオン
の運動エネルギーが十分て良質のダイヤモンド状薄膜が
合成されたものである。
In addition, since the absolute value of v2, ■1 depends on the plasma density, the value of ■1 can be checked by the magnitude of the high frequency power applied, and as specified in the conventional example above, it is sufficient It is possible to make it larger. As a result, a diamond-like thin film with sufficient ion kinetic energy and high quality was synthesized.

発明が解決しようとする課題 ところが前記従来の技術では、基体25上に合成された
ダイヤモンド状薄膜に硬さ等の膜質のl、う、および膜
厚のムラが発生し、問題となフた。
Problems to be Solved by the Invention However, in the conventional technique, the diamond-like thin film synthesized on the substrate 25 suffers from unevenness in film quality such as hardness, and unevenness in film thickness, which poses a problem.

これは、第3図(a)に示すように従来の薄膜合成装置
では、基体、電極、真空容器などによってガスの流動状
態、ガス圧力、さらにはプラズマ状態にムラが生じてし
まうためであった。
This is because, as shown in Figure 3(a), in conventional thin film synthesis equipment, unevenness occurs in the gas flow state, gas pressure, and even plasma state due to the substrate, electrodes, vacuum container, etc. .

また、例えば高周波電力を増加した場合等、合成条件に
よっては第3図に示す下部電極26と真空容器28との
間でアーク放電などの異常放電が発生しやすくなり、ダ
イヤモンド状i’ii膜を安定して合成することが困難
であった。これは前記のように、真空容器2日のガス圧
力が膜の合成部である前記電極近傍の圧力に近く、しか
も真空容器28も電力を印加する下部電極25に対して
接地電極となり、真空容器28の全体でプラズマが発生
するため、真空容器28の付着物、突起等へアーク放電
が発生しやすくなるからである。
Furthermore, depending on the synthesis conditions, such as when high-frequency power is increased, abnormal discharge such as arc discharge may easily occur between the lower electrode 26 and the vacuum vessel 28 shown in FIG. It was difficult to synthesize it stably. This is because, as mentioned above, the gas pressure on the second day of the vacuum vessel is close to the pressure near the electrode where the membrane is synthesized, and the vacuum vessel 28 also serves as a ground electrode with respect to the lower electrode 25 to which power is applied. This is because plasma is generated throughout the vacuum container 28, and arc discharge is likely to occur on deposits, protrusions, etc. of the vacuum container 28.

課題を解決するための手段 第一の本発明は、薄膜の構成元素を含む原料ガスの流人
部と流出部を備え、このガスをプラズマ化する第一の真
空容器と、その第一の真空容器に内設された接地電極と
、前記第一の真空容器のガスの流出部との間でガスが流
動可能なようにその第一の真空容器に接続された第二の
真空容器と、前記第一の真空容器のガスの流出部のガス
の流出を妨げないように、そのガス流出部に接近して配
置された基体と、その基体に交流電力を印加する交流電
源とを備え、薄膜の合成中において前記第一の真空容器
の圧力が0.01 Torr以上でかつ第二の真空容器
の圧力が5 X 10−3Torr以fとなる位置に前
記基体が設置されたことを特徴とする薄膜合成装置であ
る。
Means for Solving the Problems A first aspect of the present invention is a first vacuum vessel which is provided with a flow part and an outflow part for raw material gas containing constituent elements of a thin film, and which converts this gas into plasma; a second vacuum container connected to the first vacuum container so that gas can flow between a ground electrode installed in the container and a gas outlet of the first vacuum container; The first vacuum container includes a base disposed close to the gas outlet so as not to obstruct the outflow of the gas from the gas outlet, and an AC power source that applies AC power to the base. A thin film characterized in that the substrate is placed at a position where the pressure in the first vacuum container is 0.01 Torr or more and the pressure in the second vacuum container is 5 X 10-3 Torr or less during synthesis. It is a synthesis device.

