JPH0327067U - - Google Patents
Info
- Publication number
- JPH0327067U JPH0327067U JP8757289U JP8757289U JPH0327067U JP H0327067 U JPH0327067 U JP H0327067U JP 8757289 U JP8757289 U JP 8757289U JP 8757289 U JP8757289 U JP 8757289U JP H0327067 U JPH0327067 U JP H0327067U
- Authority
- JP
- Japan
- Prior art keywords
- component
- width
- wiring board
- printed wiring
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8757289U JPH0327067U (me) | 1989-07-26 | 1989-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8757289U JPH0327067U (me) | 1989-07-26 | 1989-07-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0327067U true JPH0327067U (me) | 1991-03-19 |
Family
ID=31637214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8757289U Pending JPH0327067U (me) | 1989-07-26 | 1989-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0327067U (me) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013033570A (ja) * | 2011-08-02 | 2013-02-14 | Dainippon Printing Co Ltd | サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法 |
-
1989
- 1989-07-26 JP JP8757289U patent/JPH0327067U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013033570A (ja) * | 2011-08-02 | 2013-02-14 | Dainippon Printing Co Ltd | サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法 |