第二の本発明は、薄膜の構成元素を含む原料ガスの流入
部と流出部を備え、このガスをプラズマ化する第一の真
空容器と、第一の真空容器に内設された電極と、前記第
一の真空容器のガスの流出部との間でガスが流動可能な
ようにその第一の真空容器に接続された第二の真空容器
と、前記第一の真空容器のガスの流出部のガスの流出を
妨げないように、そのガス流出部に接近して配置された
基体と、前記電極に交流電力を印加する交流電源と、前
記基体の接地部材とを備え、薄膜の合成中において前記
第一の真空容器の圧力が、0,01Torr以上でかつ
前記第二の真空容器の圧力が5×10−3Torr以下
となる位置に前記基体が設置されたことを特徴とする薄
膜合成装置である。
A second aspect of the present invention includes a first vacuum container that includes an inlet and an outlet for raw material gas containing constituent elements of the thin film, and that converts the gas into plasma; an electrode installed in the first vacuum container; a second vacuum container connected to the first vacuum container such that gas can flow between the first vacuum container and the gas outlet of the first vacuum container; a base disposed close to the gas outflow portion so as not to obstruct the gas outflow, an AC power source for applying AC power to the electrode, and a grounding member for the base; A thin film synthesis apparatus characterized in that the substrate is installed at a position where the pressure of the first vacuum container is 0.01 Torr or more and the pressure of the second vacuum container is 5 x 10-3 Torr or less. be.

作用 第一の本発明では、薄膜の合成位置におけるガスの流動
状態、ガス圧力、さらにはプラズマ状態の均一化が図ら
れるため、膜質、および膜厚は均一となる。また、第一
の真空容器の圧力が0.01Torr以上と第二の真空
容器の圧力よりも高いため、プラズマは第一の真空容器
で発生しやすい。しかも薄膜の合成部外である第二の真
空容器での圧力を5X 10−3Torr以下とするた
め、第二の真空容器でのプラズマの発生、およびアーク
放電は抑制される。以上のようにして第一・の発明では
前記従来の技術にあった課題が解決される。また、良質
のダイヤモンド状薄膜を合成するのに必要であった基体
に発生するセルフバイアス電圧(V3と記す)は、接地
電極のセルフバイアス電圧を■4、基体のプラズマに接
している面積をA3、接地電極の面積をA4と記すと、
前記従来例と同様に V3/V4= (A4/A3)’ となる。従って印加する交流電力の大きさ、A4、A3
の比によってV3を調整し、イオンが十分な運動エネル
ギーを得て良質のダイヤモンド状薄膜が合成可能となる
In the first aspect of the present invention, the gas flow state, gas pressure, and plasma state at the thin film synthesis position are made uniform, so that the film quality and thickness become uniform. Furthermore, since the pressure in the first vacuum container is 0.01 Torr or more, which is higher than the pressure in the second vacuum container, plasma is likely to be generated in the first vacuum container. Furthermore, since the pressure in the second vacuum vessel outside the thin film synthesis section is set to 5X 10-3 Torr or less, generation of plasma and arc discharge in the second vacuum vessel are suppressed. As described above, the first invention solves the problems encountered in the prior art. In addition, the self-bias voltage (denoted as V3) generated on the substrate, which was necessary to synthesize a high-quality diamond-like thin film, is determined by dividing the self-bias voltage of the ground electrode by ■4 and the area of the substrate in contact with the plasma by A3. , if the area of the ground electrode is written as A4, then
As in the conventional example, V3/V4=(A4/A3)'. Therefore, the magnitude of the AC power to be applied, A4, A3
By adjusting V3 according to the ratio of ions, ions obtain sufficient kinetic energy, and a high quality diamond-like thin film can be synthesized.

また、第二の発明は、前記第一の発明の均一な膜厚、膜
質の薄膜が合成可能である等の長所を維持しつつ、さら
に次のような作用を示す。第一の発明では、交流電力は
第二の真空容器に設置した基体に印加される。このため
、この基体に対して、第二の真空容器は接地電極となる
。この場合、第二の真空容器の圧力が5 X 10−3
Torrでも、例えば印加する交流電力がある程度より
大きくなると、第二の真空容器においてもプラズマが発
生することがありあまり好ましくない。また、例えば円
筒状基体を回転させつつダイヤモンド状薄膜を合成する
場合、第一の発明の薄膜合成装置によればベストとはい
いにくい。円筒状基体に交流電力を印加する接合部は多
点接触構造の複雑なものとなること、およびこの接合部
のインピーダンスが高いため、交流電力が消費され高温
となりやすいこと、さらにはこの接合部でアーク放電等
の異常放電が発生しやすいこと等のためである。その結
果、前記のような回転する円筒状基体にダイヤモンド状
薄膜を安定して合成することがいささか困難である。第
二の発明はこれらの不都合も更に解決可能な薄膜合成装
置である。第二の発明では、交流電力は第一の真空容器
に内設した電極に印加され、しかも基体を接地するため
、基体と第二の真空容器は同一の接地電位となる。その
結果、第二の真空容器においてプラズマの発生が第一の
発明以上に抑制できろ。また、前記のような回転する円
筒状基体に交流電力を印加する接合部での電力消費、発
熱、アーク放電等の課題も解決できる。また、良質のダ
イヤモンド状/iI膜を合成するのに必要であった基体
に発生ずるセルフバイアス電圧(V5と記す)は、接地
電極のセルフバーイアスミ圧をV6、基体のプラズマに
接している面積をA5、接地電極の面積をA6と記すと
、この場合もやはり前記従来例と同様に VS/V6= (AI3/A5)’ となる。従って印加する交流電力の大きさ、八〇、A5
の比によって■5を調整し、イオンが十分な運動エネル
ギーを得て良質のダイヤモンド状薄膜が合成可能となる
Further, the second invention maintains the advantages of the first invention, such as being able to synthesize a thin film with uniform thickness and quality, and also exhibits the following effects. In the first invention, AC power is applied to a substrate placed in a second vacuum container. Therefore, the second vacuum vessel becomes a ground electrode for this substrate. In this case, the pressure in the second vacuum container is 5 x 10-3
Even with Torr, for example, if the applied AC power becomes larger than a certain level, plasma may also be generated in the second vacuum container, which is not very preferable. Further, when synthesizing a diamond-like thin film while rotating a cylindrical substrate, for example, the thin film synthesizing apparatus of the first invention cannot be said to be the best. The joint that applies AC power to the cylindrical base has a complex multi-point contact structure, and the impedance of this joint is high, so AC power is consumed and the temperature tends to increase. This is because abnormal discharges such as arc discharges are likely to occur. As a result, it is somewhat difficult to stably synthesize a diamond-like thin film on such a rotating cylindrical substrate. The second invention is a thin film synthesis apparatus that can further solve these disadvantages. In the second invention, AC power is applied to an electrode installed inside the first vacuum container, and the base is grounded, so that the base and the second vacuum container are at the same ground potential. As a result, generation of plasma in the second vacuum container can be suppressed more than in the first invention. Furthermore, problems such as power consumption, heat generation, and arc discharge at the joint where AC power is applied to the rotating cylindrical base as described above can be solved. In addition, the self-bias voltage (denoted as V5) generated on the substrate, which was necessary to synthesize a high-quality diamond-like/iI film, is determined by the self-bias voltage of the ground electrode being V6, and the area of the substrate in contact with the plasma. If A5 is the area of the ground electrode, and A6 is the area of the ground electrode, in this case as well, VS/V6=(AI3/A5)' as in the conventional example. Therefore, the magnitude of the AC power to be applied is 80, A5
By adjusting (5) according to the ratio, ions obtain sufficient kinetic energy and a high-quality diamond-like thin film can be synthesized.

実施例 以下に本発明の実施例を図面を参熊して説明する。第1
図は第一の本発明に基づく薄膜合成装置の一実施例であ
る。絶縁性基体lとして通常の青板カラス(厚さ1rl
IITl)をステンレス′i14製の基体保持部材2に
設置し、ガス流動部4の間隔を2mmに調整した後、第
一の真空容器5と第二の真空容器10とを真空ポンプ1
1にて曙空排気し、第二の真空容器10を10”’To
rr程度とする。次に、第一の真空容器5内にベンゼン
ガス6をガス流入部8から0 、 I Torr導入す
るとともに、13.56MHzの高周波型R3から基体
保持部材2に高周波電力を170W印加すると、第一の
真空容器5内において絶縁性基体1と、接地電極7との
間でプラズマ6が発生した。このとき、第二の真空容器
lOの圧力は7 X 10−’Torrであり、プラズ
マはこの真空容器で発生しなかった。また、基体1での
セルフバイアス電圧は560■であった。この状態で1
0分間合成した。合成した膜は、ヌープ硬さが3000
から3100であり、また、膜厚は5500Aから57
00Aと均一な良質のダイヤモンド状薄膜であつk。
Examples Examples of the present invention will be described below with reference to the drawings. 1st
The figure shows an embodiment of a thin film synthesis apparatus based on the first invention. Ordinary blue plate crow (thickness 1rl) is used as the insulating substrate l.
After installing the IITl) on the base holding member 2 made of stainless steel 'i14 and adjusting the interval between the gas flow parts 4 to 2 mm, the first vacuum container 5 and the second vacuum container 10 are connected to the vacuum pump 1.
1, and evacuated the second vacuum container 10 to 10"'To
It should be about rr. Next, benzene gas 6 is introduced into the first vacuum container 5 from the gas inlet 8 at 0.1 Torr, and 170 W of high frequency power is applied from the 13.56 MHz high frequency type R3 to the substrate holding member 2. Plasma 6 was generated between the insulating substrate 1 and the ground electrode 7 in the vacuum container 5 . At this time, the pressure in the second vacuum vessel 1O was 7×10-' Torr, and no plasma was generated in this vacuum vessel. Further, the self-bias voltage at the substrate 1 was 560 . In this state 1
Synthesized for 0 minutes. The synthesized film has a Knoop hardness of 3000
to 3100A, and the film thickness is 5500A to 57A.
It is a diamond-like thin film with a uniform quality of 00A.

また、前記高周波電力を増加するとダイヤモンド状薄膜
の合成速度が増加し、生産上有利となるが本実施例では
、約600 W以上において第二の真空容器10の全体
にプラズマが発生し、さらに900V程度からアーク放
電が発生し始めた。
In addition, increasing the high frequency power increases the synthesis rate of the diamond-like thin film, which is advantageous in terms of production. Arc discharge started to occur.

さらに、第1図に示す実施例で、ガス流出部4の間隔が
10ffI111となる位置に基体1を設置すると、第
一の真空容器5の圧力が0 、 I Torrにおいて
、第二の真空容器10の圧力は9 X 10−3Tor
rとなった。この状態で高周波電力を100W印加する
と、第二の真空容器10全体でもプラズマが発生した。
Furthermore, in the embodiment shown in FIG. 1, if the base body 1 is installed at a position where the interval between the gas outlet portions 4 is 10ffI111, the pressure of the first vacuum vessel 5 is 0 and I Torr, and the second vacuum vessel 10 is The pressure is 9 x 10-3 Torr
It became r. When high frequency power of 100 W was applied in this state, plasma was generated throughout the second vacuum vessel 10.

また、合成された膜のヌープ硬さは合成部の周辺での1
800から、中央部の2900とムラがあり、一方、膜
厚も前記周辺部で2600Aから中央部で4100Aと
ムラが生じた。なお、前記間隔は第一の真空容器5の大
きさ、第二の真空容器lOの大きさ、および真空ポンプ
11の排気能力等によって変わるものであり、本発明は
これに限られるものではない。
In addition, the Knoop hardness of the synthesized film is 1
The film thickness varied from 800A to 2900A at the center, and the film thickness also varied from 2600A at the periphery to 4100A at the center. Note that the above-mentioned interval varies depending on the size of the first vacuum container 5, the size of the second vacuum container 1O, the exhaust capacity of the vacuum pump 11, etc., and the present invention is not limited thereto.

また、本発明では以上の実施例以外の合成条件でもダイ
ヤモンド状薄膜は合成可能である。例えば電源は交流電
源であれは絶縁性の基体上にダイヤモンド上薄膜は合成
可能であって、高周波電源の周波数は27MHzでもか
まわなく、また100kHz程度のオーディオ周波数を
もちいでもよい。原料ガスもエチレン、メタン、など各
種の炭化水素ガスをもちいることもできる。その他の合
成条件も、前記の内容に限るものではない。また、交流
電力の印加と同時に直流電圧を重畳してもかまわない。
Further, in the present invention, a diamond-like thin film can be synthesized under synthesis conditions other than those in the above embodiments. For example, if the power source is an AC power source, a thin film on diamond can be synthesized on an insulating substrate, and the frequency of the high frequency power source may be 27 MHz, or an audio frequency of about 100 kHz may be used. Various hydrocarbon gases such as ethylene and methane can also be used as the raw material gas. Other synthesis conditions are not limited to those described above. Further, a DC voltage may be superimposed at the same time as the AC power is applied.

基体が導電性の場合でも良質のダイヤモンド状薄膜が合
成可能であることは言うまでもない。
It goes without saying that high-quality diamond-like thin films can be synthesized even when the substrate is conductive.

さらに、本発明はダイヤモンド状薄膜以外の薄膜の合成
にも適応可能である。また、第1の真空容器5を第2真
空容器10の外部に出し、第2真空容器】0の臂に孔を
開け、その孔に、第1真空容器5のガス流出部4を連結
するように構成してもよい。
Furthermore, the present invention is applicable to the synthesis of thin films other than diamond-like thin films. Further, the first vacuum container 5 is taken out to the outside of the second vacuum container 10, a hole is made in the arm of the second vacuum container 10, and the gas outlet part 4 of the first vacuum container 5 is connected to the hole. It may be configured as follows.

第2図は第二の発明に基づく薄膜合成装置の一実施例で
ある。この実施例では複写機等に広く用いられているト
ラム状の有41!感九体の上にダイヤモンド状薄膜を合
成すること示す。第2図では有機感光体の側面図を示す
。有機感光体(第2図中では基体12で示す)は、アル
ミニウム等の導電部材12−2の上に有機物の絶縁層1
2−1が形成されている。この有機感光体を回転支持部
材(記載せず)に設置し、導電部材12−2を接地部材
22によって接地する。また、ガス流動部130間隔を
2 m rnに調整した後、第一の真空容器14と第二
の真空容器19とを真空ポンプ21にて真空排気し、第
二の真空容器19を10−5Torr程度とする。次に
、第一の真空容器14内にベンゼンガス18をガス流入
部17から0 、 l Torr導入するとともに、1
3.56MHzの高周波電源20から電極16に高周波
電力を170W印加すると、第一の真空容器14内にお
いて基に12と、電極16との間でプラズマ15が発生
した。このとき、第二の真空容器19の圧力は8 X 
10−’Torrであり、プラズマはこの真空容器で発
生しなかっk。
FIG. 2 shows an embodiment of a thin film synthesis apparatus based on the second invention. In this embodiment, a tram-shaped device 41!, which is widely used in copying machines and the like, is used. Demonstrates the synthesis of a diamond-like thin film on a sensual body. FIG. 2 shows a side view of the organic photoreceptor. The organic photoreceptor (indicated by a base 12 in FIG. 2) has an organic insulating layer 1 on a conductive member 12-2 such as aluminum.
2-1 is formed. This organic photoreceptor is installed on a rotating support member (not shown), and the conductive member 12-2 is grounded by a grounding member 22. Further, after adjusting the interval between the gas flow sections 130 to 2 mrn, the first vacuum container 14 and the second vacuum container 19 are evacuated by the vacuum pump 21, and the second vacuum container 19 is heated to 10-5 Torr. degree. Next, benzene gas 18 is introduced into the first vacuum container 14 from the gas inlet 17 at a pressure of 0.1 Torr, and at a pressure of 1 Torr.
When 170 W of high frequency power was applied to the electrode 16 from the 3.56 MHz high frequency power source 20, plasma 15 was generated between the base 12 and the electrode 16 in the first vacuum vessel 14. At this time, the pressure in the second vacuum container 19 is 8
10-' Torr, and no plasma is generated in this vacuum vessel.

また、基体12てのセルフバイアス電圧は560Vてあ
った。この状態で10分間合成した。合成した膜は、ヌ
ープ硬さが3000から3100であり、また、膜厚は
6500Aから5700Aと均一な良質のダイヤモンド
状薄膜であった。
Further, the self-bias voltage of the substrate 12 was 560V. Synthesis was carried out in this state for 10 minutes. The synthesized film had a Knoop hardness of 3,000 to 3,100, and a uniform film thickness of 6,500 to 5,700 A, which was a diamond-like thin film of good quality.

また、前記高周波電力を増加するとダイヤモント状薄膜
の合成速度が増加するが本実施例では、約1000Wに
おいてもプラズマは第二の真空容器19では発生しなか
った。
Furthermore, although increasing the high frequency power increases the synthesis rate of the diamond-like thin film, in this example, no plasma was generated in the second vacuum vessel 19 even at approximately 1000 W.

さらに、第2図に示す実施例で、ガス流出部13の間隔
を10mmとすると、第一の真空容器14の圧力が0、
11’orrにおいて、第二の真空容器19の圧力は0
.02Torrとなった。この状態で高周波電力を50
0り印加すると、プラズマ15がガス流出部13から第
二の真空容器19へ洩れたためか、第二の真空容器19
全体でもプラズマが発生した。また、合成された膜のヌ
ープ硬さは合成部の周辺での1800から、中央部の2
900とムラがあり、一方、膜厚も前記周辺部で260
0 Aから中央部で4100Aとムラが生じた。なお、
前記間隔は第一の真空容器14の大きさ、第二の真空容
器190大きさ、および真空ポンプ20の排気能力等に
よって変わるものであり、本発明はそれに限定されるも
のではない。
Furthermore, in the embodiment shown in FIG. 2, if the interval between the gas outlet parts 13 is 10 mm, the pressure in the first vacuum container 14 is 0,
At 11'orr, the pressure in the second vacuum vessel 19 is 0.
.. It became 02 Torr. In this state, the high frequency power is
When 0 is applied, the plasma 15 leaks from the gas outlet part 13 to the second vacuum container 19.
Plasma was generated throughout. In addition, the Knoop hardness of the synthesized film ranges from 1800 at the periphery of the composite area to 2 at the center.
900, and on the other hand, the film thickness was 260 in the peripheral area.
Unevenness occurred from 0 A to 4100 A in the center. In addition,
The distance varies depending on the size of the first vacuum vessel 14, the size of the second vacuum vessel 190, the evacuation capacity of the vacuum pump 20, etc., and the present invention is not limited thereto.

また、本発明では以上の実施例以外の合成条件でもダイ
ヤモンド状薄膜は合成可能である。例えは電源は交流電
源であれば絶縁性の基体りにダイヤモンド上薄膜は合成
可能゛Cあって、高周波電源の周波数は27MHzでも
かまわなく、また100kHz程度のオーディオ周波数
をもちいてもよい。原料ガスもエチレン、メタン、など
各種の炭化水素ガスをもちいることもてきる。その他の
合成条件も、前記の内容に限るものではない。また、交
流電力の印加と同時に直流電圧を重畳してもかまわない
。基体が導電性の場合でも良質のダイヤモンド状薄膜が
合成i1能であることは言うまでもない。
Further, in the present invention, a diamond-like thin film can be synthesized under synthesis conditions other than those in the above embodiments. For example, if the power source is an AC power source, a thin film on diamond can be synthesized on an insulating substrate, and the frequency of the high frequency power source may be 27 MHz, or an audio frequency of about 100 kHz may be used. Various hydrocarbon gases such as ethylene and methane can also be used as raw material gases. Other synthesis conditions are not limited to those described above. Further, a DC voltage may be superimposed at the same time as the AC power is applied. It goes without saying that a diamond-like thin film of good quality can be synthesized even if the substrate is conductive.

さらに、本発明はダイヤモンド状1i11!以外の薄膜
の合成にも適応可能である。
Furthermore, the present invention provides diamond-like 1i11! It can also be applied to the synthesis of other thin films.

発明の効果 以上の説明から明かなように、本発明の薄膜合成装置は
、絶縁性基体上に良質のダイヤモンド状薄膜を膜厚、膜
質とも均一に合成することが可能であり、ダイヤモンド
状薄膜の各種電子デバイス、光学部品等の表面保護膜等
への応用が拡大でき、産業上の効果が大きい。
Effects of the Invention As is clear from the above explanation, the thin film synthesis apparatus of the present invention is capable of synthesizing a high-quality diamond-like thin film on an insulating substrate with uniform thickness and quality, and is capable of producing a diamond-like thin film with uniform thickness and quality. It can be widely applied to surface protective films of various electronic devices, optical parts, etc., and has great industrial effects.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は第一の本発明の薄膜合成装置にかかる一実施例
を示す略本断面図、第2図は第二の本発明の薄膜合成装
置にがかる一実施例を示す略本断面図、第3図は従来の
薄膜合成装置を示す略本断面図である。 1.12・・・基体、3,20・・・高周波′F#LH
14゜13・・・ガス流出部、5,14・・・第一の真
空容器、6.15・・・プラズマ、7・・・接地電極、
16・・・電極、10.19・・・第二の真空容器。
FIG. 1 is a schematic sectional view showing an embodiment of the thin film synthesis apparatus of the first invention, FIG. 2 is a schematic sectional view showing an embodiment of the thin film synthesis apparatus of the second invention, FIG. 3 is a schematic sectional view showing a conventional thin film synthesis apparatus. 1.12...Base, 3,20...High frequency 'F#LH
14゜13... Gas outflow part, 5, 14... First vacuum container, 6.15... Plasma, 7... Ground electrode,
16... Electrode, 10.19... Second vacuum container.

Claims (2)

【特許請求の範囲】[Claims] (1)薄膜の構成元素を含む原料ガスの流入部と流出部
を備え、このガスをプラズマ化する第一の真空容器と、
その第一の真空容器に内設された接地電極と、前記第一
の真空容器のガスの流出部との間でガスが流動可能なよ
うにその第一の真空容器に接続された第二の真空容器と
、前記第一の真空容器のガスの流出部のガスの流出を妨
げないように、そのガス流出部に接近して配置された基
体と、その基体に交流電力を印加する交流電源とを備え
、薄膜の合成中において前記第一の真空容器の圧力が0
.01Torr以上でかつ第二の真空容器の圧力が5×
10^−^3Torr以下となる位置に前記基体が設置
されたことを特徴とする薄膜合成装置。
(1) a first vacuum container that includes an inlet and an outlet for a raw material gas containing constituent elements of the thin film and converts the gas into plasma;
A second vacuum container is connected to the first vacuum container so that gas can flow between a ground electrode installed in the first vacuum container and a gas outlet of the first vacuum container. a vacuum container; a base body disposed close to a gas outlet portion of the first vacuum container so as not to obstruct gas flow from the gas outlet portion; and an AC power source for applying alternating current power to the base body; and the pressure in the first vacuum container is 0 during synthesis of the thin film.
.. 01 Torr or more and the pressure of the second vacuum container is 5×
A thin film synthesis apparatus characterized in that the base body is installed at a position where the pressure is 10^-^3 Torr or less.
(2)薄膜の構成元素を含む原料ガスの流入部と流出部
を備え、このガスをプラズマ化する第一の真空容器と、
第一の真空容器に内設された電極と、前記第一の真空容
器のガスの流出部との間でガスが流動可能なようにその
第一の真空容器に接続された第二の真空容器と、前記第
一の真空容器のガスの流出部のガスの流出を妨げないよ
うに、そのガス流出部に接近して配置された基体と、前
記電極に交流電力を印加する交流電源と、前記基体の接
地部材とを備え、薄膜の合成中において前記第一の真空
容器の圧力が0.01Torr以上でかつ前記第二の真
空容器の圧力が5×10^−^3Torr以下となる位
置に前記基体が設置されたことを特徴とする薄膜合成装
置。
(2) a first vacuum container that includes an inlet and an outlet for a raw material gas containing constituent elements of the thin film and converts this gas into plasma;
a second vacuum container connected to the first vacuum container so that gas can flow between an electrode installed in the first vacuum container and a gas outlet of the first vacuum container; a base body disposed close to the gas outlet part of the first vacuum container so as not to obstruct the outflow of the gas from the gas outlet part; an AC power source that applies alternating current power to the electrode; and a grounding member for the base body, and the pressure in the first vacuum container is 0.01 Torr or more and the pressure in the second vacuum container is 5×10^-^3 Torr or less during synthesis of the thin film. A thin film synthesis device characterized in that a base is installed.
JP7521290A 1990-03-22 1990-03-22 Device for synthesizing thin film Pending JPH03274276A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7521290A JPH03274276A (en) 1990-03-22 1990-03-22 Device for synthesizing thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7521290A JPH03274276A (en) 1990-03-22 1990-03-22 Device for synthesizing thin film

Publications (1)

Publication Number Publication Date
JPH03274276A true JPH03274276A (en) 1991-12-05

Family

ID=13569674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7521290A Pending JPH03274276A (en) 1990-03-22 1990-03-22 Device for synthesizing thin film

Country Status (1)

Country Link
JP (1) JPH03274276A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010013676A (en) * 2008-07-01 2010-01-21 Utec:Kk Plasma cvd apparatus, dlc film, and method for producing thin film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010013676A (en) * 2008-07-01 2010-01-21 Utec:Kk Plasma cvd apparatus, dlc film, and method for producing thin film

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